(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Single
Top
Copper Pattern
Footprints and Traces
Layer Number of
Measurement Board
4 Layers
Top
Copper Pattern
Footprints and Traces
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.57 mmt
Thickness
70 μm
Material
FR-4
Board Size
114.3 mm x 76.2 mm x 1.6 mmt
2 Internal Layers
Thickness
70 μm
Copper Pattern
74.2 mm x 74.2 mm
Thickness
35 μm
Thermal Via
(Note 5)
Pitch
Diameter
1.20 mm
Φ0.30 mm
Bottom
Copper Pattern
74.2 mm x 74.2 mm
Thickness
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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