Technical Data
November 2013
3M
™
Anisotropic Conductive Film 5363
Product Description
3M™ Anisotropic Conductive Film (ACF) 5363 is a
heat-bondable, electrically conductive adhesive film.
The unbonded film is non-tacky at room temperature
and consists of a thermoset-thermoplastic adhesive
matrix randomly loaded with conductive particles. These
particles allow inter-connection of circuit lines through
the adhesive thickness, but are spaced far enough
apart for the product to be electrically insulating in the
plane of the adhesive. Application of heat and pressure
causes the adhesive to flow and to bring the circuit pads
into contact by trapping the conductive particles. The
adhesive rapidly cures at modest bonding temperature.
The 3M ACF 5363 may be used to bond a flexible printed
circuit to another flexible printed circuit or to a printed
circuit board.
Typical Physical Properties and
Performance Characteristics
Note:
The following technical information and data should
be considered representative or typical only and
should not be used for specification purposes.
Design Requirements
Property
Minimum Space Between
Conductors
Minimum Pitch
Minimum Pad Area
Value
100
(4)
200
(8)
0.15
(240)
Units
micron
(mil)
micron
(mil)
sq. mm
(sq. mil)
Ambient Physical Properties
Property
(1)
Interconnect
Resistance
Peel Strength
(4)
Test Substrates
Flex-to-
PC board
(2)
Flex-to-
PC board
(2)
Value
Test Method
< 20 mOhms 3M TM-2314
(3)
> 700 gf/cm 3M TM-2313
(5)
Construction
General Properties
Property
Adhesive Type
Particle Type
Particle Size
Liner Type
Adhesive Thickness
Liner Thickness
Value
(1)
Thermosetting Type
Gold-Coated Nickel
10 micron
Polyester Film with Silicone Release
40 micron
50 micron
(4)
(5)
(2)
(3)
For a given application, values may differ depending on particular substrate
material or type of circuitry.
Measured for gold/nickel/copper polyimide flex circuits bonded to printed
circuit board. Contact overlap area was 0.15 sq. mm. Pad pitch was 200
microns.
3M internal test method TM-2314 based on test method IPC 650 – Section
2.6.24. The flex has the shorting strap located near the bond-line to
approximate a 4-wire test structure and eliminate most extraneous
resistance in the measurement due to the circuit lines.
Results listed for minimum bonding conditions of 160°C x 5 sec. Higher
values are possible with increase in bonding temperature or time.
3M internal test method TM-2313 based on test method IPC 650 –
Section 2.4.9.1.
3M
™
Anisotropic Conductive Film 5363
Typical Physical Properties and
Performance Characteristics
(continued)
Note:
The following technical information and data should
be considered representative or typical only and
should not be used for specification purposes.
Reliability Performance – Electrical Contact
(6,7)
Test Conditions
Interconnect Resistance
(mOhms)
3M TM-2314
(8)
< 100
< 100
< 100
< 100
< 100
< 100
Tacking and Bonding Conditions
Procedure
Tacking Conditions
Temperature
(10)
Pressure
Time
Bonding Conditions
Temperature
(10)
Pressure
Time
(11)
Conditions
90 - 110°C
1 - 15 kg/cm
2
~1 sec
195 - 210°C
30 - 50 kg/cm
2
10 - 20 sec
85°C x 1000 hrs
125°C x 1000 hrs
-40°C x 1000 hrs
85°C / 85% RH x 1000 hrs
-40° to 85°C x 500 cycles
-40° to 100°C x 1000 cycles
Assembly Process
(continued)
Bonding of 3M ACF 5363 requires a three-part procedure:
Tacking the film to one substrate (pre-tacking)
Removing the release liner
Bonding the first substrate to the second substrate.
A pre-tacking temperature of 90°C under a pressure of
about 10 kg/cm
2
should be used.
For automated ACF
application:
Set the ACF pretacking equipment to deliver
the conditions provided in the Tacking and Bonding
Conditions Table above. Slight adjustment to these
conditions may be necessary for each application or for
different types of circuitry.
For manual ACF application:
Cut the adhesive to the size of the flex circuit. Place the
adhesive on the flex and set flex on hot plate at setpoint
up to 90°C. Use roller to press adhesive onto the flex.
After allowing flex and adhesive to cool, remove liner.
Reliability Performance – Peel Strength
(6,7)
Test Conditions
100°C x 1000 hrs
-40°C to 100°C x 1000 cycles
85°C / 85% r. h. x 1000 hrs
Peel Strength
(gf/cm)
3M TM-2313
(9)
> 700
> 700
> 700
Assembly Process Techniques
Assembly Process
A source of heat and pressure, such as a thermo-compression
(hot bar) bonder is required for use of 3M™ Anisotropic
Conductive Film 5363. Several commercially available
models exist: a list of vendors can be obtained by calling the
toll free number on the back of this Technical Data Sheet.
(6)
For a given application, values may differ depending on particular flex circuit
and PC board materials used.
Measured for gold/nickel/copper polyimide flex circuits bonded to gold/
nickel/copper/FR-4 PC board. Contact overlap area was 0.2 sq. mm.
Pad pitch was 200 microns.
3M internal test method TM-2314 based on test method IPC 650 - Section
2.6.24. The flex has the shorting strap located near the bond-line to
approximate a 4-wire test structure and eliminate most extraneous
resistance in the measurement due to the circuit lines.
3M internal test method TM-2313 based on test method IPC 650 - Section
2.4.9.1.
(10)
(7)
Temperature measured in the adhesive. Thermode set points will be higher
and will depend upon the substrate materials and bond equipment.
A typical bonding set-up for a flex interconnect bond is a thermode
temperature of 300°C and a bonding time of 10 seconds (see next note).
The required minimum bonding temperature of 195°C is usually reached
within the first 5 seconds of bonding. The adhesive should be bonded so
that the temperature is held above the minimum of 195°C for at least
an additional 5 seconds. Also, it may be desirable to hold pressure while
cooling to below 100°C for maximum performance.
(11)
(8)
(9)
(2)
3M
™
Anisotropic Conductive Film 5363
Assembly Process Techniques
(continued)
Final bonding must be done under heat and pressure,
with a typical desirable bond line temperature at or
above 200°C, held for 10 seconds, and a pressure of 30
kg/cm
2
. During bonding, electrical contact is typically
achieved within the first seconds after the bond line
reaches about 195°C. Additional time at temperature is
necessary to fully cure the epoxy material to generate
peel strength and the ultimate reliability. Bond times
may vary depending upon the substrates to be bonded.
For maximum mechanical and electrical performance,
the pressure should be maintained while cooling to
below 100°C. This increases the total bond time. The
time required to drop adhesive bond-line temperature
below 100°C is highly dependent upon the bonding
equipment used.
Storage
3M™ Anisotropic Conductive Film 5363 should be kept
frozen in the original airtight shipping bag. 3M ACF 5363
has a shelf life of 15 months from date of manufacture
when stored at temperature ≤ 2°C. The product should be
allowed to warm to room temperature for approximately
30 minutes prior to use to prevent moisture condensation
on the film. Whenever possible, 3M ACF 5363 should be
kept away from high humidity environments as absorbed
water can lead to moisture volatilization producing
bubbles during heat bonding or gradual degradation
of the product. The 3M ACF 5363 can be held at
room temperature for product utilization provided the
cumulative room temperature shelf life is not exceeded.
The room temperature shelf life is 4 weeks.
Temperature (°C)
200
150
Thermode
Released
100
210°C x 20 sec
195°C x 20 sec
50
0
0
5
10
15
20
Time (sec)
Figure 1. Graph of ACF temperature vs. time profile
showing typical examples of bonding cycle.
Predicted 3M™ ACF 5363 Cure Reaction
180.0°C
190.0°C
200.0°C
210.0°C
220.0°C
100%
90%
80%
Conversion (%)
70%
60%
50%
40%
30%
20%
10%
0%
0
10
20
30
Time (sec)
40
50
60
Figure 2. Graph of predicted cross-link reaction
compared with bonding temperature and time.
Shelf Life Data
Storage Environment
Freezer (< 2°C)
Room Temperature
Value
15 months
4 weeks
(3)
3M
™
Anisotropic Conductive Film 5363
Product Selection Guide
Flex Type
Connection Type
Pitch and Space Requirements
Minimum
Space
Between
Conductors
100 micron
250 micron
100 micron
100 micron
70 micron
100 micron
50 micron
Silver Ink
on Polyester
ACF 5363
ACF 7303
ACF 7371
ACF 7371-20
ACF 7376-10
ACF 7376-30
ACF 7379
1
2
Gold/Copper
on Polyester
Gold/Copper
on Polyimide
X
Flex to
Glass
Flex to
Plastic
Device
Flex to
PCB
X
Flex to
Flex
X
X
X
X
Minimum
Pad
Area
0.15 sq. mm
0.75 sq. mm
0.10 sq. mm
0.50 sq. mm
0.10 sq. mm
0.50 sq. mm
0.05 sq. mm
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
X
X
X
X
X
X
2
X
X
X
X
X
X
X
X
X
Tested only for silver frit; not suitable for ITO traces.
Suitable for silver ink traces only; not suitable for ITO traces.
(4)
3M
™
Anisotropic Conductive Film 5363
Technical Information
The technical information, recommendations and other
statements contained in this document are based upon
tests or experience that 3M believes are reliable, but the
accuracy or completeness of such information is not
guaranteed.
Warranty, Limited Remedy, and Disclaimer
Unless an additional warranty is specifically stated on the
applicable 3M product packaging or product literature,
3M warrants that each 3M product meets the applicable
3M product specification at the time 3M ships the
product. 3M MAKES NO OTHER WARRANTIES OR
CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT
NOT LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION
OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR
PURPOSE OR ANY IMPLIED WARRANTY OR CONDITION
ARISING OUT OF A COURSE OF DEALING, CUSTOM OR
USAGE OF TRADE. If the 3M product does not conform to
this warranty, then the sole and exclusive remedy is, at
3M’s option, replacement of the 3M product or refund of
the purchase price.
Product Use
Many factors beyond 3M’s control and uniquely within
user’s knowledge and control can affect the use and
performance of a 3M product in a particular application.
Given the variety of factors that can affect the use and
performance of a 3M product, user is solely responsible
for evaluating the 3M product and determining whether
it is fit for a particular purpose and suitable for user’s
method of application.
Limitation of Liability
Except where prohibited by law, 3M will not be liable for
any loss or damage arising from the 3M product, whether
direct, indirect, special, incidental or consequential,
regardless of the legal theory asserted, including
warranty, contract, negligence or strict liability.
Electronics Markets Materials Division
3M Center, Building 225-3S-06
St. Paul, MN 55144-1000
1-800-251-8634 phone
651-778-4244 fax
www.3M.com/electronics
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(5)
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