1. Exceeding the absolute maximum rating may damage the device.
2. The device is not guaranteed to function outside its operating rating.
3. The maximum allowable power dissipation of any T
A
(ambient temperature) is P
D
(max) = (T
J
(max)–T
A
)/θ
JA
. Exceeding the maximum allowable
power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. The
θ
JA
of the MIC5252-x.xBM5 (all ver-
sions) is 235°C/W on a PC board. See
”Thermal Considerations”
section for further details.
4. Devices are ESD sensitive. Handling precautions recommended.
5. Specification for packaged product only.
6. Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range
from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification.
7. Dropout Voltage is defined as the input-to-output differential at which the output voltage drops 2% below its nominal value measured at 1V differen-
tial. For outputs below 2.7V, dropout voltage is the input-to-output voltage differential with the minimum input voltage 2.7V. Minimum input operating
voltage is 2.7V.
8. Ground pin current is the regulator quiescent current. The total current drawn from the supply is the sum of the load current plus the ground pin cur-
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Embedded System
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