F-219
ZA8–40–2–1.00–Z–10
ZA8–10–2–1.00–Z–10
®
ZA8–30–2–1.00–Z–10
ZA8–20–1–1.00–Z–10–2
(0.80 mm) .0315"
ZA8 SERIES
ULTRA-LOW PROFILE MICRO ARRAYS
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ZA8
Insulator Material:
FR4
Contact Material:
BeCu
Plating:
Au over 50 µ" (1.27 µm) Ni
Current Rating:
.8 A per pin
(10 pins powered)
Operating Temp Range:
-55 °C to +105 °C
RoHS Compliant:
Yes
Note:
Solder ball parts will come
with a pick & place pad.
APPLICATION
25 g normal force
with (0.20 mm) .008"
contact deflection
Up to
1,200
contacts/
square inch
Dual compression
or single compression
with solder balls
BeCu
contacts
HIGH-SPEED CHANNEL PERFORMANCE
1 mm Stack Height
Rating based on Samtec reference channel.
For full SI performance data visit Samtec.com
or contact SIG@samtec.com
APPLICATION
14
G b p s
Solder ball
option
(1.00 mm) .040"
height
ZA8
Dual compression or single
compression with solder balls
POSITIONS
PER ROW
TERMINATION
HEIGHT
PLATING
ROWS
SOLDER
TYPE
–10, –20,
–30, –40
= Single Compression
with Solder Balls
(–10 & –20 positions only)
–1
–2
= (1.00 mm)
.040"
Height
–1.00
= 6 µ"
(0.15 µm)
Gold in
contact
area
–Z
–10
= Ten
Rows
(Termination
–1 only)
= Lead
–1
–2
DESIGN FLEXIBILITY
The Z-Ray
®
platform is
highly-customizable:
PITCH
STACK HEIGHT
DENSITY
RUGGEDIZING
CONSTRUCTION
≥
0.65 mm
0.50 mm to
4.00 mm
Up to 1,200
contacts/square inch
Latches, Thermal
Spreaders,
Quick-release
Spring Constraints
Multi-layer FR4
(e.g., Pitch Spreaders)
(1.07)
.042
DIA
= Dual Compression
(–10, –20, –30
& –40 positions only)
A
(1.25)
.049
DIA
(9.00)
.354
(0.80) .0315
(2.00) .079 DIA
(0.20) .008 TYP
A
= Lead-Free
(1.00)
.039
(4.00) .157
40 X 10 DUAL COMPRESSION
BOTH SIDES
20 x 10 DUAL COMPRESSION
B
(9.00)
.354
(0.80) .0315
B
(1.06)
.042
POSITIONS
PER ROW
–10
–20
–30
A
(12.50)
.492
(20.50)
.807
(31.70)
1.248
(39.70)
1.563
B
(9.35)
.368
(17.35)
.683
N/A
N/A
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
20 X 10 COMPRESSION
WITH SOLDER BALLS
10 x 10 COMPRESSION
WITH SOLDER BALLS
–40
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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