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H6MMS-3018G

Description
DIP CBL - HHDM30S/AE30G/HHDM30S
CategoryWire/cable   
File Size159KB,1 Pages
ManufacturerASSMANN WSW components
Environmental Compliance
Download Datasheet Parametric View All

H6MMS-3018G Overview

DIP CBL - HHDM30S/AE30G/HHDM30S

H6MMS-3018G Parametric

Parameter NameAttribute value
Connector typeDIP to DIP
Number of pins30
Number of rows2
Pitch - Connector0.100"(2.54mm)
Spacing - Cable0.050"(1.27mm)
length1.50'(457.20mm)
characteristic-
colorgray, banded
shieldNo shielding
useJack (0.1"), onboard
Cable terminationIDC
Contact platingtin
Contact plating thickness-
1
4
A
2
3
5
6
7
A
NOTES:
B
C
8
MATERIAL
1.Insulator Material:PBT+30%GF(UL94V-0),Grey
2.Contact Material : Brass
3.Contact Plating : Sn Over 50μ" Ni
ELECTRICAL
1.Current Rating : 3.0AMP
2.Withstand Voltage : 1000V AC/DC
4.Contact Resistance : 20mΩ max
5.Insulation Resistance: 1000MΩ min
ENVIRONMENTAL
1.Operation Temperature: -40°C to +105°C
2.Waving Soldering Temperature: 245°C, 5s Max.
3.Packing : Tray
B
C
5
Order Information:
contacts xx : 06,08,10,12,14,16,18,20,22,24,26
28,30,32,34,36,38,40,50,60,64
D
7
D
E
E
F
Scale
Free
TOLERANCE
X.X
X.XX
6
8
7
Add waving soldering temperature
Add recommended PCB layout
08.08.2017
16.07.2015
Ray
Ray
Drawn
Date
31.07.2006
F
G
RoHS compliant
Unit: mm
Name
Customer-No.
Hellwig
±0.40
±0.25
Angle
6
Add UL file no.
12.12.2013
Amy
Approved
08.08.2017
G
X.XXX ±0.15
5
Add multiple pin
17.09.2013
Winnie
Winnie
ASSMANN WSW-No.
AWLP xx/3.2-T
±
4
3
Id.
Add 18pin product
Update
Modification
06.09.2013
16.03.2009
Date
Ray
Dean
Name
Drawing-No.
H
1
2
ASS 1197 CO
rev08
H
3
4
5
Replace dd 15.11.01
Sheet
6
7

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Index Files: 2671  204  1162  2673  1401  54  5  24  29  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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