LCMXO3L-4300E-5MG324C datasheet, PDF

Datasheet> All Categories > Programmable logic devices> Programmable logic> LCMXO3L-4300E-5MG324C

LCMXO3L-4300E-5MG324C: DescriptionIC FPGA 268 I/O 324CSFBGA; CategoryProgrammable logic devices Programmable logic; File Size2MB，93 Pages; ManufacturerLattice; Websitehttp://www.latticesemi.com; Environmental Compliance

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LCMXO3L-4300E-5MG324C Overview

IC FPGA 268 I/O 324CSFBGA

LCMXO3L-4300E-5MG324C Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Lattice
package instruction	VFBGA,
Reach Compliance Code	unknown
ECCN code	EAR99
JESD-30 code	S-PBGA-B324
length	10 mm
Configurable number of logic blocks	540
Number of terminals	324
Maximum operating temperature	85 °C
Minimum operating temperature
organize	540 CLBS
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	SQUARE
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Programmable logic type	FIELD PROGRAMMABLE GATE ARRAY
Maximum seat height	1 mm
Maximum supply voltage	1.26 V
Minimum supply voltage	1.14 V
Nominal supply voltage	1.2 V
surface mount	YES
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	10 mm
Base Number Matches	1

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MachXO3 Family

Data Sheet

FPGA-DS-02032-2.3

November 2018

MachXO3 Family

Data Sheet

Contents

Acronyms in This Document .................................................................................................................................................6

1. Introduction ..................................................................................................................................................................7

1.1.

Features...............................................................................................................................................................8

1.1.1. Solutions .........................................................................................................................................................8

1.1.2. Flexible Architecture .......................................................................................................................................8

1.1.3. Advanced Packaging .......................................................................................................................................8

1.1.4. Pre-Engineered Source Synchronous I/O ........................................................................................................8

1.1.5. High Performance, Flexible I/O Buffer ............................................................................................................8

1.1.6. Flexible On-Chip Clocking................................................................................................................................8

1.1.7. Non-volatile, Multi-time Programmable.........................................................................................................8

1.1.8. TransFR Reconfiguration .................................................................................................................................8

1.1.9. Enhanced System Level Support .....................................................................................................................8

1.1.10.

Applications ................................................................................................................................................8

1.1.11.

Low Cost Migration Path ............................................................................................................................8

2. Architecture ................................................................................................................................................................10

2.1.

Architecture Overview ......................................................................................................................................10

2.2.

PFU Blocks .........................................................................................................................................................12

2.2.1. Slices .............................................................................................................................................................12

2.2.2. Modes of Operation ......................................................................................................................................14

2.2.3. RAM Mode ....................................................................................................................................................14

2.2.4. ROM Mode ....................................................................................................................................................14

2.3.

Routing ..............................................................................................................................................................15

2.4.

Clock/Control Distribution Network...................................................................................................................15

2.4.1. sysCLOCK Phase Locked Loops (PLLs) ...........................................................................................................17

2.5.

sysMEM Embedded Block RAM Memory ..........................................................................................................20

2.5.1. sysMEM Memory Block ................................................................................................................................20

2.5.2. Bus Size Matching .........................................................................................................................................20

2.5.3. RAM Initialization and ROM Operation ........................................................................................................20

2.5.4. Memory Cascading .......................................................................................................................................20

2.5.5. Single, Dual, Pseudo-Dual Port and FIFO Modes ..........................................................................................21

2.5.6. FIFO Configuration ........................................................................................................................................22

2.5.7. Memory Core Reset ......................................................................................................................................22

2.5.8. EBR Asynchronous Reset ..............................................................................................................................23

2.6.

Programmable I/O Cells (PIC) ............................................................................................................................24

2.7.

PIO .....................................................................................................................................................................26

2.7.1. Input Register Block ......................................................................................................................................26

2.7.2. Output Register Block ...................................................................................................................................26

2.7.3. Tri-state Register Block .................................................................................................................................27

2.8.

Input Gearbox ...................................................................................................................................................27

2.9.

Output Gearbox.................................................................................................................................................29

2.10. sysI/O Buffer ......................................................................................................................................................31

2.10.1.

Typical I/O Behavior during Power-up .....................................................................................................31

2.10.2.

Supported Standards ................................................................................................................................31

2.10.3.

sysI/O Buffer Banks...................................................................................................................................33

2.11. Hot Socketing ....................................................................................................................................................34

2.12. On-chip Oscillator ..............................................................................................................................................34

2.13. Embedded Hardened IP Functions ....................................................................................................................35

2.13.1.

Hardened I

C IP Core ................................................................................................................................35

2.13.2.

Hardened SPI IP Core ................................................................................................................................36

2.13.3.

Hardened Timer/Counter .........................................................................................................................38

2.14. User Flash Memory (UFM) ................................................................................................................................39

2.15. Standby Mode and Power Saving Options ........................................................................................................39

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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.3

MachXO3 Family

Data Sheet

2.16. Power On Reset ................................................................................................................................................. 40

2.17. Configuration and Testing ................................................................................................................................. 41

2.17.1.

IEEE 1149.1-Compliant Boundary Scan Testability ................................................................................... 41

2.17.2.

Device Configuration ................................................................................................................................ 41

2.18. TraceID .............................................................................................................................................................. 43

2.19. Density Shifting ................................................................................................................................................. 43

3. DC and Switching Characteristics ............................................................................................................................... 44

3.1.

Absolute Maximum Rating ................................................................................................................................ 44

3.2.

Recommended Operating Conditions ............................................................................................................... 44

3.3.

Power Supply Ramp Rates ................................................................................................................................ 44

3.4.

Power-On-Reset Voltage Levels ........................................................................................................................ 45

3.5.

Hot Socketing Specifications ............................................................................................................................. 45

3.6.

Programming/Erase Specifications ................................................................................................................... 45

3.7.

ESD Performance .............................................................................................................................................. 45

3.8.

DC Electrical Characteristics .............................................................................................................................. 46

3.9.

Static Supply Current – C/E Devices .................................................................................................................. 47

3.10. Programming and Erase Supply Current – C/E Devices ..................................................................................... 48

3.11. sysI/O Recommended Operating Conditions ..................................................................................................... 49

3.12. sysI/O Single-Ended DC Electrical Characteristics .............................................................................................. 50

3.13. sysI/O Differential Electrical Characteristics ..................................................................................................... 51

3.13.1.

LVDS.......................................................................................................................................................... 51

3.13.2.

LVDS Emulation ........................................................................................................................................ 51

3.13.3.

BLVDS ....................................................................................................................................................... 52

3.13.4.

LVPECL....................................................................................................................................................... 53

3.13.5.

MIPI D-PHY Emulation .............................................................................................................................. 54

3.14. Typical Building Block Function Performance – C/E Devices ............................................................................ 57

3.14.1.

Pin-to-Pin Performance (LVCMOS25 12 mA Drive) .................................................................................. 57

3.14.2.

Register-to-Register Performance ............................................................................................................ 57

3.15. Derating Logic Timing ........................................................................................................................................ 57

3.16. Maximum sysI/O Buffer Performance .............................................................................................................. 58

3.17. MachXO3L/LF External Switching Characteristics – C/E Devices ...................................................................... 59

3.18. sysCLOCK PLL Timing ......................................................................................................................................... 65

3.19. NVCM/Flash Download Time ............................................................................................................................ 66

3.20. JTAG Port Timing Specifications ........................................................................................................................ 66

3.21. sysCONFIG Port Timing Specifications .............................................................................................................. 68

3.22. I

C Port Timing Specifications ........................................................................................................................... 69

3.23. SPI Port Timing Specifications ........................................................................................................................... 69

3.24. Switching Test Conditions ................................................................................................................................. 69

4. Signal Descriptions...................................................................................................................................................... 70

4.1.

Pin Information Summary ................................................................................................................................. 72

5. MachXO3 Part Number Description ........................................................................................................................... 77

6. Ordering Information ................................................................................................................................................. 78

6.1.

MachXO3L Ultra Low Power Commercial and Industrial Grade Devices, Halogen Free (RoHS) Packaging ...... 78

6.2.

MachXO3LF Ultra Low Power Commercial and Industrial Grade Devices, Halogen Free (RoHS) Packaging .... 81

References .......................................................................................................................................................................... 85

Revision History .................................................................................................................................................................. 86

www.latticesemi.com/legal.

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.3

MachXO3 Family

Data Sheet

Figures

Figure 2.1. Top View of the MachXO3L/LF-1300 Device ....................................................................................................10

Figure 2.2. Top View of the MachXO3L/LF-4300 Device ....................................................................................................11

Figure 2.3. PFU Block Diagram ............................................................................................................................................12

Figure 2.4. Slice Diagram ....................................................................................................................................................13

Figure 2.5. Primary Clocks for MachXO3L/F Devices ..........................................................................................................16

Figure 2.6. Secondary High Fanout Nets for MachXO3L/F Devices ....................................................................................17

Figure 2.7. PLL Diagram ......................................................................................................................................................18

Figure 2.8. sysMEM Memory Primitives .............................................................................................................................21

Figure 2.9. Memory Core Reset ..........................................................................................................................................23

Figure 2.10. EBR Asynchronous Reset (Including GSR) Timing Diagram .............................................................................23

Figure 2.11. Group of Four Programmable I/O Cells ..........................................................................................................25

Figure 2.12. Sentry Output Register Block Diagram (PIO on the Left, Top and Bottom Edges)..........................................27

Figure 2.13. Input Gearbox .................................................................................................................................................28

Figure 2.14. Output Gearbox ..............................................................................................................................................30

Figure 2.15. MachXO3L/LF-1300 in 256 Ball Packages, MachXO3L/LF-2100, MachXO3L/LF-4300, MachXO3L/LF-6900 and

MachXO3L/LF-9400 Banks I/O Banks..................................................................................................................................33

Figure 2.16. MachXO3L/LF-640 and MachXO3L/LF-1300 Banks.........................................................................................34

Figure 2.17. Embedded Function Block Interface ...............................................................................................................35

Figure 2.18. I

C Core Block Diagram ...................................................................................................................................36

Figure 2.19. SPI Core Block Diagram ...................................................................................................................................37

Figure 2.20. Timer/Counter Block Diagram ........................................................................................................................38

Figure 3.1. LVDS Using External Resistors (LVDS25E) .........................................................................................................51

Figure 3.2. BLVDS Multi-point-Output Example .................................................................................................................52

Figure 3.3. Differential LVPECL ...........................................................................................................................................53

Figure 3.4. MIPI D-PHY Input Using External Resistors .......................................................................................................54

Figure 3.5. MIPI D-PHY Output Using External Resistors ....................................................................................................55

Figure 3.6.Receiver GDDR71_RX. Waveforms ....................................................................................................................64

Figure 3.7. Transmitter GDDR71_TX. Waveforms ..............................................................................................................64

Figure 3.8. JTAG Port Timing Waveforms ...........................................................................................................................67

Figure 3.9. Output Test Load, LVTTL and LVCMOS Standards ............................................................................................69

Tables

Table 1.1. MachXO3L/LF Family Selection Guide .................................................................................................................9

Table 2.1. Resources and Modes Available per Slice ..........................................................................................................12

Table 2.2. Slice Signal Descriptions .....................................................................................................................................13

Table 2.3. Number of Slices Required For Implementing Distributed RAM .......................................................................14

Table 2.4. PLL Signal Descriptions .......................................................................................................................................19

Table 2.5. sysMEM Block Configurations ............................................................................................................................20

Table 2.6. EBR Signal Descriptions ......................................................................................................................................21

Table 2.7. Programmable FIFO Flag Ranges........................................................................................................................22

Table 2.8. PIO Signal List .....................................................................................................................................................26

Table 2.9. Input Gearbox Signal List....................................................................................................................................27

Table 2.10. Output Gearbox Signal List...............................................................................................................................29

Table 2.11. Supported Input Standards...............................................................................................................................32

Table 2.12. Supported Output Standards............................................................................................................................32

Table 2.13. Available MCLK Frequencies ............................................................................................................................34

Table 2.14. I

C Core Signal Description ...............................................................................................................................36

Table 2.15. SPI Core Signal Description ..............................................................................................................................37

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All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.3

MachXO3 Family

Data Sheet

Table 2.16. Timer/Counter Signal Description.................................................................................................................... 39

Table 2.17. MachXO3L/LF Power Saving Features Description .......................................................................................... 40

Table 3.1. Absolute Maximum Rating

1, 2, 3

.......................................................................................................................... 44

Table 3.2. Recommended Operating Conditions

.............................................................................................................. 44

Table 3.3. Power Supply Ramp Rates ................................................................................................................................. 44

Table 3.4. Power-On Reset Voltage Levels ......................................................................................................................... 45

Table 3.5. Hot Socketing Specifications .............................................................................................................................. 45

Table 3.6. Programming/Erase Specifications .................................................................................................................... 45

Table 3.7. DC Electrical Characteristics ............................................................................................................................... 46

Table 3.8. Static Supply Current – C/E Devices

1, 2, 3, 6

.......................................................................................................... 47

Table 3.9. Programming and Erase Supply Current – C/E Devices

1, 2, 3, 4

............................................................................ 48

Table 3.10. sysI/O Recommended Operating Conditions ................................................................................................... 49

Table 3.11. sysI/O Single-Ended DC Electrical Charateristics

1, 2

.......................................................................................... 50

Table 3.12. LVDS ................................................................................................................................................................. 51

Table 3.13. LVDS25E DC Conditions.................................................................................................................................... 52

Table 3.14. BLVDS DC Condition ......................................................................................................................................... 53

Table 3.15. LVPECL DC Conditions ...................................................................................................................................... 54

Table 3.16. MIPI DC Conditions .......................................................................................................................................... 55

Table 3.17. MIPI D-PHY Output DC Conditions ................................................................................................................... 56

Table 3.18. Pin-to-Pin Performance (LVCMOS25 12 mA Drive) .......................................................................................... 57

Table 3.19. Register-to-Register Performance ................................................................................................................... 57

Table 3.20. Maximum sysI/O Buffer Performance ............................................................................................................. 58

Table 3.21. MachXO3L/LF External Switching Characteristics – C/E Devices

1, 2, 3, 4, 5, 6, 10

................................................... 59

Table 3.22. sysCLOCK PLL Timing ........................................................................................................................................ 65

Table 3.23. NVCM/Flash Download Time ........................................................................................................................... 66

Table 3.24. JTAG Port Timing Specifications ....................................................................................................................... 66

Table 3.25. sysCONFIG Port Timing Specifications ............................................................................................................. 68

Table 3.26. I

C Port Timing Specification ............................................................................................................................ 69

Table 3.27. SPI Port Timing Specifications .......................................................................................................................... 69

Table 3.28. Test Fixture Required Components, Non-Terminated Interfaces .................................................................... 69

Table 4.1. Signal Descriptions ............................................................................................................................................. 70

Table 4.2. MachXO3L/LF-640 and MachXO3L/LF-1300 ...................................................................................................... 72

Table 4.3. MachXO3L/LF-2100............................................................................................................................................ 73

Table 4.4. MachXO3L/LF-4300............................................................................................................................................ 74

Table 4.5. MachXO3L/LF-6900............................................................................................................................................ 75

Table 4.6. MachXO3L/LF-9400C.......................................................................................................................................... 76

www.latticesemi.com/legal.

All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.

FPGA-DS-02032-2.3

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