BC807-16/-25/-40
Taiwan Semiconductor
0.3W, PNP Plastic-Encapsulate Transistor
FEATURES
●
●
●
●
Low power loss, high efficiency
Ideal for automated placement
High surge current capability
Compliant to RoHS directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
KEY PARAMETERS
PARAMETER
V
CBO
V
CEO
V
EBO
I
C
h
FE
Package
Configuration
VALUE
-50
-45
-5
-0.5
250-600
SOT-23
Single Dice
UNIT
V
V
V
A
APPLICATIONS
●
●
●
●
Switching mode power supply (SMPS)
Adapters
Lighting application
On-board DC/DC converter
MECHANICAL DATA
●
●
●
●
Case: SOT-23
Molding compound meets UL 94 V-0 flammability rating
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound
(halogen-free)
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 1A whisker test
● Weight: 0.008grams (approximately)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Marking code on the device
Power dissipation
Collector-base voltage, emitter open
Collector-emitter voltage, base open
Emitter-base voltage, collector open
Collector current, dc
Junction temperature
Storage temperature
I
C
= -10 μA, I
E
= 0
I
C
= -10 mA, I
B
= 0
I
E
= -1 μA, I
C
= 0
P
D
V
CBO
V
CEO
V
EBO
I
C
T
J
T
STG
SYMBOL
BC807- BC807- BC807-
16
5A
25
5B
0.3
-50
-45
-5
-0.5
-55 to +150
-55 to +150
40
5C
UNIT
W
V
V
V
A
°C
°C
1
Version:H1702
BC807-16/-25/-40
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Collector cutoff current, emitter
open
Emitter cutoff current, collector
open
CONDITIONS
V
CB
= -45 V, I
E
= 0
V
CB
= -40 V, I
B
= 0
V
EB
= -4 V, I
C
= 0
BC807-16
DC current gain
V
CE
= -1 V,
I
C
= -100 mA
BC807-25
BC807-40
V
CE(sat)
V
BE(sat)
f
T
h
FE
SYMBOL
I
CBO
I
EBO
MIN
-
-
-
100
160
250
-
-
100
TYP
-
-
-
-
-
-
-
-
-
MAX
-0.1
-0.2
-0.1
250
400
600
-0.7
-1.2
-
V
V
MHz
µA
µA
UNIT
Collector-emitter saturation
voltage
Base-emitter saturation
voltage
Transition frequency
I
C
= -500 mA, I
B
= -50 mA
I
C
= -500 mA, I
B
= -50 mA
V
CE
= -5 V , I
C
= -10 mA,
f= 50MHz
ORDERING INFORMATION
PART NO.
BC807-XX
(Note 1)
PACKING
CODE
RF
PACKING CODE
SUFFIX(*)
G
PACKAGE
SOT-23
PACKING
3K / 7" Reel
Notes:
1. "xx" is Device Code is"16" and "25" and "40"
*: optional available
EXAMPLE
EXAMPLE P/N
BC807-16 RFG
PART NO.
BC807-16
PACKING CODE
RF
PACKING CODE
SUFFIX
G
DESCRIPTION
Green compound
2
Version:H1702
BC807-16/-25/-40
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.1 Power Derating Curve
400
f
T,
Gain Bandwidth Product (MHz)
1000
T
A
= 25
o
C
f = 20 MHz
-V
CE
= 5.0
100
-V
CE
= 1 V
Fig. 2 Gain Bandwidth Product VS.
Collector Current
P
D
, Power Dissipation (mW)
300
200
100
0
0
50
100
150
200
10
1
10
100
1000
I
C
, Collector Current (mA)
T
SB
, Substrate Temperature (
o
C)
Fig.3 Collector Sat Voltage VS. Collector Current
1000
- 50
-I
C,
Collector Current (mA)
100
o
C
Fig.4 DC Current Gain VS. Collector Current
1000
-V
CE
= 1V
150
o
C
h
FE
, DC Current Gain
25
o
C
Typical
- - - - - - - - Limits
at T
A
= 25
o
C
25
o
C
100
- 50
o
C
10
150
o
C
1
-I
C
/ -I
B
= 10
0.1
0
0.1
0.2
0.3
0.4
0.5
10
0.1
1
10
100
1000
-I
C
, Collector Current (mA)
-V
CESAT
, Collector Saturation Voltage (V)
3
Version:H1702
BC807-16/-25/-40
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.5 Typical Emitter-Collector Characteristics
500
3.2
1.4
100
2.4
2.0
1.8
300
1.0
200
0.8
0.6
0.4
0
0
- I
B
= 0.2 mA
1
-V
CE
, Collector-Emitter Voltage (V)
2
0
0
1.6
1.2
-I
C
, Collector Current ( mA )
80
Fig. 6 Typical Transient Thermal
Characteristics
2.8
0.4
0.35
0.3
-I
c
, Collector Current (mA)
400
60
0.25
0.2
0.15
40
100
20
0.1
- I
B
= 0.05 mA
10
-V
CE
, Collector-Emitter Voltage (V)
20
4
Version:H1702
BC807-16/-25/-40
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSION
SOT-23
DIM.
A
B
C
D
E
F
G
H
Unit(mm)
Min
2.70
1.10
0.30
1.78
2.10
0.89
Max
3.10
1.50
0.51
2.04
2.64
1.30
Unit(inch)
Min
0.106
0.043
0.012
0.070
0.083
0.035
Max
0.122
0.059
0.020
0.080
0.104
0.051
0.55 REF
0.10 REF
0.022 REF
0.004 REF
SUGGEST PAD LAYOUT
DIM.
Z
X
Y
C
E
Unit(mm)
TYP
2.8
0.7
0.9
1.9
1.0
Unit(inch)
TYP
0.11
0.03
0.04
0.07
0.04
5
Version:H1702
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