BAS16
Taiwan Semiconductor
150mA, 75V Switching Diode
FEATURES
●
●
●
●
Low power loss, high efficiency
Ideal for automated placement
High surge current capability
Compliant to RoHS directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
● Halogen-free according to IEC 61249-2-21
KEY PARAMETERS
PARAMETER
I
F(AV)
V
RRM
I
FSM
V
F
at I
F
=100mA
T
J MAX
Package
Configuration
VALUE
150
75
2
1.0
150
SOT-23
Single dice
UNIT
mA
V
A
V
°C
APPLICATIONS
● Switching mode power supply (SMPS)
MECHANICAL DATA
● Case: SOT-23
● Molding compound: UL flammability classification
rating 94V-0
● Moisture sensitivity level: level 1, per J-STD-020
● Packing code with suffix "G" means green compound
(halogen-free)
● Terminal: Matte tin plated leads, solderable per J-STD-002
● Meet JESD 201 class 1A whisker test
● Weight: 8± 0.5 mg (approximately)
ABSOLUTE MAXIMUM RATINGS
(T
A
= 25°C unless otherwise noted)
PARAMETER
Marking code on the device
Repetitive peak reverse voltage
Forward current
Non-repetitive peak forward surge current @ t = 0.001 s
Junction temperature range
Storage temperature range
SYMBOL
V
RRM
I
F(AV)
I
FSM
T
J
T
STG
PART NUMBER
A6
75
150
2
-65 to +150
-65 to +150
V
mA
A
°C
°C
UNIT
THERMAL PERFORMANCE
PARAMETER
Junction-to-ambient thermal resistance
SYMBOL
R
ӨJA
LIMIT
375
UNIT
°C/W
1
Version:E1612
BAS16
Taiwan Semiconductor
ELECTRICAL SPECIFICATIONS
(T
A
= 25°C unless otherwise noted)
PARAMETER
CONDITIONS
I
F
= 1.0mA, T
J
= 25°C
Forward voltage per diode
(1)
SYMBOL
TYP
MAX
0.715
0.855
1.000
1.250
UNIT
I
F
= 10mA, T
J
= 25°C
I
F
= 50mA, T
J
= 25°C
I
F
= 150mA, T
J
= 25°C
V
F
--
V
Reverse current @ rated V
R
per diode
(2)
V
R
=75V T
J
= 25°C
1 MHz, V
R
=0V
I
F
=10mA, I
R
= 60mA,
I
RR
= 10%I
R
,R
L
=100Ω
I
R
C
J
T
rr
--
--
1
2
4
μA
ρF
ns
Junction capacitance
Reverse recovery time
Notes:
1. Pulse test with PW=0.3 ms
2. Pulse test with PW=30 ms
ORDERING INFORMATION
PART NO.
PACKING
CODE
RF
BAS16
R5
Notes:
*: optional available
G
SOT-23
10K / 13" Reel
PACKING CODE
SUFFIX(*)
PACKAGE
PACKING
3K / 7" Reel
EXAMPLE
EXAMPLE P/N
BAS16 RFG
PART NO.
BAS16
PACKING CODE
RF
PACKING CODE
SUFFIX
G
DESCRIPTION
Green compound
2
Version:E1612
BAS16
Taiwan Semiconductor
CHARACTERISTICS CURVES
(T
A
= 25°C unless otherwise noted)
Fig.1 Typical Forward Characteristics
100
Instantaneous Forward Current (mA)
1000
Fig.2 Reverse Current VS. Reverse Voltage
Reverse Current (uA)
10
100
1
10
0.1
0.01
0
0.2
0.4
0.6
0.8
1
1.2
1.4
1.6
Instantaneous Forward Voltage (V)
1
0
20
40
60
80
100
120
Reverse Voltage (V)
Fig.3 Admissible Power Dissipation Curve
300
250
200
150
100
50
0
0
25
50
75
100
125
150
175
Ambient Temperature (
o
C)
Junction Capacitance (pF)
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0
Fig.4 Typical Junction Capacitance
Power Dissipation (mW)
8
16
24
32
40
Reverse Voltage (V)
3
Version:E1612
BAS16
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSION
SOT-23
DIM.
Unit(mm)
Min
2.70
1.10
0.30
1.78
2.10
0.89
Max
3.10
1.50
0.51
2.04
2.64
1.30
Unit(inch)
Min
0.106
0.043
0.012
0.070
0.083
0.035
Max
0.122
0.059
0.020
0.080
0.104
0.051
A
F
A
B
C
B
E
D
E
F
C
D
H
G
G
H
0.55 REF
0.10 REF
0.022 REF
0.004 REF
DIM.
Z
X
Y
C
E
Unit(mm)
Typ.
2.80
0.70
0.90
1.90
1.00
Unit(inch)
Typ.
0.110
0.028
0.035
0.075
0.039
4
Version:E1612
BAS16
Taiwan Semiconductor
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
5
Version:E1612
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