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BM10NB(0.6)-30DS-0.4V(75)

Description
CONN RCPT 30POS 0.4MM SMD GOLD
CategoryThe connector   
File Size2MB,15 Pages
ManufacturerHirose Electric
Environmental Compliance
Download Datasheet Parametric View All

BM10NB(0.6)-30DS-0.4V(75) Overview

CONN RCPT 30POS 0.4MM SMD GOLD

BM10NB(0.6)-30DS-0.4V(75) Parametric

Parameter NameAttribute value
Connector typeSocket with central contact
Number of pins30
spacing0.016"(0.40mm)
Number of rows2
Installation typesurface mount
characteristicFixed solder tail
Contact platinggold
Contact plating thickness3.90µin(0.099µm)
Joint stack height0.6mm
board height0.024"(0.61mm)
ITS-P-08016NB_.2 (Page 1 of 15)
BM10 Series
0.4 mm Pitch, 0.6 / 0.8 mm Stacking Height, FPC to Board Connector
◆Features
0.8 mm stacking height
1. 2 types of stacking height are available: 0.6 and 0.8 mm
2. Space saving: 2.98 mm depth
3. Highly reliable contact and retention force with clipping contact design
4. Clear tactile click with excellent contact design
5. Shock-absorbing configuration with dimple on contact for robustness
6. Enhanced self alignment mechanism by guidance ribs (Self alignment range: 0.3 mm)
7. High PCB retention force with metal fittings
8. Solder wicking prevention
9. Contact protection against dust
10. RoHS compliant, Halogen-free product*
*This product satisfies halogen free requirements defined as 900 ppm maximum chlorine,
900 ppm maximum bromine, and 1500 ppm maximum total of chlorine and bromine.
Specifications herein are subject to change without notice.
Contact Hirose for latest specification, drawings, or availabilities.
Issued: Mar. 31, 2010

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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