NEW
I/O Card Interface Connectors
NX Series
3. ESD Secure
Thermoplastic molded covers assures insulation
of the connections and shields from ESD.
4. Secure Latching
A built-in latch assures correct and secure
mating of connector.
5. Reliable Conductor Termination
Reliable termination of conductors
accomplished by proven IDC termination.
is
6. Sequential Mating
The 0.8mm pitch contacts are engaging the
corresponding parts in sequence: Ground-
Power & Signal
7. Rugged Construction
sFeatures
1. Low Profile
Protorusion above the PCB board is only 2.9mm, and the
connectors can be mounted to type I and II I/O cards.
Securely attached to the board with optional
screws.
8. Card Frame Kits
Available as a separate part number.
2. EMI/RFI protection
Full metal shielding. Shield connects first, ahead of
contacts.
9. Secure Attachment to Frame Kit.
Compliant mounting bracket attaches the
connectore directly to the frame kit.
sApplications
Used with I/O cards, portable personal computers,and the external connections of various small-sized portable
terminals.
sSpecifications
Current
Ratings
Voltage
Item
1. Insulation resistance
2. Voltage proof
3. Contact resistance
4. Vibration
5. Humidity resistance
6. Rapid change
of temperature
7. Insertion and
withdrawal life
8. Resistance to
soldering heat
0.5 A
125 V AC
Operating temperature
Operating humidity
-30ç to +70ç (Note 1) Storage temperature range -10ç to +60ç (Note 2)
95% R.H. or less
(No condensation)
Requirements
250 Mø or greater
No flashover or breakdown
40 mø or less (initial value) (Note 3)
No electrical discontinuity for 10µs or
greater
Insulation resistance: 250 Mø or greater
No damage, cracks, or defects at any
part
Change of contact resistance from the
start should be 60 mø or less
Measured at 100 V DC
300 V AC for 1 minute
Measured at 100 mA
Frequency of 10 to 55 Hz, amplitude of 0.75 mm,
3 directions, 2 hours each
Temperature of 40ç
±2ç,
humidity of 90 to 95%,
duration 96h
-55ç, 30 min./15 to 30ç, within 5 min/85ç, 30 min
/15
to 35ç, within 5 min, for 5 cycles
3,000 times
Storage humidity range
Conditions
40 to 70% (Note 2)
No melting of resin portions which affect Reflow: at the recommended temperature profile
performance
Soldering iron temperature: 300ç for 3 seconds
Note 1 : Includes temperature rise when conducting.
Note 2 : The term storage refers to an unused products prior to boards mounting (including packing materials) that is being kept for
a long period.
The operating temperature and humidity range are applied to the non-conducting condition following board assembly.
Note 3 : The aforementioned specifications are representative of this series. For information on specific parts, confirm with Sales Office.
B8
sRECEPTACLE
CONNECTORS
q0.9
mm offset type
CL234-0004-5
NX60T-½ SAA9-SP
Unit: mm
Product No.
HRS No.
Number of contacts
09
15
25
32
A
25.2
30.0
38.0
43.6
B
19.7
24.5
32.5
38.1
C
17.2
22.0
30.0
35.6
D
06.4
11.2
19.2
24.8
NX60TA-09SAA9-SP CL234-0106-5
NX60TB-15SAA9-SP CL234-0097-6
NX60TA-25SAA9-SP CL234-0107-8
NX60T0-32SAA9-SP CL234-0023-0
q0.3
mm offset type
CL234-00032-0
NX60TA-½ SAA3-SP
Unit: mm
Product No.
HRS No.
Number of contacts
09
15
25
32
A
25.2
30.0
38.0
43.6
B
19.7
24.5
32.5
38.1
C
17.2
22.0
30.0
35.6
D
06.4
11.2
19.2
24.8
NX60TA-09SAA3-SP CL234-0031-8
NX60TB-15SAA3-SP CL234-0098-9
NX60TB-25SAA3-SP CL234-0033-3
NX60TA-32SAA3-SP CL234-0053-0
B11
Embedded System
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