HYS72V32300GU-7.5-D datasheet, PDF

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HYS72V32300GU-7.5-D: DescriptionSynchronous DRAM Module, 32MX72, 5.4ns, CMOS, DIMM-168; Categorystorage; File Size92KB，16 Pages; ManufacturerInfineon; Websitehttp://www.infineon.com/

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HYS72V32300GU-7.5-D Overview

Synchronous DRAM Module, 32MX72, 5.4ns, CMOS, DIMM-168

HYS72V32300GU-7.5-D Parametric

Parameter Name	Attribute value
Maker	Infineon
Parts packaging code	DIMM
package instruction	DIMM, DIMM168
Contacts	168
Reach Compliance Code	unknown
ECCN code	EAR99
Is Samacsys	N
access mode	SINGLE BANK PAGE BURST
Maximum access time	5.4 ns
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz
I/O type	COMMON
JESD-30 code	R-XDMA-N168
memory density	2415919104 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	168
word count	33554432 words
character code	32000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	32MX72
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	DIMM
Encapsulate equivalent code	DIMM168
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	3.3 V
Certification status	Not Qualified
refresh cycle	8192
self refresh	YES
Maximum standby current	0.018 A
Maximum slew rate	2.16 mA
Maximum supply voltage (Vsup)	3.6 V
Minimum supply voltage (Vsup)	3 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	DUAL
Base Number Matches	1

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HYS 64/72V32300GU

SDRAM-Modules

3.3 V 32M x 64/72-Bit, 256MByte SDRAM Modules

168-pin Unbuffered DIMM Modules

• 168 Pin unbuffered 8 Byte Dual-In-Line

SDRAM Modules for PC main memory

applications using 256Mbit technology.

• PC100-222, PC133-333 and PC133-222

versions

• One bank 32M

64 and 32M

organisation

• Optimized for byte-write non-parity or ECC

applications

• Fully PC board layout compatible to INTEL’s

Rev. 1.0 module specification

• Programmed Latencies:

Product Speed

-7

-7.5

-8

PC133

PC100

RCD

• Single + 3.3 V (

0.3 V) power supply

• Programmable CAS Latency, Burst Length,

and Wrap Sequence (Sequential &

Interleave)

• Auto Refresh (CBR) and Self Refresh

• Decoupling capacitors mounted on substrate

• All inputs, outputs are LVTTL compatible

• Serial Presence Detect with E

PROM

• Uses Infineon 256 Mbit SDRAM components

in 32M

8 organization and TSOPII-54

packages

• Gold contact pads, card size:

133.35 mm

31.75 mm

3.00 mm

(JEDEC MO-161-BA)

• SDRAM Performance:

-7 / -7.5

PC133

-8

PC100

100

Unit

MHz

Clock Frequency (max.)

Clock Access Time

133

5.4

Description

The HYS 64V32300GU and HYS 72V32300GU are industry standard 168-pin 8-byte Dual in-line

Memory Modules (DIMMs) which are organized as 32M

64 and 32M

72 in 1 memory bank high

speed memory arrays designed with 256M Synchronous DRAMs (SDRAMs) for non-parity and

ECC applications. The DIMMs use -7 speed sorted 32M

8 SDRAM devices in TSOP54 packages

to meet the PC133-222 requirement, -7.5 components for PC133-333 and -8 components for the

standard PC100 applications. Decoupling capacitors are mounted on the PC board. The PC board

design is according to INTEL’s module specification. The DIMMs have a serial presence detect,

implemented with a serial E

PROM using the 2-pin I

C protocol. The first 128 bytes are utilized by

the DIMM manufacturer and the second 128 bytes are available to the end user. All Infineon 168-

pin DIMMs provide a high performance, flexible 8-byte interface in a 133.35 mm long footprint, with

1.25“ (31.75 mm) height.

INFINEON Technologies

9.01

HYS72V32300GU-7.5-D Related Products

	HYS72V32300GU-7.5-D	HYS64V32300GU-7.5-D
Description	Synchronous DRAM Module, 32MX72, 5.4ns, CMOS, DIMM-168	Synchronous DRAM Module, 32MX64, 5.4ns, CMOS, DIMM-168
Maker	Infineon	Infineon
Parts packaging code	DIMM	DIMM
package instruction	DIMM, DIMM168	DIMM, DIMM168
Contacts	168	168
Reach Compliance Code	unknown	unknown
ECCN code	EAR99	EAR99
access mode	SINGLE BANK PAGE BURST	SINGLE BANK PAGE BURST
Maximum access time	5.4 ns	5.4 ns
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	133 MHz	133 MHz
I/O type	COMMON	COMMON
JESD-30 code	R-XDMA-N168	R-XDMA-N168
memory density	2415919104 bit	2147483648 bit
Memory IC Type	SYNCHRONOUS DRAM MODULE	SYNCHRONOUS DRAM MODULE
memory width	72	64
Number of functions	1	1
Number of ports	1	1
Number of terminals	168	168
word count	33554432 words	33554432 words
character code	32000000	32000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	32MX72	32MX64
Output characteristics	3-STATE	3-STATE
Package body material	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM
Encapsulate equivalent code	DIMM168	DIMM168
Package shape	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
refresh cycle	8192	8192
self refresh	YES	YES
Maximum standby current	0.018 A	0.016 A
Maximum slew rate	2.16 mA	1.92 mA
Maximum supply voltage (Vsup)	3.6 V	3.6 V
Minimum supply voltage (Vsup)	3 V	3 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V
surface mount	NO	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal form	NO LEAD	NO LEAD
Terminal pitch	1.27 mm	1.27 mm
Terminal location	DUAL	DUAL

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