INTERCONNECTS
SERIES 834 & 835 • .100” GRID OFP
®
PASS-THROUGH SOCKETS
Ø.030”
&
.025”
PINS• SINGLE AND DOUBLE ROW STRIPS
•
834/835 Series Pass-Through Sockets have a low
•
•
•
•
•
.130” pro le and will accept Ø.030” round pin,
as well as industry standard .025” square pin
headers.
They are typically used to interconnect two or
more parallel circuit boards.
Sockets are designed for hand, wave or re ow*
soldering. The high temperature insulator is
compatible with all solder processes.
Unique ORGANIC FIBRE PLUG® barriers prevent
solder, paste or ux from contaminating the
internal spring contacts. After soldering, the
OFP® barriers are pushed out of the socket when
the mating header is inserted.
Mill-Max sockets use a receptacle consisting of a
precision-machined brass sleeve with a press- t
beryllium copper “multi- nger” spring contact.
Recommended mounting holes are Ø.046 ±.003”
PTH (1,2 mm drilled prior to plating).
UPPER
CIRCUIT
BOARD
Ø.030" or
.025"
PINS
MIDDLE
CIRCUIT
BOARD
Typical Application
INTERCONNECTION
PIN
#47 SPRING
CONTACT
*Intrusive
reflow (also called “pin-in-paste”) is a technique
of using conventional through-hole components in a
reflow soldering process. The pass-through socket is placed
into plated through-holes in the circuit board (solder paste
has previously been screen printed on pads adjacent to the
holes) and the board is reflowed in the same pass as other
SMT components. Solder will fill the plated through-holes
and achieve solder joints as reliable as wave soldering. The
OFP® barrier prevents solder paste from being picked up
inside the contact during assembly.
.025-.036
.025 * .025
.100
SOCKET
INSULATOR
PASS THROUGH
SOCKETS
RECEPTACLE
SLEEVE
CIRCUIT
BOARD
LOWER
CIRCUIT
BOARD
SOLDER
JOINT
PUSHED OUT BY INTERCONNECT
PIN AFTER SOLDERING
ORGANIC FIBER PLUG
®
US Patent #7,086,870
Number of Pins
X .100"
ORDERING INFORMATION
Series 834...001
Single Row OFP
®
Pass-Through Socket
834 XX 0 _ _ 10 001000
Specify number of pins
01-64
.110
.088
.130
.061 DIA.
.043 DIA.
.036 DIA.
Through-Hole
.080
FIG. 1
FIG. 1
.100
®
Series 835...001
Double Row OFP
®
Pass-Through Socket
04-72
For
Electrical, Mechanical
& Enviromental Data,
See page 264
.025-.036
.025 * .025
.200
Number of Pins
X .100" / 2
Specify number of pins
RoHS - 2
.110 .088
.061 DIA.
.043 DIA.
.036 DIA.
Through-Hole
.100
.130
2011/65/EU
.080
XX=Plating Code
See Below
93
200
µ”
Sn/Pb
SPECIFY PLATING CODE XX=
®
.100
43
200
µ”
Sn
30
µ”
Au
47
200
µ”
Sn
Au Flash
FIG. 2
Sleeve (Pin)
Contact (Clip)
30
µ”
Au
Mill-Max Mfg. Corp. • 190 Pine Hollow Road, P.O. Box 300, Oyster Bay, NY 11771 • 516-922-6000 • Fax: 516-922-9253 • www.mill-max.com
PAGE 63 | INTERCONNECTS
FIG. 2
835 XX 0 _ _ 10 001000
Embedded System
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