These Devices are Pb--Free, Halogen Free/BFR Free and are RoHS
Compliant
http://onsemi.com
MAXIMUM RATINGS
Rating
Collector -- Emitter Voltage
Collector -- Base Voltage
Collector -- Emitter Voltage
Emitter -- Base Voltage
Collector Current
Total Power Dissipation up to T
A
= 25C
(Note 1)
Storage Temperature Range
Junction Temperature
Symbol
V
CEO
V
CBO
V
CER
V
EBO
I
C
P
D
T
stg
T
J
Value
--300
--300
--300
--5.0
--50
1.5
--65 to +150
150
Unit
Vdc
Vdc
Vdc
Vdc
mAdc
W
C
C
COLLECTOR 2,4
BASE
1
EMITTER 3
PNP SILICON TRANSISTOR
SURFACE MOUNT
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance,
Junction--to--Ambient (Note 1)
Symbol
R
θJA
Max
83.3
Unit
C/W
1
AYW
DF
G
G
1
MARKING
DIAGRAM
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on a glass epoxy printed circuit board 1.575 in. x 1.575 in.
x 0.059 in.; mounting pad for the collector lead min. 0.93 in
2
.
SOT-
-223 (TO-
-261)
CASE 318E
STYLE 1
A
= Assembly Location
Y
= Year
W = Work Week
DF = Device Code
G
= Pb--Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
BF721T1G
Package
SOT--223
(Pb--Free)
Shipping
†
1000 / Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Semiconductor Components Industries, LLC, 2010
September, 2010 - Rev. 9
-
1
Publication Order Number:
BF721T1/D
BF721T1G
ELECTRICAL CHARACTERISTICS
(T
A
= 25C unless otherwise noted)
Characteristic
OFF CHARACTERISTICS
Collector-Emitter Breakdown Voltage
(I
C
= --1.0 mAdc, I
B
= 0)
Collector-Base Breakdown Voltage
(I
C
= --100
mAdc,
I
E
= 0)
Collector-Emitter Breakdown Voltage
(I
C
= --100
mAdc,
R
BE
= 2.7 kΩ)
Emitter-Base Breakdown Voltage
(I
E
= --10
mAdc,
I
C
= 0)
Collector-Base Cutoff Current
(V
CB
= -- 200 Vdc, I
E
= 0)
Collector--Emitter Cutoff Current
(V
CE
= -- 250 Vdc, R
BE
= 2.7 kΩ)
(V
CE
= -- 200 Vdc, R
BE
= 2.7 kΩ T
J
= 150C)
ON CHARACTERISTICS
DC Current Gain
(I
C
= --25 mAdc, V
CE
= --20 Vdc)
Collector-Emitter Saturation Voltage
(I
C
= -- 30 mAdc, I
B
= -- 5.0 mAdc)
DYNAMIC CHARACTERISTICS
Current-Gain -- Bandwidth Product
(V
CE
= -- 10 Vdc, I
C
= --10 mAdc, f = 35 MHz)
Feedback Capacitance
(V
CE
= -- 30 Vdc, I
C
= 0, f = 1.0 MHz)
f
T
C
re
60
--
--
1.6
MHz
pF
h
FE
V
CE(sat)
50
--
--
-- 0.8
--
Vdc
V
(BR)CEO
V
(BR)CBO
V
(BR)CER
V
(BR)EBO
I
CBO
I
CER
-- 300
--300
--300
-- 5.0
--
--
--
--
--
--10
Vdc
Vdc
Vdc
Vdc
nAdc
Symbol
Min
Max
Unit
--
--
--50
--10
nAdc
mAdc
http://onsemi.com
2
BF721T1G
300
250
hFE , DC CURRENT GAIN
200
25C
150
100
50
0
--55C
T
J
= +125C
V
CE
= 10 Vdc
0.1
1.0
I
C
, COLLECTOR CURRENT (mA)
10
100
Figure 1. DC Current Gain
100
f T, CURRENT--GAIN — BANDWIDTH (MHz)
C
ib
@ 1MHz
150
130
110
90
70
50
30
10
1
3
5
11
13
15
7
9
I
C
, COLLECTOR CURRENT (mA)
T
J
= 25C
V
CE
= 20 Vdc
F = 20 MHz
17
19
21
C, CAPACITANCE (pF)
10
C
cb
@ 1MHz
1.0
0.1
0.1
1.0
10
100
V
R
, REVERSE VOLTAGE (VOLTS)
1000
Figure 2. Capacitance
1.4
1.2
V, VOLTAGE (VOLTS)
1.0
0.8
0.6
0.4
0.2
0.0
0.1
1.0
10
I
C
, COLLECTOR CURRENT (mA)
100
Figure 3. Current-
-Gain — Bandwidth
V
CE(sat)
@ 25C, I
C
/I
B
= 10
V
CE(sat)
@ 125C, I
C
/I
B
= 10
V
CE(sat)
@ --55C, I
C
/I
B
= 10
V
BE(sat)
@ 25C, I
C
/I
B
= 10
V
BE(sat)
@ 125C, I
C
/I
B
= 10
V
BE(sat)
@ --55C, I
C
/I
B
= 10
V
BE(on)
@ 25C, V
CE
= 10 V
V
BE(on)
@ 125C, V
CE
= 10 V
V
BE(on)
@ --55C, V
CE
= 10 V
Figure 4. “ON” Voltages
http://onsemi.com
3
BF721T1G
PACKAGE DIMENSIONS
SOT-
-223 (TO-
-261)
CASE 318E--04
ISSUE N
D
b1
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCH.
DIM
A
A1
b
b1
c
D
E
e
e1
L
L1
H
E
MIN
1.50
0.02
0.60
2.90
0.24
6.30
3.30
2.20
0.85
0.20
1.50
6.70
0
MILLIMETERS
NOM
MAX
1.63
1.75
0.06
0.10
0.75
0.89
3.06
3.20
0.29
0.35
6.50
6.70
3.50
3.70
2.30
2.40
0.94
1.05
------
------
1.75
2.00
7.00
7.30
10
--
MIN
0.060
0.001
0.024
0.115
0.009
0.249
0.130
0.087
0.033
0.008
0.060
0.264
0
INCHES
NOM
0.064
0.002
0.030
0.121
0.012
0.256
0.138
0.091
0.037
------
0.069
0.276
--
MAX
0.068
0.004
0.035
0.126
0.014
0.263
0.145
0.094
0.041
------
0.078
0.287
10
4
H
E
1
2
3
E
e1
b
e
A
θ
L
L1
C
0.08 (0003)
θ
A1
STYLE 1:
PIN 1.
2.
3.
4.
BASE
COLLECTOR
EMITTER
COLLECTOR
SOLDERING FOOTPRINT*
3.8
0.15
2.0
0.079
2.3
0.091
2.3
0.091
6.3
0.248
2.0
0.079
1.5
0.059
mm
inches
SCALE 6:1
*For additional information on our Pb--Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor
and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone:
303--675--2175 or 800--344--3860 Toll Free USA/Canada
Fax:
303--675--2176 or 800--344--3867 Toll Free USA/Canada
Email:
orderlit@onsemi.com
N. American Technical Support:
800--282--9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81--3--5773--3850
ON Semiconductor Website: www.onsemi.com
Order Literature:
http://www.onsemi.com/orderlit
For additional information, please contact your local
If there is a car: the front looks like a Mercedes-Benz, and the back looks like a BMW; it must be Geely. If there is a car: the appearance has not changed, but the name has been changed; it must be S...
[align=left][color=rgb(85, 85, 85)][size=4] With the rapid development of new energy vehicles and the increasing complexity of automotive electronic systems, the functional safety of automobiles has r...
I am so angry, so mad, so rude and so annoying! ~~~~ I have 2TB of space on my Baidu Cloud account, but I am currently using only about 200GB:Today I saw some information shared by a forum user on EE ...
I've been working on it for a long time but nothing has come out. I'm so depressed...
Can someone tell me briefly the process of establishing a TCP connection using LWIP as a client, including which f...
introduction
Bluetooth technology is a short-range wireless communication technology designed to replace wired cables. It is a wireless communication technology standard developed by the SIG, ...[Details]
Some time ago, I attended the 4th Energy Chemistry Forum of the Chinese Chemical Society and learned about high-energy-density and high-safety batteries. I would like to summarize and share this wi...[Details]
introduction
The concept of the smart home is gradually developing and gaining market acceptance. We believe its ultimate form lies in the interconnection of all home appliances through open i...[Details]
One of the most core components of electric vehicles is the motor. The power supply provides electrical energy to the motor, which converts this electrical energy into mechanical energy, which in t...[Details]
Magna's integrated in-cabin perception system fuses vision and millimeter-wave radar data to detect the presence of passengers, identify stranded children, monitor driver fatigue and vital signs, a...[Details]
A patent disclosed by Ford proposes replacing traditional segmented side curtain airbags with integrated full-width side curtain airbags that span the side of the vehicle and can be deployed simult...[Details]
Over the past decade, the narrative surrounding fuel vehicles has been one of decline and replacement. Under the onslaught of new energy vehicles, traditional automakers have been forced to acceler...[Details]
China, August 21, 2025 – STMicroelectronics (NYSE: STM), a world-leading semiconductor company serving a wide range of electronics applications, has published its IFRS 2025 semi-annual financial re...[Details]
Methods of DC motor speed regulation:
1. The voltage regulator can be used to change the input voltage and speed directly, which is often used for large kilowatt-level motors.
2. Thyristo...[Details]
There are many motors that can use thyristor speed control, and they can be used in almost all industries. Various types of motors, such as fans, pumps, AC motors, DC motors, torque motors, single-...[Details]
introduction
The rapid adoption of computers has led to a growing number of tasks being performed on them. People from all walks of life, especially programmers and writers, are spending incre...[Details]
For self-driving cars, LiDAR is the sensory organ that allows them to "see the road." Simply put, its operating principle involves sending out a laser beam, receiving the echo, and ultimately gener...[Details]
Hair dryer structure and working principle: It is mainly used for drying and shaping hair, but it can also be used for local drying, heating and treatment in laboratories, physiotherapy rooms, ind...[Details]
According to Reuters, citing people familiar with the matter, British semiconductor design company Arm Holdings (NASDAQ:ARM) has hired Rami Sinno, head of Amazon's (NASDAQ:AMZN) artificial intellig...[Details]
The automotive transmission is the foundation of a vehicle's motion. The vehicle's drivetrain transfers engine power to the drive wheels, enabling the vehicle to move. The vehicle's drivetrain cons...[Details]
Automotive Electronics
京公网安备 11010802033920号
EEWORLD
