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BZX84C8V2

Description
Zener Diode, 8.2V V(Z), 5%, 0.35W, Silicon, Unidirectional, PLASTIC PACKAGE-3
Categorydiode   
File Size123KB,4 Pages
ManufacturerMicro Commercial Components (MCC)
Download Datasheet Parametric View All

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BZX84C8V2 Overview

Zener Diode, 8.2V V(Z), 5%, 0.35W, Silicon, Unidirectional, PLASTIC PACKAGE-3

BZX84C8V2 Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
MakerMicro Commercial Components (MCC)
package instructionR-PDSO-G3
Contacts3
Reach Compliance Codecompliant
ECCN codeEAR99
Is SamacsysN
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
JESD-30 codeR-PDSO-G3
JESD-609 codee0
Number of components1
Number of terminals3
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)240
polarityUNIDIRECTIONAL
Maximum power dissipation0.35 W
Certification statusNot Qualified
Nominal reference voltage8.2 V
surface mountYES
technologyZENER
Terminal surfaceTIN LEAD
Terminal formGULL WING
Terminal locationDUAL
Maximum time at peak reflow temperature30
Maximum voltage tolerance5%
Working test current5 mA
Base Number Matches1
MCC
Features
l
l
l
l
  omponents
21201 Itasca Street Chatsworth

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BZX84C2V4
THRU
BZX84C39
Silicon
410 mWatt
Zener Diodes
Planar Die construction
410mW Power Dissipation
Zener Voltages from 2.4V - 39V
Ideally Suited for Automated Assembly Processes
.
Mechanical Data
l
l
l
Case: SOT-23, Plastic
Terminals: solderable per MIL-STD-202, Methode 208
Weight: 0.008 grams (approx.)
A
D
SOT-23
C
B
Maximum Ratings @ 25
o
C Unless Otherwise Specified
Zener Current
I
F
100
mA
Maximum Forward
V
F
1.2
V
Voltage
Power Dissipation
P
(AV)
410
mWatt
(Note 1)
Operation And
T
J
, T
STG
-55
o
C to
Storage
+150
o
C
Temperature
Peak Foreard Surge
I
FSM
2.0
A
Current 8.3mS half
NOTES:
A. Mounted on 5.0mm2(.013mm thick) land areas.
B. Measured on 8.3ms, single half sine-wave or
equivalent square wave, duty cycle = 4 pulses per
minute maximum.
F
E
G
H
J
DIMENSIONS
INCHES
MIN
.110
.083
.047
.035
.070
.018
.0005
.035
.003
.015
MM
MIN
2.80
2.10
1.20
.89
1.78
.45
.013
.89
.085
.37
DIM
A
B
C
D
E
F
G
H
J
K
MAX
.120
.098
.055
.041
.081
.024
.0039
.044
.007
.020
MAX
3.04
2.64
1.40
1.03
2.05
.60
.100
1.12
.180
.51
NOTE
Suggested Solder
Pad Layout
.031
.800
.035
.900
*Pin Configuration - Top View
.079
2.000
inches
mm
.037
.950
.037
.950
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