L130-408000HR00000 datasheet, PDF

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L130-408000HR00000: DescriptionLED LUXEON WM WHT 4000K 2KV 2SMD; CategoryLED optoelectronic/LED photoelectric; File Size1MB，13 Pages; ManufacturerLumileds; Websitehttps://www.lumileds.com/; Environmental Compliance

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L130-408000HR00000 Overview

LED LUXEON WM WHT 4000K 2KV 2SMD

L130-408000HR00000 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	Lumileds
Reach Compliance Code	compliant
Optoelectronic device types	SINGLE COLOR LED
Base Number Matches	1

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ILLUMINATION

LUXEON HR30

Assembly and Handling Information

Introduction

This application brief addresses the recommended assembly and handling

guidelines for LUXEON HR30 emitter. This emitter is specifically designed and tested

for use in the most demanding environments and conditions. This emitter delivers

high efficacy and quality of light for distributed light source applications in a compact

3.0mm x 3.0mm package. Proper assembly, handling, and thermal management, as

outlined in this application brief, ensure high optical output and reliability of these

emitters.

Scope

The assembly and handling guidelines in this application brief apply to LUXEON 3030

HR30 with the following part number designation:

L130 – AABBCCHR00000

Where:

AA –

BB –

CC –

designates nominal ANSI CCT (27=2700K, 30=3000K, etc.)

designates minimum CRI (70=70CRI, 80=80CRI, etc.)

designated ESD protection level per JEDEC JS-001-2012 (00=2kV and 0T=8kV)

In the remainder of this document the term LUXEON emitter refers to any product in

the LUXEON product series listed above. Any handling requirements that are specific

to a subset of LUXEON emitters will be clearly marked.

Table of Contents

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

Scope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1

1 . Component . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.2 Optical Center . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.3 Handling Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3

1.4 Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.5 Electrical Isolation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

1.6 Mechanical Files. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2 . PCB Design Guidelines for the LUXEON Emitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2.1 PCB Footprint and Land Pattern . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4

2.2 Surface Finishing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.3 Minimum Spacing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

2.4 PCB Substrate Selection and Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5

3 . Thermal Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

4 . Thermal Measurement Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7

5 . Assembly Process Guidelines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

5.1 Stencil Design. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

5.2 Solder Paste . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

5.3 Solder Reflow Profile. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8

5.4 Pick and Place . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9

5.5 Electrostatic Discharge Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

5.6 JEDEC Moisture Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

6 . Environmental Corrosion Testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10

7 . Packaging Considerations — Chemical Compatibility . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

1.4 Cleaning

The LUXEON emitter should not be exposed to dust and debris. Excessive dust and debris may cause a drastic decrease

in optical output. In the event that a LUXEON emitter requires cleaning, first try a gentle swabbing using a lint-free swab.

If needed, a lint-free swab and isopropyl alcohol (IPA) can be used to gently remove dirt from the silicone coating. Do not

use other solvents as they may adversely react with the package of the LUXEON emitter. For more information regarding

chemical compatibility, see Section 6.

1.5 Electrical Isolation

The LUXEON emitter contains two electrode pads on the package. It is important to keep sufficient distance between the

LUXEON emitter package and any other objects or neighboring LUXEON emitters to prevent any accidental shorts.

In order to avoid any electrical shocks, flashover and/or damage to the LUXEON emitter, each design needs to comply with

the appropriate standards of safety and isolation distances, known as clearance and creepage distances, respectively (e.g.

IEC60950, clause 2.10.4).

1.6 Mechanical Files

Mechanical files for the LUXEON emitter are available on the Lumileds website at

www.lumileds.com.

2. PCB Design Guidelines for the LUXEON Emitter

The LUXEON emitter is designed to be soldered onto a Printed Circuit Board (PCB). To ensure optimal operation, the PCB

should be designed to minimize the overall thermal resistance between the LED package and the heatsink.

2.1 PCB Footprint and Land Pattern

The recommended PCB footprint design for the LUXEON emitter is shown in Figure 3. In order to ensure proper heat

dissipation from the emitter electrodes to the PCB, it is best to extend the top copper layer of the PCB beyond the

perimeter of the LUXEON emitter (see 2.4).

2.50

Package outline

1.00

0.15

Solder mask

Stencil

Top copper

0.50

Package geometric center

0.90

2.40

Figure 3. Recommended PCB footprint design for the LUXEON emitter. Dimensions are in mm.

2.2 Surface Finishing

Lumileds recommends using a high temperature organic solderability preservative (OSP) or electroless nickel immersion

gold (ENIG) plating on the exposed copper pads.

2.3 Minimum Spacing

Lumileds recommends a minimum edge to edge spacing between LUXEON emitters of 0.5 mm. Placing multiple LUXEON

emitters too close to each other may adversely impact the ability of the PCB to dissipate the heat from the emitters.

2.4 PCB Substrate Selection and Design

Table 1 provides a summary of various relevant performance characteristics of common PCB substrates to aid material

selection. Specific PCB design considerations for each substrate material are summarized below.

Table 1: General PCB substrate characteristics for consideration when designing a PCB for LUXEON HR30 emitter.

FR-4/CEM-3

Cost

PCB thermal conductivity performance

LED assembly packing density (thermal

resistance consideration)

Dielectric withstand voltage (top copper

to bottom of substrate)

Low to medium

Low to high (FR4 with filled and capped

vias but with increase cost)

Generally suitable for low density

application with a large spacing between

LEDs and/or low operating currents

Extremely high (>20kV/mm)

Medium

High

Suitable for high density application with

close spacing between emitters

Depends on dielectric material thickness

and its property. Typically 4kV for 100um

thick.

MCPCB

Metal Core PCB

The most common MCPCB construction consists of the following layers (Figure 4):

• A metal substrate, typically aluminum.

• Epoxy dielectric layer. This is the most important layer in the MCPCB construction as it affects the thermal

performance and electrical breakdown strength. The typical thermal conductivity of the dielectric layer on a MCPCB

is around 2Wm

-1

. A higher value is better for good thermal performance. A thinner dielectric layer is better for

thermal performance but can negatively impact the ability of the MCPCB to withstand electrical insulation test to meet

minimum electrical safety standards as required in certain lighting markets. The typical dielectric thickness layer is

about 100µm.

• Top copper layer. A thicker copper layer improves heat spreading into the PCB but may pose challenges for PCB

manufacturers when fabricating narrow traces or spaces. A thickness of 1oz (35µm) or 2oz (70µm) is common. For

optimum thermal performance on both 1oz and 2oz copper design, the copper area should extend at least 4mm

away from the package outline.

• Use of white solder mask.

Figure 4. MCPCB typical cross section of the three-pad openings with aluminum substrate.

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