EQM08-4KC-F5AS101-00
(1/5)
1.Scope
This specification shall cover the characteristics of the shock sensor.
Preliminary
2.Kyocera’s Type Name
PMLE480W-R
3.Customer’s Type Name
4.Electrical Characteristics
Items
4-1 Primary Axis Inclined Angle
4-2 Capacitance
4-3 Charge Sensitivity
4-4 Insulation Resistance
4-5 Resonant Frequency
4-6 Non-linearity
4-7 Charge Sensitivity
Temperature Drift
<Measurement Condition>
The reference temperature shall be 25 ºC ±5ºC.
0
±
3degree
890pF
±
30%, at 1Vrms, 1kHz
0.608 pC/G
±
15%
under vibration at 200Hz, 2G
0.5Gohm minimum, at 10VDC after 1min.
19.5
±
3.5kHz
5% maximum, under vibration at 25G
Ta : 70℃ 7.7±3.0%
Ta : 0℃
-4.2±2.0%
under vibration at 200Hz, 2G
Specifications
5.Dimensions and Marking
4.8±0.2
Marking of Polarity
Characteristic Spec
0: Initial of Primary Axis Inclined Angle.
W: Specification
Manufacturing Day Cade :
2.0±0.2
Day
Cade
Day
Cade
Day
Cade
1
A
11
L
21
W
2
B
12
M
22
X
½
½
½
½
3
C
13
N
23
Y
4
D
14
P
24
Z
:
:
:
:
5
E
15
Q
25
a
6
F
16
R
26
b
7
G
17
S
27
c
8
H
18
T
28
d
9
J
19
U
29
e
10
K
20
V
30 31
f g
0W
1.7
Manufacturing Month Cade :
(0.8)
1.05±0.1
2010 Jan.
2011 Jan.
2012 Jan.
2013 Jan.
Dec.
Dec.
Dec.
Dec.
N
½
Z except "O"
a
½
m except "i"
n
½
z except "o"
A
½
M except "I"
0.6
3.7
Unit:mm
Fig.1
Note:These alphabets should be repeated
after Jan.2014.
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(2/5)
6.Emvironmental Characteristics
Items
6-1.High Temperature
Storage Test
Conditions
Preliminary
Keep in a chamber at 85
±2°C
for 1000 +12/-0 hours, and then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-2.Low Temperature
Storage Test
Keep in a chamber at –40
±2°C
for 1000 +12/-0 hours, and then keep at
room temperature for 1 hour. The characteristics of shock sensor shall meet
the specifications.
6-3.Moisture
Resistance Test
Keep in a chamber at 90 to 95 % R.H. and 60
±
2°C for 500 +12/-0 hours,
and then keep at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-4.Temperature
Cycling Test
Apply 100 thermal cycles with the following temperatures:
-
-
-
upper temperature 85°C for 20 minutes and transfer time 10 minutes
lower temperature -40°C for 20 minutes and transfer time 10 minutes
total cycle time is 1hour
and then left at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-5.Mechanical Shock
Test
After applying the acceleration at 29430m/sec
2
{3000G} in each of X, Y and
Z axis (each 3 times). The characteristics of shock sensor shall meet the
specifications.
6-6.Solderability Test
At first, being soaked in the Methanol solution containing Rosin for 5
seconds and then being dipped in a bath of Pb/Sn solder at 250
±
5°C for 4
±
0.5 seconds. The surface of the electrode terminal shall be soldered more
than 95%.
6-7.Resistance to
Soldering Heat Test
Pre-heat temperature is 150 to 180°C for 1 minute. High temperature is 250
±
5°C, over 200°C for 20 seconds max.(2times). Then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-8.Board Flex Test
After soldered on the circuit board specified as below, then the load which
cause 3 mm bend to the board is applied. The characteristics of shock
sensor shall meet the specifications. The shock sensor cause no defect in
the appearance. (Circuit Board: FR4, 100 x
50
20
40 x 1.6 )
F
R230
3.0mm
45
45
1.0
<Measurement Condition>
The reference temperature shall be 25°C±5°C.
CIRCUIT COMPONENT DIVISION
PIZ SECTION
EQM08-4KC-F5AS101-00
(3/5)
7. Recommended Land pattern
6.32
Preliminary
2.57
1.94
4.14
Unit: (mm)
Fig.2 Recommended Land pattern
2.2
8. Recommended Convection Reflow profile
300
Reflow
250
Temperature (
ºC
)
200
Preheat
Peak:245+/-5ºC
(Over 230ºC,30 to
than 40sec)
(Over 230℃,less
40sec)
150
100
50
0
150 to 180ºC
90 to 120sec
Over 200ºC
within 80 sec
Time(Sec)
Fig.3 Recommended Convection Reflow profile
9. Taping Specifications
9-1.CarrierTape
9-1-1.Dimensions
K
T
D
0
P
0
Marking of Polarity
P
2
E
Unit: (mm)
Sym
Dimensions
2.25
±
0.1
4.4
±
0.1
12.0 +0.3/-0.1
1.75
±
0.1
5.5± 0.05
Sym
bol
P
0
P
1
D
0
K
T
Dimensions
4.0
±
0.1
4.0
±
0.1
1.5 +0.1/-0
1.25± 0.1
0.3
±
0.05
F
B
0
0
B
W
bol
A
0
B
0
T
2
A
0
P
1
D
1
W
E
F
Pulling Direction
Fig.4 Emboss Carrier Tape Dimensions
CIRCUIT COMPONENT DIVISION
PIZ SECTION
Embedded System
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