(1/5)
1.Scope
This specification shall cover the characteristics of the shock sensor.
Preliminary
2.Kyocera’s Type Name
PSLE382E-R44
3.Customer’s Type Name
4.Electrical Characteristics
Items
4-1 Primary Axis Inclined Angle
4-2 Capacitance
4-3 Charge Sensitivity
4-4 Insulation Resistance
4-5 Resonant Frequency
4-6 Non-linearity
(Referense only)
Voltage Sensitivity
Specifications
25± 3degree
340
±
160pF, at 1Vrms, 1kHz
0.09
±
0.035 pC/G , under vibration at 200Hz, 2G
0.5Gohm minimum, at 10VDC after 1min.
44
±
9kHz
5% maximum, under vibration at 25G
0.265mV/G ,under vibration at 200Hz, 2G
<Measurement Condition>
The reference temperature shall be 25 ºC ±5ºC.
5.Dimensions and Marking
Marking of Polarity
Characteristic Spec
1.7
２Ｓ
2E
Ｓ
2: Initial of Primary Axis Inclined Angle.
2.0±0.2
E: Electrical Characteristics
3.7
EIAJ Date Code
4.1±0.2
2008
2009
2010
2011
Jan.
Jan.
Jan.
Jan.
~
~
~
~
Dec.
Dec.
Dec.
Dec.
: n~z except “o”
: A~M except “I”
: N~Z except “O”
: a~m except “i”
Note: These alphabet should be repeated after
1.05±0.1
Jan.2012.
Fig.1
Unit:mm
CIRCUIT COMPONENT DIVISION
PIZ SECTION
(2/5)
6.Environmental Characteristics
Items
6-1.High Temperature
Storage Test
Preliminary
Conditions
Keep in a chamber at 85
±2°C
for 1000 +12/-0 hours, and then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-2.Low Temperature
Storage Test
Keep in a chamber at –40
±2°C
for 1000 +12/-0 hours, and then keep at
room temperature for 1 hour. The characteristics of shock sensor shall meet
the specifications.
6-3.Moisture
Resistance Test
Keep in a chamber at 90 to 95 % R.H. and 60
±
2°C for 500 +12/-0 hours,
and then keep at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-4.Temperature
Cycling Test
Apply 100 thermal cycles with the following temperatures:
-
-
-
upper temperature 85°C for 20 minutes and transfer time 10 minutes
lower temperature -40°C for 20 minutes and transfer time 10 minutes
total cycle time is 1hour
and then left at room temperature for 1 hour. The characteristics of shock
sensor shall meet the specifications.
6-5.Mechanical Shock
Test
After applying the acceleration at 29430m/sec
2
{3000G} in each of X, Y and
Z axis (each 3 times). The characteristics of shock sensor shall meet the
specifications.
6-6.Solderability Test
At first, being soaked in the Methanol solution containing Rosin for 5
seconds and then being dipped in a bath of Pb/Sn solder at 250
±
5°C for 4
±
0.5 seconds. The surface of the electrode terminal shall be soldered more
than 95%.
6-7.Resistance to
Soldering Heat Test
Pre-heat temperature is 150 to 180°C for 1 minute. High temperature is 250
±
5°C, over 200°C for 20 seconds max.(2times). Then keep at room
temperature for 1 hour. The characteristics of shock sensor shall meet the
specifications.
6-8.Board Flex Test
After soldered on the circuit board specified as below, then the load which
cause 3 mm bend to the board is applied. The characteristics of shock
sensor shall meet the specifications. The shock sensor cause no defect in
the appearance. (Circuit Board: FR4, 100 x
50
20
40 x 1.6 )
F
R230
3.0mm
45
45
1.0
<Measurement Condition>
The reference temperature shall be 25°C±5°C.
CIRCUIT COMPONENT DIVISION
PIZ SECTION
(3/5)
7. Recommended Land pattern
Preliminary
.
２
½
Ｓ
1.4
4.8
1.4
Unit: (mm)
2.0
Fig.2 Recommended Land pattern
8. Recommended Convection Reflow profile
300
Reflow
250
Temperature (
ºC
)
200
Preheat
Peak:245+/-5ºC
(Over 230ºC,30 to
than 40sec)
(Over 230℃,less
40sec)
150
100
50
0
150 to 180ºC
90 to 120sec
Over 200ºC
within 80 sec
Time(Sec)
Fig.3 Recommended Convection Reflow profile
9. Taping Specifications
9-1.CarrierTape
9-1-1.Dimensions
K
T
D
0
P
0
Marking of Polarity
P
2
E
Unit: (mm)
Sym
Dimensions
2.25
±
0.1
4.4
±
0.1
12.0 +0.3/-0.1
1.75
±
0.1
5.5± 0.05
Sym
bol
P
0
P
1
D
0
K
T
Dimensions
4.0
±
0.1
4.0
±
0.1
1.5 +0.1/-0
1.25± 0.1
0.3
±
0.05
F
B
0
0
B
W
bol
A
0
B
0
T
2
A
0
P
1
D
1
W
E
F
Pulling Direction
Fig.4 Emboss Carrier Tape Dimensions
CIRCUIT COMPONENT DIVISION
PIZ SECTION
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