F-219
ERF8–020–05.0–S–DV–TR
ERF8–040–05.0–S–DV–TR
ERF8–060–05.0–L–DV–TR
(0.80 mm) .0315"
ERF8 SERIES
RUGGED HIGH-SPEED SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?ERF8
Insulator Material:
Black LCP
Contact Material:
BeCu
Plating:
Au or Sn over 50 µ" (1.27 µm) Ni
Current Rating:
2.2 A per pin
(2 pins powered)
Operating Temp Range:
-55 °C to + 125 °C
Voltage Rating:
225 VAC / 318 VDC
RoHS Compliant:
Yes
Board Mates:
ERM8
Cable Mates:
ERCD, ERDP
Robust Edge Rate
®
contact improves
“Zippered”
unmating
10 to 200 I/Os
(1.50 mm)
.059"
NOMINAL
WIPE
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
POWER/SIGNAL
APPLICATION
MATED HEIGHT*
ERF8
LEAD
STYLE
ERM8 LEAD STYLE
–02.0
–05.0
(10.00)
.394
(12.00)
.472
(14.00)
.551
–08.0
(13.00)
.512
(15.00)
.591
(17.00)
.669
–09.0
(14.00)
.551
(16.00)
.629
(18.00)
.709
PROCESSING
Lead–Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (005-030)
(0.12 mm) .005" max (040-060)*
(0.15 mm) .006" max (070-100)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
–05.0
(7.00)
.276
(9.00)
–07.0
.354
–09.0
(11.00)
.453
HIGH-SPEED CHANNEL PERFORMANCE
ERM8/ERF8 @ 7 mm
Mated Stack Height
Rating based on Samtec
reference channel.
For full SI performance data visit
Samtec.com or contact SIG@samtec.com
*Processing conditions will affect mated height.
Compatible with
UMPT/UMPS for flexible
two-piece power/signal solutions
ERF8
NO. OF POSITIONS
PER ROW
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
LEAD
STYLE
PLATING
OPTION
DV
OTHER
OPTION
TR
RECOGNITIONS
For complete scope of
recognitions see
www.samtec.com/quality
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Mezzanine stack heights
–005, –010, –011,
–013, –020, –025,
–030, –035 –040, –049,
–050, –060, –070, –075
–100
(Available with –05.0 lead style only)
= 10 µ"
(0.25 µm)
Gold on
contact,
Matte Tin
on tail
–L
= Latching
(Lead Style –05.0 only)
(Not available with
–EGP or –EGPS options)
–L
A
–05.0
(5.10)
.200
(7.00)
–07.0
.276
–09.0
(9.00)
.354
APPLICATIONS
STANDARD
NEXUS5001
™
.org
POWER.org
™
ARM/HSSTP
NEXUS5001 .org
POWER.org
™
™
= 30 µ"
(0.76 µm)
Gold on
contact,
Matte Tin
on tail
–S
= Extended Guide Post
(Lead Style –07.0 only)
(Not available with
–L & –EGPS option)
–EGP
= Tape &
Reel
Packaging
(Not
available
with 100
positions)
–TR
POS.
10
11
17
20
23
25
35
40
PART NOs.
ASP-148421-01
ASP-137969-01
ASP-137973-01
ASP-130367-01
ASP-130368-01
ASP-148422-01
ASP-135029-01
ASP-148424-01
SERIES
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
ERF8-DV
No. of Positions x
(0.80) .0315 + (6.00) .236
–L & –EGP = No. of Positions x
(0.80) .0315 + (7.50) .295
–EGPS = No. of Positions x
(0.80) .0315 + (10.00) .394
01
(3.35)
.132
02
= Extended Guide Post Shield
(Lead Style –07.0 only)
(Not available with
–L & –EGP option)
(–010, –020, –025, –030 only)
–EGPS
(7.25)
.285
(5.60)
.220
–EGP
= (6.00 mm) .236" DIA
Polyimide Film
Pick & Place Pad
–K
(5.30)
.209
(3.35)
.132
A
(1.32)
.052
DIA
(0.80)
.0315
(5.40)
.213
(2.50)
.098
(1.07)
.042
(0.64)
.025
–L
(6.20)
.244
Notes:
Patented
Some lengths, styles and
options are non-standard,
non-returnable.
(0.94)
.037
(7.20)
.283
–EGPS
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
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