EEWORLDEEWORLDEEWORLD

Part Number

Search

TSM-115-01-FM-DV

Description
.025 SQ. TERMINAL STRIPS
CategoryThe connector   
File Size780KB,2 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Download Datasheet Parametric View All

TSM-115-01-FM-DV Overview

.025 SQ. TERMINAL STRIPS

TSM-115-01-FM-DV Parametric

Parameter NameAttribute value
Connector typeConnector
Contact typeMale pin
Spacing - Mating0.100"(2.54mm)
Number of pins30
Number of rows2
Line spacing - patching0.100"(2.54mm)
Number of pins loadedall
styleBoard to Board or Cable
shieldUncovered
Installation typesurface mount
Terminationwelding
Fastening typepush-pull
Contact Length - Mating0.230"(5.84mm)
Contact length - terminal-
Overall contact length-
Insulation height0.100"(2.54mm)
Contact shapeSquare
Contact surface treatment - matinggold
Contact Surface Treatment Thickness - Mating3.00µin(0.076µm)
Contact Surface Preparation - Columntin
Contact materialPhosphor bronze
Insulation MaterialsLiquid Crystal Polymer (LCP)
characteristic-
Operating temperature-55°C ~ 125°C
Intrusion protection-
Material flammability ratingUL94 V-0
Insulation colorblack
Rated current-
Rated voltage-
Joint stack height-
Contact Surface Treatment Thickness - Column-
application-
F-219
TSM–116–02–S–DV–LC
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 30 µ" GOLD
TSM–121–01–T–SV
(2.54 mm) .100"
SMT .025" SQ POST HEADER
Board Mates:
SSW, SSQ, SSM, BSW, ESW,
ESQ, BCS, SLW, CES, HLE
Cable Mates:
IDSS, IDSD
TSM
1
NO. PINS
PER ROW
LEAD
STYLE
PLATING
OPTION
ROW
OPTION
SPECIFICATIONS
For complete specifications
and recommended PCB layouts
see www.samtec.com?TSM
Insulator Material:
Black Liquid Crystal Polymer
Terminal Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Operating Temp Range:
-55 °C to +105 °C with Tin;
-55 °C to +125 °C with Gold
Voltage Rating:
475 VAC -SV/-DV mated with
BCS or SSM
RoHS Compliant:
Yes
MATES
TSM/SSW
TSM/SSM
TSM/HLE
CURRENT RATING
(PER PIN)
4.7 A
5.4 A
4.1 A
02
thru
36
–01
= .230" (5.84 mm) Post Height IDSS, IDSD)
(Mates with SSW, BCS, SSM,
Post
Height
= Gold flash on post,
Matte Tin on tail
–F
–L
= 10 µ" (0.25 µm) Gold on post,
Matte Tin on tail
.320" (8.13
–02
= (Mates withmm) Post Height
SSM -DH)
.420" (10.67
Height
–03
= (For Bottom mm) PostPass Through)
Mount &
.120" (3.05
–04
= (Mates withmm) Post Height
SLW, CES, HLE)
= 30 µ" (0.76 µm) Gold on post,
Matte Tin on tail
–S
–T
= Matte Tin
= Single Row Vertical Pin
–SV
2 PINS POWERED
36
(2.54) .100 x No. of positions
(2.54)
.100
PROCESSING
Lead–Free Solderable:
Yes
-DH/-SH Lead Coplanarity:
(0.15 mm) .006" max (02-36)*
-DV/-SV Lead Coplanarity:
(0.10 mm) .004" max (02-05)
(0.13 mm) .005" max (06-10)*
(0.15 mm) .006" max (11-36)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
(2.54)
.100
01
(0.64)
.025
SQ
(1.14)
.045
REF
Post
Height
(2.54)
.100
(3.81)
.150
APPLICATIONS
SSM
TSM
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
HORIZONTAL
(1.40)
.055
(1.78)
.070
= Single Row
Horizontal Pin
–SH
(2.54) .100 x No. of positions
36
01
(3.05)
.120
FILE NO. E111594
ALSO AVAILABLE
(MOQ Required)
• Edge Mount and
Locking Clips for –SV
• Solder Locks for –DH and
Shrouds for –DV
• Other platings
(1.58)
.062
DIA
(2)
Optional Alignment Pin (–A)
(No. of positions x (2.54) .100) – (5.08) .200
(0.64)
.025
SQ
Post
Height
(2.54)
.100
(2.03)
.080
Note:
Some lengths,
styles and options are
non-standard, non-returnable.
–01= (4.57) .180
–02, –03, –04 = (4.82) .190
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
How to use the three-phase sampling circuit
I used a simple single-chip microcomputer to detect the three phases ABC of the three-phase three-wire and the three relays to synchronously control the output A1B1C1. In order to prevent the relay fr...
涉雨前行 Analog electronics
MFC program development error under WinCE6.0
Dear heroes: I customized WinCE6.0 platform, exported and installed SDK, used VS2005 to create an MFC device application for an intelligent device, the simplest one, based on dialog box, did not make ...
lxcqh2008 Embedded System
Ask a newbie question, MSP430F2013 and CC1101EMK433
I am working on a project recently and want to use MSP430F2013 to communicate with CC1101EMK433 module via SPI, but the FLASH of 2013 is only 2KB and the RAM is only 128B.I would like to ask all the e...
sphinz Microcontroller MCU
【Video Sharing】TMS320C64x Online Course 7——CSL3.x
Introduction : TMS320C64x+ Network Course 6 - CSL3.x, mainly introduces the use of CSL3, the gradual upgrade of CSL2-CSL3-PSP, the hierarchy of CSL, the structure and operation of peripheral registers...
德州仪器_视频 DSP and ARM Processors
【Challenge Energia-ID0103A】Energia Decryption-3
1.5 Online Energia If you are still struggling with which operating system to install, you can use another development tool, the online Energia developed by Cloud. First log in to dev.ti.comThen log i...
北方 TI Technology Forum
Friendly Arm MINI2440 User Manual
[b]Contents[/b] Chapter 1 Introduction to MINI2440 Development Board...................................................................................- 11 - 1.1 Introduction to MINI2440 Development B...
clark Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1079  867  2313  2781  354  22  18  47  56  8 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号