Diode Terminator
Electrical Characteristics
DN5
SERIES
Diode Terminator
Low parasitics, fast reverse recovery time, and a
low forward voltage characteristic make KOA’s DN5
Schottky diode network an excellent bus terminator
for very high speed I/O. This network offers the
designer a single package solution to address
overshoot and undershoot problems, ringing, and
bus reflections that are common to high speed I/O.
Today these networks are commonly used to
optimize bus performance in high end computers,
external data storage peripherals, LAN networks,
and many other applications where high transfer
rates are necessary.
Features
Supply Voltage
(VDD) . . . . . . . . . . . . .
-.3V to +7V
Channel Clamp
Current . . . . . . . . . . . . .
±50mA
Package Power
Rating @ 70°C . . . . . . .
1W
Operating
Temperature . . . . . . . . . .
0°C to +70°C
Storage Temperature . . . .
-65°C to +150°C
Forward Voltage
(to VDD @ 50ma). . . . .
0.55V to 0.90V
Forward Voltage
(to GND @ 50ma). . . . .
0.55V to 0.85V
Reverse Recovery
Time (@ 50ma) . . . . . . .
<400ps
Channel Leakage
(0<Vin<VDD) . . . . . . .
0.1µA to 5µA
Input Capacitance
(If = 1MHz,
Vin = 2.5v) . . . . . . . . . .
5pF
ESD Protection . . . . . . .
4KV min.
Circuit Schematic
VDD
24
VDD
GND
13
G
s
s
s
s
s
Negligible reverse recovery time
Low capacitance
Low forward voltage drop
18-channel terminator in a single package
Resolved bus impedance mismatch
1
GND
GND
12
VDD
Available Pin Configurations
Applications
s
s
s
n
= Number of Pins (24)
See physical configurations on page G-3
for available pin/package configurations.
Termination of data/control signals @
≥
66 MHz
Dynamic RAM bus termination
RISC architecture
Bolivar Drive, P.O. Box 547, Bradford, PA 16701 USA
s
814-362-5536
s
Fax: 814-362-8883
s
www.koaspeer.com
G-2
DN5 Series
Physical Configurations
Mechanical Characteristics
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Resistance
Body Style
. . . . . . . . . . . . . . . . . . . . .
Pin Count
QSOP . . . . . . . . . . . . . . . . . . . . . 24
TSSOP . . . . . . . . . . . . . . . . . . . . 24
Die Pack * . . . . . . . . . . . . . . . . . . 24
Part Marking
Manufacturer's
Trademark
Model
Item.
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Material
Substrate . . . . . . . . . . . . . . . . . . . . . . . Silicon
Resistor material. . . . . . . . . . . . . . . . . . . . TaN
Passivation . . . . . . . . . . . . . . . . . . . . . . Glass
9909
DN5 Q24
Date Code
Body Style/
Pin Count
Pin 1 Indicator
(Molded Indent)
* See page J-6 for preliminary Die Pack specifications.
Ordering Information
DN5
Circuit
Type
Q
Body
Style
Q = QSOP
T = TSSOP
6 = 0.6 mm
Die Pack
5 = 0.5 mm
Die Pack
4 = 0.4 mm
Die Pack
24
Number
of Pins
24
See
above
table
B
Packaging
B = 13"
Embossed
Plastic Tape
& Reel, see
Packaging
Section for
details
G
Bolivar Drive, P.O. Box 547, Bradford, PA 16701 USA
s
814-362-5536
s
Fax: 814-362-8883
s
www.koaspeer.com
G-3