EXPOSED PAD (PIN 11) PCB GROUND CONNECTION OPTIONAL
T
JMAX
= 150°C,
θ
JA
= 43°C/W
MS10 PACKAGE
10-LEAD PLASTIC MSOP
T
JMAX
= 150°C,
θ
JA
= 160°C/W
ORDER INFORMATION
LEAD FREE FINISH
LTC4368CDD-1#PBF
LTC4368CDD-2#PBF
LTC4368IDD-1#PBF
LTC4368IDD-2#PBF
LTC4368HDD-1#PBF
LTC4368HDD-2#PBF
LTC4368CMS-1#PBF
LTC4368CMS-2#PBF
LTC4368IMS-1#PBF
LTC4368IMS-2#PBF
LTC4368HMS-1#PBF
LTC4368HMS-2#PBF
TAPE AND REEL
LTC4368CDD-1#TRPBF
LTC4368CDD-2#TRPBF
LTC4368IDD-1#TRPBF
LTC4368IDD-2#TRPBF
LTC4368HDD-1#TRPBF
LTC4368HDD-2#TRPBF
LTC4368CMS-1#TRPBF
LTC4368CMS-2#TRPBF
LTC4368IMS-1#TRPBF
LTC4368IMS-2#TRPBF
LTC4368HMS-1#TRPBF
LTC4368HMS-2#TRPBF
PART MARKING*
LGTH
LGTK
LGTH
LGTK
LGTH
LGTK
LTGTG
LTGTJ
LTGTG
LTGTJ
LTGTG
LTGTJ
PACKAGE DESCRIPTION
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
10-Lead (3mm × 3mm) Plastic DFN
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
10-Lead Plastic MSOP
TEMPERATURE RANGE
0°C to 70°C
0°C to 70°C
–40°C to 85°C
–40°C to 85°C
–40°C to 125°C
–40°C to 125°C
0°C to 70°C
0°C to 70°C
–40°C to 85°C
–40°C to 85°C
–40°C to 125°C
–40°C to 125°C
*Temperature grades are identified by a label on the shipping container. Consult ADI Marketing for parts specified with wider operating temperature ranges.
Tape and reel specifications.
Some packages are available in 500 unit reels through designated sales channels with #TRMPBF suffix.
2
Rev A
For more information
www.analog.com
LTC4368
ELECTRICAL CHARACTERISTICS
SYMBOL
V
IN
V
IN(UVLO)
I
VIN
I
VIN(R)
PARAMETER
Input Voltage: Operating Range
Protection Range
Input Supply Undervoltage Lockout
Input Supply Current: On
Off
Reverse Input Supply Current
V
IN
Rising
SHDN = 2.5V,
SENSE = V
OUT
= V
IN
SHDN = 0V, SENSE = V
OUT
= V
IN
V
IN
= –40V, SENSE = V
OUT
= 0V
V
OUT
Rising, V
OUT
– SENSE = 100mV, V
IN
= 12V
V
IN
= 12V, V
OUT
:0V→12V, V
OUT
– SENSE = 100mV
SHDN = 2.5V,
SENSE = V
OUT
= V
IN
SHDN = 0V,
SENSE = V
OUT
= V
IN
V
IN
= –40V, SENSE = V
OUT
= 0V
SHDN = 2.5V,
SENSE = V
OUT
= V
IN
SHDN = 0V,
SENSE = V
OUT
= V
IN
V
IN
= –40V, SENSE = V
OUT
= 0V
V
OUT
= V
IN
V
IN
= 12V, V
OUT
= 0.5V
V
IN
= 12V, V
OUT
= 0V
LTC4368-1
LTC4368-2
V
OUT
= V
IN
V
OUT
= V
IN
V
IN
, V
OUT
, SENSE
l
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 2.5V to 60V, unless otherwise noted (Note 2). UV = 2.5V, OV = 0V,
SHDN = 2.5V,
SENSE = V
OUT
= V
IN
unless otherwise specified.
CONDITIONS
MIN
2.5
–40
1.8
2.2
30
5
–1.5
1.8
40
2.2
120
50
3
20
1.2
0.1
1
40
40
30
–42
–1
75
20
3
7.2
10
–20
40
30
150
22
3
50
50
50
–50
–3
100
50
4
8.7
11
–35
90
60
2
275
32
8
TYP
MAX
60
100
2.4
100
25
–2.5
2.4
280
125
20
50
2
2
10
60
60
70
–58
–5
125
125
5.5
10.8
13.1
–60
160
90
6
575
45
18
UNITS
V
V
V
µA
µA
mA
V
µs
µA
µA
µA
µA
µA
µA
mV
mV
mV
mV
mV
mV
mV
V
V
V
µA
µA
mA
µs
µs
ms
µs
V
OUT(UVLO)
V
OUT
Undervoltage Lockout
t
VOUT(UVLO)
V
OUT
Undervoltage Lockout Delay
I
VOUT
V
OUT
Input Current:
On
Off
Reverse
l
l
l
l
l
Current Sense
I
SENSE
ΔV
SENSE,F
ΔV
SENSE,R
ΔV
RR
GATE
ΔV
GATE
I
GATE(UP)
I
GATE(FAST)
t
D(FAST)
t
D(SLOW)
t
D(ON)
t
p(GATE)
Gate Drive (GATE – V
OUT
)
Gate Pull Up Current
Gate Fast Pull Down Current
Gate Fast Turn Off Delay
Gate Slow Turn Off Delay
Gate Turn-On Delay Time
Overcurrent Fault Propagation Delay
V
IN
= 2.5V, I
GATE
= 0µA, –1µA
V
IN
= 5V, I
GATE
= 0µA, –1µA
V
IN
= 12V to 60V, I
GATE
= 0µA, –1µA
GATE = 15V, V
IN
= 12V
GATE = 20V, V
IN
= 12V
GATE = 20V, SENSE = V
IN
= 12V
C
GATE
= 2.2nF: UV, OV Fault
C
GATE
= 2.2nF,
SHDN
Falling, V
IN
= 12V
V
IN
= 12V, Power Good to ΔV
GATE
> 0V
C
GATE
= 2.2nF, Overcurrent Fault to ΔV
GATE
= 0V
SENSE – V
OUT
: 0 to +100mV, or
SENSE – V
OUT
: 0 to –100mV (LTC4368-1)
SENSE – V
OUT
: 0 to –10mV (LTC4368-2)
l
l
l
l
l
l
l
l
SENSE Input Current: On
Off
Reverse
Overcurrent Fault Threshold, Forward
(SENSE – V
OUT
)
Overcurrent Fault Threshold, Reverse
(SENSE – V
OUT
)
Reverse Overcurrent Re-Enable
Turn-On Threshold (V
IN
– V
OUT
)
l
l
l
l
l
l
l
l
l
l
V
IN
= SENSE = 6V to 60V
V
IN
= SENSE = 2.5V to <6V
I
GATE(SLOW)
Gate Slow Pull Down Current
l
l
For more information
www.analog.com
3
Rev A
LTC4368
ELECTRICAL CHARACTERISTICS
SYMBOL
UV, OV
V
UV
V
OV
V
UVHYST
V
OVHYST
I
LEAK
t
FAULT
SHDN
V
SHDN
I
SHDN
t
START
t
SHDN(F)
t
LOWPWR
FAULT
V
OL
I
FAULT
RETRY
V
RETRY
I
RETRY
t
CLEAR
t
RETRY
Configuration Threshold for GATE
Latch-Off
Output Current for RETRY Timer
Minimum
SHDN
Pulse to Clear Forward
Overcurrent RETRY Latch
Forward Overcurrent Cool-Down Delay
RETRY Falling to ΔI
RETRY
> 2µA
V
IN
= 12V
RETRY = 2V, V
IN
= 12V
RETRY = 0V, V
IN
= 12V
RETRY = 0V, V
IN
= 12V
FAULT
Asserted to
FAULT
Released, C
RETRY
= 22nF
SENSE = V
OUT
= V
IN
= 12V
l
l
l
l
l
The
l
denotes the specifications which apply over the full operating
temperature range, otherwise specifications are at T
A
= 25°C. V
IN
= 2.5V to 60V, unless otherwise noted (Note 2). UV = 2.5V, OV = 0V,
SHDN = 2.5V,
SENSE = V
OUT
= V
IN
unless otherwise specified.
PARAMETER
UV Input Threshold Voltage
OV Input Threshold Voltage
UV Input Hysteresis
OV Input Hysteresis
UV, OV Leakage Current
UV, OV Fault Propagation Delay
SHDN
Input Threshold
SHDN
Input Current
Delay Coming Out of Shutdown Mode
SHDN
To
FAULT
Asserted
Delay From Turn Off to Low Power
Operation
FAULT
Output Voltage Low
FAULT
Leakage Current
V = 0.5V, V
IN
= 60V
Overdrive = 50mV, V
IN
= 12V
SHDN
Falling
SHDN = 10V,
V
IN
= 60V
SHDN
Rising to
FAULT,
V
IN
= 12V
V
IN
= 12V
V
IN
= 12V
CONDITIONS
UV Falling
OV Rising
l
l
l
l
l
l
MIN
492.5
492.5
20
20
TYP
500
500
25
25
1
MAX
507.5
507.5
32
32
±10
2
1.2
±15
1400
3
48
UNITS
mV
mV
mV
mV
nA
µs
V
nA
µs
µs
ms
l
l
l
l
l
0.4
400
20
0.75
800
1.5
32
I
FAULT
= 500µA, V
IN
= 12V
FAULT = 5V,
V
IN
= 60V
l
l
0.15
0.4
±20
V
nA
V
µA
µA
µs
0.5
2.5
–10
15
80
1
3.5
–17
1.5
4.5
–25
120
150
ms
Note 1.
Stresses beyond those listed under Absolute Maximum Ratings
may cause permanent damage to the device. Exposure to any Absolute
Maximum Rating condition for extended periods may affect device
reliability and lifetime.
Note 2.
All currents into pins are positive; all voltages are referenced to
GND unless otherwise noted.
Note 3.
These pins can be tied to voltages below –0.3V through a resistor
My major is mechanics, and unfortunately I drew a topic about single-chip microcomputers, "Design of coil vehicle detection and display system based on single-chip microcomputer". I had been busy look...
Please give me some advice. I am designing video processing. The signal source is DVD signal, satellite signal decoder or DVB-C set-top box output signal. Since it is based on H.264 codec compression,...
[font=微软雅黑][size=3][color=#000000] Fluke's Master's Choice expert-level thermal imager is about to be launched. [/color][/size][/font][font=微软雅黑][size=3]Usually, we are most concerned about the three ...
I would like to ask all my colleagues in WinCE development: Is there any successful application that supports WinCE5.0 and uses CF cards, MMC or SD cards as large as 64G?...
Reflow soldering, a common soldering method in modern electronics manufacturing, primarily melts solder paste and pads to form solder joints. With technological advancements, soldering equipment ha...[Details]
Is pure electric vehicles a false proposition for long-distance driving? At least from my personal perspective, based on current technological and infrastructure standards, I believe so. Below, I'l...[Details]
Topics: Bring Your Own Device (BYOD) trends; the impact of using employees' own mobile devices to control access to work facilities and equipment on information security; and ways to securely imple...[Details]
In recent years, with the application of the IEC61850 standard and the development and deployment of optoelectronic transformers, the concept of digital substations has been put into practical use ...[Details]
In mobile technology, sensors are the primary input for measured signals and form a component of a sensor system. They include sensitive and transducer elements connected to carriers and circuits. ...[Details]
For healthcare professionals, accurate diagnosis and treatment are crucial for a clear picture of a person's health. However, healthcare professionals often rely on tests at medical facilities, cli...[Details]
1 Introduction
In the mid-1960s, American scientist Maas conducted extensive experimental research on the charging process of open-cell batteries and proposed an acceptable charging curve for ...[Details]
Gross profit margin jumped from 13.6% in the first half of last year to 25.9%, almost doubling year-on-year.
On August 21, RoboSense released its interim performance report, in which the...[Details]
On August 22, South Korean media Nate reported on the 20th local time that Samsung Electronics is introducing Hyper Cell technology into its most advanced 2nm process technology, striving to improv...[Details]
Overview
As handheld voice communication devices become more and more popular, they are increasingly used in noisy environments, such as airports, busy roads, crowded bars, etc. In such noisy ...[Details]
Through AI connection technology supported by Qualcomm X85 5G modem and RF and Qualcomm FastConnect 7900 mobile connection system, seamless switching can be achieved between cellular net...[Details]
PowiGaN achieves 95% efficiency at both light and full loads, meeting critical operational and safety requirements.
DARWIN, Australia and SAN JOSE, Calif.,
August 22, 2025 – Powe...[Details]
Linear motor modules have become the "sweet spot" in various fields due to their advantages such as long stroke, fast speed, high precision, smooth operation and long life. Different models of line...[Details]
The MCX E series is the most reliability- and safety-focused series in NXP's extensive MCX product portfolio.
With the launch of this series, NXP has further enriched its 5V-compatible MCU pr...[Details]
Intel®
Xeon®
6
-
core processors now support the new Amazon EC2 R8i and R8i-flex instances on Amazon Web Services (AWS).
These new instances offer superior performance and fast...[Details]
Sensor
京公网安备 11010802033920号
EEWORLD
