PIC24FJ256GB410-I/PT datasheet, PDF

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PIC24FJ256GB410-I/PT: DescriptionSecure MCU 16bit PIC24 PIC Harvard 256KB Flash 2.5V/3.3V 100-Pin TQFP Tray; CategoryThe embedded processor and controller Microcontrollers and processors; File Size27MB，558 Pages; ManufacturerMicrochip; Websitehttps://www.microchip.com; Environmental Compliance

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PIC24FJ256GB410-I/PT Overview

Secure MCU 16bit PIC24 PIC Harvard 256KB Flash 2.5V/3.3V 100-Pin TQFP Tray

PIC24FJ256GB410-I/PT Parametric

Parameter Name	Attribute value
EU restricts the use of certain hazardous substances	Compliant
ECCN (US)	5A002.a.1
Part Status	Active
HTS	8542.31.00.01
Family Name	PIC24
Instruction Set Architecture	Harvard
Device Core	PIC
Core Architecture	PIC
Maximum CPU Frequency (MHz)	32
Maximum Clock Rate (MHz)	32
Data Bus Width (bit)	16
Program Memory Type	Flash
Program Memory Size	256KB
RAM Size	16KB
Minimum Endurance (Cycles)	20000
Data Retention (Year)	20
Maximum Expanded Memory Size	12MB
Programmability	Yes
Key Size	128bit@AES/192bit@AES/256bit@AES
Number of Keys	3@DES
Number of I/Os	84
No. of Timers	5
Timers Channels	31/15
PWM	6
Number of ADCs	Single
ADC Channels	24
ADC Resolution (bit)	12
Number of DACs	Single
DAC Resolution (bit)	10
LCD Segments	480
Interface Type	I2C/SPI/UART/USB
UART	6
USB	1
SPI	4
I2C	3
I2S	0
CAN	0
Ethernet	0
Watchdog	1
Analog Comparators	3
Parallel Master Port	No
Real Time Clock	Yes
Special Features	LCD Controller
Minimum Operating Supply Voltage (V)	2
Typical Operating Supply Voltage (V)	2.5\|3.3
Maximum Operating Supply Voltage (V)	3.6
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Packaging	Tray
Supplier Package	TQFP
Pin Count	100
Standard Package Name	QFP
Mounting	Surface Mount
Package Height	1
Package Length	12
Package Width	12
PCB changed	100
Lead Shape	Gull-wing

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PIC24FJ256GA412/GB412 FAMILY

16-Bit Flash Microcontrollers with Dual Partition Flash Memory,

XLP, LCD, Cryptographic Engine and USB On-The-Go

Extreme Low-Power Features

• Multiple Power Management Options for Extreme Power

Reduction:

- V

BAT

allows for lowest power consumption on backup

battery (with or without RTCC)

- Deep Sleep allows near total power-down with the ability to

wake-up on external triggers

- Sleep and Idle modes selectively shut down peripherals

and/or core for substantial power reduction and fast wake-up

- Doze mode allows CPU to run at a lower clock speed than

peripherals

• Alternate Clock modes allow On-the-Fly Switching to a Lower

Clock Speed for Selective Power Reduction

• Extreme Low-Power Current Consumption for Deep Sleep:

- WDT: 650 nA @ 2V typical

- RTCC: 650 nA @ 32 kHz, 2V typical

- Deep Sleep current, 60 nA typical

• 160

A/MHz

in Run mode

Dual Partition Flash with Live Update

Capability

• Capable of Holding Two Independent Software Applications,

including Bootloader

• Permits Simultaneous Programming of One Partition while

Executing Application Code from the Other

• Allows Run-Time Switching Between Active Partitions

Universal Serial Bus Features

(PIC24FJXXXGB4XX Only)

• USB v2.0 On-The-Go (OTG) Compliant

• Dual Role Capable – Can Act as Either Host or Peripheral

• Low-Speed (1.5 Mb/s) and Full-Speed (12 Mb/s) USB

Operation in Host mode

• Full-Speed USB Operation in Device mode

• High-Precision PLL for USB

• USB Device mode Operation from FRC Oscillator – No Crystal

Oscillator Required

• Supports up to 32 Endpoints (16 bidirectional):

- USB module can use any RAM locations on the device as

USB endpoint buffers

• On-Chip USB Transceiver with Interface for Off-Chip

USB Transceiver

• Supports Control, Interrupt, Isochronous and Bulk Transfers

• On-Chip Pull-up and Pull-Down Resistors

High-Performance CPU

• Modified Harvard Architecture

• Up to 16 MIPS Operation @ 32 MHz

• 8 MHz Internal Oscillator:

- 96 MHz PLL option

- Multiple clock divide options

- Run-time self-calibration capability for maintaining better

than ±0.20% accuracy

- Fast start-up

• 17-Bit x 17-Bit Single-Cycle Hardware Fractional/Integer Multiplier

• 32-Bit by 16-Bit Hardware Divider

• 16 x 16-Bit Working Register Array

• C Compiler Optimized Instruction Set Architecture

• Two Address Generation Units for Separate Read and Write

Addressing of Data Memory

Special Microcontroller Features

•

20,000 Erase/Write Cycle Endurance, Typical

Data Retention: 20 Years Minimum

Self-Programmable under Software Control

Supply Voltage Range of 2.0V to 3.6V

Two On-Chip Voltage Regulators (1.8V and 1.2V) for

Regular and Extreme Low-Power Operation

Programmable Reference Clock Output

In-Circuit Serial Programming™ (ICSP™) and

In-Circuit Emulation (ICE) via 2 Pins

JTAG Boundary Scan Support

Fail-Safe Clock Monitor (FSCM) Operation:

- Detects clock failure and switches to on-chip,

Low-Power RC (LPRC) Oscillator

Power-on Reset (POR), Power-up Timer (PWRT)

and Oscillator Start-up Timer (OST)

Separate Brown-out Reset (BOR) and Deep Sleep

Brown-out Reset (DSBOR) Circuits

Programmable High/Low-Voltage Detect (HLVD)

Flexible Watchdog Timer (WDT) with its Own

RC Oscillator for Reliable Operation

Standard and Ultra Low-Power Watchdog Timers (ULPW) for

Reliable Operation in Standard and Deep Sleep modes

Temperature Range: -40°C to +85°C

Cryptographic Engine

• Performs NIST Standard Encryption/Decryption

Operations without CPU Intervention

• AES Cipher Support for 128, 192 and 256-Bit Keys

• DES/3DES Cipher Support, with up to Three Unique Keys

for 3DES

• Supports ECB, CBC, OFB, CTR and CFB128 modes

• Programmatically Secure OTP Array for Key Storage

• True Random Number Generation

• Battery-Backed RAM Key Storage

•

Analog Features

• 10/12-Bit, up to 24-Channel Analog-to-Digital (A/D) Converter:

- Conversion rate of 500 ksps (10-bit), 200 kbps (12-bit)

- Auto-scan and threshold compare features

- Conversion available during Sleep

• One 10-Bit Digital-to-Analog Converter (DAC):

- 1 Msps update rate

• Three Rail-to-Rail, Enhanced Analog Comparators with

Programmable Input/Output Configuration

• Charge Time Measurement Unit (CTMU):

- Used for capacitive touch sensing, up to 24 channels

- Time measurement down to 100 ps resolution



2015-2016 Microchip Technology Inc.

Downloaded from

Arrow.com.

DS30010089D-page 1

PIC24FJ256GB410-I/PT Related Products

	PIC24FJ256GB410-I/PT	PIC24FJ256GB410T-I/PT
Description	Secure MCU 16bit PIC24 PIC Harvard 256KB Flash 2.5V/3.3V 100-Pin TQFP Tray	Secure MCU 16bit PIC24 PIC Harvard 256KB Flash 2.5V/3.3V 100-Pin TQFP T/R
EU restricts the use of certain hazardous substances	Compliant	Compliant
ECCN (US)	5A002.a.1	5A002.a.1
Part Status	Active	Active
Family Name	PIC24	PIC24
Instruction Set Architecture	Harvard	Harvard
Device Core	PIC	PIC
Core Architecture	PIC	PIC
Maximum CPU Frequency (MHz)	32	32
Maximum Clock Rate (MHz)	32	32
Data Bus Width (bit)	16	16
Program Memory Type	Flash	Flash
Program Memory Size	256KB	256KB
RAM Size	16KB	16KB
Minimum Endurance (Cycles)	20000	20000
Data Retention (Year)	20	20
Maximum Expanded Memory Size	12MB	12MB
Programmability	Yes	Yes
Key Size	128bit@AES/192bit@AES/256bit@AES	128bit@AES/192bit@AES/256bit@AES
Number of Keys	3@DES	3@DES
Number of I/Os	84	84
No. of Timers	5	5
Timers Channels	31/15	31/15
PWM	6	6
Number of ADCs	Single	Single
ADC Channels	24	24
ADC Resolution (bit)	12	12
Number of DACs	Single	Single
DAC Resolution (bit)	10	10
LCD Segments	480	480
Interface Type	I2C/SPI/UART/USB	I2C/SPI/UART/USB
UART	6	6
USB	1	1
SPI	4	4
I2C	3	3
Watchdog	1	1
Analog Comparators	3	3
Parallel Master Port	No	No
Real Time Clock	Yes	Yes
Special Features	LCD Controller	LCD Controller
Minimum Operating Supply Voltage (V)	2	2
Typical Operating Supply Voltage (V)	2.5\|3.3	3.3\|2.5
Maximum Operating Supply Voltage (V)	3.6	3.6
Minimum Operating Temperature (°C)	-40	-40
Maximum Operating Temperature (°C)	85	85
Supplier Temperature Grade	Industrial	Industrial
Packaging	Tray	Tape and Reel
Supplier Package	TQFP	TQFP
Pin Count	100	100
Standard Package Name	QFP	QFP
Mounting	Surface Mount	Surface Mount
Package Height	1	1
Package Length	12	12
Package Width	12	12
PCB changed	100	100
Lead Shape	Gull-wing	Gull-wing

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