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27LV64-20I/P

Description
x8 EPROM
Categorystorage    storage   
File Size121KB,10 Pages
ManufacturerMicrochip
Websitehttps://www.microchip.com
Download Datasheet Parametric View All

27LV64-20I/P Overview

x8 EPROM

27LV64-20I/P Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Parts packaging codeDIP
package instruction0.600 INCH, PLASTIC, DIP-28
Contacts28
Reach Compliance Code_compli
ECCN codeEAR99
Maximum access time200 ns
I/O typeCOMMON
JESD-30 codeR-PDIP-T28
JESD-609 codee0
length36.32 mm
memory density65536 bi
Memory IC TypeOTP ROM
memory width8
Number of functions1
Number of terminals28
word count8192 words
character code8000
Operating modeASYNCHRONOUS
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize8KX8
Output characteristics3-STATE
Package body materialPLASTIC/EPOXY
encapsulated codeDIP
Encapsulate equivalent codeDIP28,.6
Package shapeRECTANGULAR
Package formIN-LINE
Parallel/SerialPARALLEL
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3/5 V
Programming voltage13 V
Certification statusNot Qualified
Maximum seat height4.83 mm
Maximum standby current0.0001 A
Maximum slew rate0.025 mA
Maximum supply voltage (Vsup)5.5 V
Minimum supply voltage (Vsup)3 V
Nominal supply voltage (Vsup)5 V
surface mountNO
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTin/Lead (Sn/Pb)
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width15.24 mm
Base Number Matches1
Obsolete Device
27LV64
64K (8K x 8) Low-Voltage CMOS EPROM
FEATURES
• Wide voltage range 3.0V to 5.5V
• High speed performance
- 200 ns access time available at 3.0V
• CMOS Technology for low power consumption
- 8 mA active current at 3.0V
- 20 mA active current at 5.5V
- 100
µA
standby current
• Factory programming available
• Auto-insertion-compatible plastic packages
• Auto ID aids automated programming
• Separate chip enable and output enable controls
• High speed “express” programming algorithm
• Organized 8K x 8: JEDEC standard pinouts
- 28-pin Dual-in-line package
- 32-pin PLCC Package
- 28-pin SOIC package
- Tape and reel
• Available for the following temperature ranges:
- Commercial:
0°C to +70°C
- Industrial:
-40°C to +85°C
PACKAGE TYPES
DIP/SOIC
V
PP
A12
A7
A6
A5
A4
A3
A2
A1
A0
O0
O1
O2
V
SS
•1
2
3
4
5
6
7
8
9
10
11
12
13
14
28
27
26
25
24
23
22
21
20
19
18
17
16
15
V
CC
PGM
NC
A8
A9
A11
OE
A10
CE
O7
O6
O5
O4
O3
27LV64
PLCC
A7
A12
V
PP
NU
Vcc
PGM
NC
32
31
DESCRIPTION
The Microchip Technology Inc. 27LV64 is a low-voltage
(3.0 volt) CMOS EPROM designed for battery powered
applications. The device is organized as 8K x 8 (8K-
Byte) non-volatile memory product. The 27LV64 con-
sumes only 8mA maximum of active current during a
3.0 volt read operation therefore improving battery per-
formance. This device is designed for very low voltage
applications where conventional 5.0 volt only EPROMs
can not be used. Accessing individual bytes from an
address transition or from power-up (chip enable pin
going low) is accomplished in less than 200 ns at
3.0V.This device allows system designers the ability to
use low voltage non-volatile memory with today’s low
voltage microprocessors and peripherals in battery
powered applications.
A complete family of packages is offered to provide the
most flexibility in applications. For surface mount appli-
cations, PLCC or SOIC packaging is available. Tape
and reel packaging is also available for PLCC or SOIC
packages.
A6
A5
A4
A3
A2
A1
A0
NC
O0
30
4
3
2
1
5
6
29
28
7
8
9
10
11
12
13
14
15
16
27
26
25
24
23
22
21
A8
A9
A11
NC
OE
A10
CE
O7
O6
17
18
19
2004 Microchip Technology Inc.
O1
O2
V
SS
NU
O3
O4
O5
20
27LV64
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