EEWORLDEEWORLDEEWORLD

Part Number

Search

BSH-060-01-C-D-A

Description
.5MM DOUBLE ROW SOCKET ASSEMBLY
CategoryThe connector    The connector   
File Size783KB,1 Pages
ManufacturerSAMTEC
Websitehttp://www.samtec.com/
Environmental Compliance
Download Datasheet Parametric View All

BSH-060-01-C-D-A Online Shopping

Suppliers Part Number Price MOQ In stock  
BSH-060-01-C-D-A - - View Buy Now

BSH-060-01-C-D-A Overview

.5MM DOUBLE ROW SOCKET ASSEMBLY

BSH-060-01-C-D-A Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMTEC
package instructionROHS COMPLIANT
Reach Compliance Codecompliant
Factory Lead Time2 weeks
Samacsys Description120 Position, Dual-Row, 0.50 mm Basic Blade & Beam Socket Strip with alignment pin
Other featuresE.L.P.
Body/casing typeSOCKET
Connector typeBOARD STACKING CONNECTOR
Contact to complete cooperationGOLD (50) OVER NICKEL (150)
Contact completed and terminatedTin (Sn) - with Nickel (Ni) barrier
Contact point genderFEMALE
Contact materialPHOSPHOR BRONZE
DIN complianceNO
Filter functionNO
IEC complianceNO
JESD-609 codee3
MIL complianceNO
Plug informationMULTIPLE MATING PARTS AVAILABLE
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of rows loaded2
OptionsGENERAL PURPOSE
Terminal pitch0.5 mm
Termination typeSURFACE MOUNT
Total number of contacts120
UL Flammability Code94V-0
F-219
BSH–060–01–F–D–RA–WT
EXTENDED LIFE
PRODUCT
HIGH MATING
CYCLES
10 YEAR MFG
WITH 50 µ" GOLD
BSH–030–01–L–D–RA–WT
(0.50 mm) .0197"
BSH–090–01–L–D–A
BSH–060–01–F–D–A
BSH SERIES
BASIC BLADE & BEAM SOCKET
SPECIFICATIONS
For complete specifications and
recommended PCB layouts see
www.samtec.com?BSH
Insulator Material:
Black LCP
Contact Material:
Phosphor Bronze
Plating:
Au or Sn over
50 µ" (1.27 µm) Ni
Current Rating:
2 A per pin
(2 pins powered)
Flammability Rating:
UL 94 VO
Operating Temp Range:
-55 °C to +125 °C
Voltage Rating:
175 VAC
Max Cycles:
100
RoHS Compliant:
Yes
BSH
Mates with:
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
A
OTHER
OPTION
–030, –050, –060,
–090, –120, –150
No. of Positions x (0.50) .01969
+ (6.27) .247
02
= Gold Flash
on contact,
Matte Tin on tail
–F
–L
= Tape & Reel
(120 positions
maximum)
–TR
(6.22)
.245
01
(3.81) (7.24)
.150 .285
(0.50)
.01969
(3.25)
.128
= 10 µ" (0.25 µm)
Gold on contact,
Matte Tin on tail
PROCESSING
Lead-Free Solderable:
Yes
SMT Lead Coplanarity:
(0.10 mm) .004" max (030-090)
(0.15 mm) .006" max (120-150)*
*(.004" stencil solution
may be available; contact
IPG@samtec.com)
Board Stacking:
For applications requiring more
than two connectors per board
or 90 positions or higher,
contact ipg@samtec.com
(3.05)
.120
(0.15)
.006
(0.89)
.035
DIA
(0.76)
.030
= Electro-Polished
Selective
50 µ" (1.27 µm) min Au
over 150 µ" (3.81 µm) Ni
on Signal Pins in contact
area, Matte Tin over
50 µ" (1.27 µm) min
Ni on all solder tails
*Note:
–C Plating passes
10 year MFG testing
–C*
POWER/SIGNAL
APPLICATION
MATED HEIGHT
LEAD STYLE MATED HEIGHT*
–01
(5.00) .197
*Processing conditions will
affect mated height.
Compatible with
UMPT/UMPS for
flexible two-piece
power/signal solutions
RECOGNITIONS
For complete scope
of recognitions see
www.samtec.com/quality
FILE NO. E111594
BSH
Mates with:
BTH
NO. OF POSITIONS
PER ROW
01
PLATING
OPTION
D
RA
WT
OTHER
OPTION
ALSO AVAILABLE
(MOQ Required)
• 30 µ" (0.76 µm) Gold
• Edge Mount Capability
• 8 mm, 11 mm, 16 mm,
19 mm and 22 mm Stack
Height (Caution: Some
automatic placement/
inspection machines may
have component height
restrictions. Please consult
machinery specifications.)
(11 mm, 16 mm, 19 mm
and 22 mm not available
with 50 positions)
–030, –060, –090
= Gold Flash on contact, Matte Tin on tail
–F
–L
= Guide Post
–GP
= 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail
No. of Positions x (0.50) .01969 + (10.88) .428
(13.59)
.535
01
(7.24)
.285
(1.32) (1.10)
.052 x .043
(0.15)
.006
(0.50)
.01969
02
(8.82)
.347
(0.64)
.025
SQ
Note:
Some lengths, styles and
options are non-standard,
non-returnable.
(1.32)
.052
DIA
Due to technical progress, all designs, specifications and components are subject to change without notice.
All parts within this catalog are built to Samtec’s specifications.
Customer specific requirements must be approved by Samtec and identified in a Samtec customer-specific drawing to apply.
WWW.SAMTEC.COM
Application of a New FSK Demodulation Algorithm in Caller ID
Application of a New FSK Demodulation Algorithm in Caller IDQian Jun and Wang Furong from Huazhong University of Science and Technology, Wuhan Abstract: The core part of caller ID is the demodulation ...
fighting Analog electronics
What DIY tools do you want most?
Are you troubled by lack of tools when doing DIY?[[i]This post was last edited by An_Ran on 2011-12-12 19:59[/i]]...
安_然 Microcontroller MCU
STM 32 PWM complementary output
I checked the information and found that only TIM1 has PWM complementary output, while other timers do not. Is this true?...
终极菜鸟 stm32/stm8
Program to implement CAN interface communication of MCP2515 through FPGA
Now I want to connect FPGA with MCP2515 chip to debug CAN interface. Does anyone have relevant program information? Thank you!...
风色碧空 FPGA/CPLD
Download the ZigBee Evaluation Kit
I am a zigbee beginner and recently purchased Zhou Ligong's zigbee evaluation kit. I would like to share the kit information and hope it will be helpful to everyone....
mervyn RF/Wirelessly
Video display issues
Well, I would like to borrow your popularity to ask for advice. How does the YUV data of the video generated by the decoder display on the LCD? Is there any relevant information? I want to intercept a...
zk12081984 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 547  413  1361  1726  2087  12  9  28  35  43 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号