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FSA2269 / FSA2269TS — Low-Voltage Dual-SPDT (0.4) Analog Switch with Negative Swing Audio Capability
July 2013
FSA2269 / FSA2269TS —
Low-Voltage Dual-SPDT (0.4
)
Analog Switch with Negative Swing Audio Capability
Features
0.4 Ω Typical On Resistance (R
ON
) for +3.0 V Supply
0.25 Ω Ma ximum R
ON
Flatness for +3.0 V Supply
-3 db Bandwidth: > 50 MHz
Low-I
CCT
Current Over an Expanded Control Input
Range
Description
The FSA2269 is a high-performance, dual Single-Pole
Double-Throw (SPDT) analog switch with negative swing
audio capability. The FSA2269 features ultra-low R
ON
of
0.4
(typical) at 3.0 V V
CC
. The FSA2269 operates over
a wide V
CC
range of 1.65 V to 4.5 V, is fabricated with
sub-micron CMOS technology to achieve fast switching
speeds, and is designed for break-before-make
operation. The select input is TTL-level compatible.
The FSA2269 features very low quiescent current even
when the control voltage is lower than the V
CC
supply.
This feature suits mobile handset applications by
allowing direct interface with baseband processor
general-purpose I/Os with minimal battery consumption.
The FSA2269TS includes termination resistors that
improve noise immunity during overshoot excursions,
off-isolation coupling, or “pop-minimization.”
Packaged in 10-Lead MicroPak™, UMLP, and
WLCSP
Power-Off Protection on Common Ports
Broad V
CC
Operating Range: 1.65 to 4.5 V
Noise Immunity Termination Resistors in FSA2269TS
Applications
Cell Phone, PDA, Digital Camera, and Notebook
LCD Monitor, TV, and Set-Top Box
Ordering Information
Part Number
FSA2269L10X
FSA2269UMX
FSA2269TSL10X
FSA2269TSUMX
FSA2269UCX
Top Mark
HL
HP
HU
HT
N9
Package Description
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm
10-Lead, Quad Ultrathin Molded Leadless Package (UMLP), 1.4 x 1.8 mm,
0.4 mm Pitch
10-Lead, MicroPak, JEDEC MO-255, 1.6 x 2.1 mm
10-Lead, Quad Ultrathin Molded Leadless Package(UMLP), 1.4 x 1.8 mm,
0.4 mm Pitch
12-Ball, Wafer-Level Chip Scale Package (WLCSP),1.2 x 1.6 mm, 0.4 mm Pitch
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