MX25V8035FZUI datasheet, PDF - EEWORLD Datasheet

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MX25V8035FZUI: DescriptionIC FLASH 8M SPI 104MHZ 8USON; Categorystorage; File Size1MB，79 Pages; ManufacturerMacronix; Websitehttp://www.macronix.com/en-us/Pages/default.aspx; Environmental Compliance

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MX25V8035FZUI Overview

IC FLASH 8M SPI 104MHZ 8USON

MX25V8035FZUI Parametric

Parameter Name	Attribute value
memory type	non-volatile
memory format	flash memory
technology	FLASH - NOR
storage	8Mb （1M x 8）
Clock frequency	104MHz
Write cycle time - words, pages	100µs，4ms
memory interface	SPI
Voltage - Power	2.3 V ~ 3.6 V
Operating temperature	-40°C ~ 85°C（TA）
Installation type	surface mount
Package/casing	8-UFDFN exposed pad
Supplier device packaging	8-USON（2x3）

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MX25V8035F

2.3V-3.6V, 8M-BIT [x 1/x 2/x 4]

CMOS MXSMIO

(SERIAL MULTI I/O)

FLASH MEMORY

Key Features

•

2.3V-3.6V

for Read, Erase and Program Operations

• Unique ID and Secure OTP Support

• Multi I/O Support - Single I/O, Dual I/O and Quad I/O

• Program Suspend/Resume & Erase Suspend/Resume

P/N: PM2209

REV. 1.0, NOV. 20, 2015

MX25V8035F

Contents

1. FEATURES .............................................................................................................................................................. 4

2. GENERAL DESCRIPTION ..................................................................................................................................... 6

Table 1. Additional Feature..........................................................................................................................7

3. PIN CONFIGURATIONS ......................................................................................................................................... 8

4. PIN DESCRIPTION .................................................................................................................................................. 8

5. BLOCK DIAGRAM................................................................................................................................................... 9

6. DATA PROTECTION.............................................................................................................................................. 10

Table 2. Protected Area Sizes ................................................................................................................... 11

Table 3. 8K-bit Secured OTP Definition

....................................................................................................12

7. MEMORY ORGANIZATION ................................................................................................................................... 13

Table 4. Memory Organization ..................................................................................................................13

8. DEVICE OPERATION ............................................................................................................................................ 14

9. HOLD FEATURE.................................................................................................................................................... 16

10. COMMAND DESCRIPTION ................................................................................................................................. 17

Table 5. Command Set..............................................................................................................................17

10-1. Write Enable (WREN) .............................................................................................................................. 20

10-2. Write Disable (WRDI)............................................................................................................................... 21

10-3. Read Identification (RDID)

....................................................................................................................... 22

10-4. Read Electronic Signature (RES) ............................................................................................................ 23

10-5. Read Electronic Manufacturer ID & Device ID (REMS) ........................................................................... 24

10-6. ID Read .................................................................................................................................................... 25

Table 6. ID Definitions

..............................................................................................................................25

10-7. Read Status Register (RDSR) ................................................................................................................. 26

10-8. Read Configuration Register (RDCR)

...................................................................................................... 31

10-9. Write Status Register (WRSR)................................................................................................................. 32

Table 7. Protection Modes.........................................................................................................................33

10-10. Read Data Bytes (READ) ........................................................................................................................ 36

10-11. Read Data Bytes at Higher Speed (FAST_READ) .................................................................................. 37

10-12. Dual Read Mode (DREAD) ...................................................................................................................... 38

10-13. 2 x I/O Read Mode (2READ) ................................................................................................................... 39

10-14. Quad Read Mode (QREAD) .................................................................................................................... 40

10-15. 4 x I/O Read Mode (4READ) ................................................................................................................... 41

10-16. Burst Read ............................................................................................................................................... 43

10-17. Performance Enhance Mode ................................................................................................................... 44

10-18. Sector Erase (SE) .................................................................................................................................... 46

10-19. Block Erase (BE32K) ............................................................................................................................... 47

10-20. Block Erase (BE) ..................................................................................................................................... 48

10-21. Chip Erase (CE) ....................................................................................................................................... 49

10-22. Page Program (PP) ................................................................................................................................. 50

10-23. 4 x I/O Page Program (4PP) .................................................................................................................... 51

10-24. Deep Power-down (DP) ........................................................................................................................... 52

10-25. Enter Secured OTP (ENSO) .................................................................................................................... 53

P/N: PM2209

REV. 1.0, NOV. 20, 2015

MX25V8035F

10-26. Exit Secured OTP (EXSO) ....................................................................................................................... 53

10-27. Read Security Register (RDSCUR) ......................................................................................................... 53

Table 8. Security Register Definition

.........................................................................................................54

10-28. Write Security Register (WRSCUR)......................................................................................................... 54

10-29. Program/Erase Suspend/Resume ........................................................................................................... 55

Table 9. Readable Area of Memory While a Program or Erase Operation is Suspended .........................55

Table 10. Acceptable Commands During Program/Erase Suspend after tPSL/tESL ................................55

Table 11. Acceptable Commands During Suspend (tPSL/tESL not required) ...........................................56

10-30. Program Resume and Erase Resume ..................................................................................................... 57

10-31. No Operation (NOP) ................................................................................................................................ 58

10-32. Software Reset (Reset-Enable (RSTEN) and Reset (RST)) ................................................................... 58

10-33. High Voltage Operation ............................................................................................................................ 60

10-34. Read SFDP Mode (RDSFDP).................................................................................................................. 61

11. POWER-ON STATE ............................................................................................................................................. 62

12. ELECTRICAL SPECIFICATIONS ........................................................................................................................ 63

Table 12. Absolute Maximum Ratings .......................................................................................................63

Table 13. Capacitance...............................................................................................................................63

Table 14. DC Characteristics.....................................................................................................................65

Table 15. AC Characteristics ....................................................................................................................66

13. OPERATING CONDITIONS ................................................................................................................................. 68

Table 16. Power-Up/Down Voltage and Timing .........................................................................................70

13-1. Initial Delivery State ................................................................................................................................. 70

14. ERASE AND PROGRAMMING PERFORMANCE .............................................................................................. 71

15. LATCH-UP CHARACTERISTICS ........................................................................................................................ 71

16. ORDERING INFORMATION ................................................................................................................................ 72

17. PART NAME DESCRIPTION ............................................................................................................................... 73

18. PACKAGE INFORMATION .................................................................................................................................. 74

19. REVISION HISTORY ........................................................................................................................................... 78

P/N: PM2209

REV. 1.0, NOV. 20, 2015

MX25V8035FZUI Related Products

	MX25V8035FZUI	MX25V8035FM2I	MX25V8035FZNI	MX25V8035FM1Q
Description	IC FLASH 8M SPI 104MHZ 8USON	IC FLASH 8M SPI 104MHZ 8SOP	IC FLASH 8M SPI 104MHZ 8WSON	IC FLASH 8M SPI 104MHZ 8SOP
memory type	non-volatile	non-volatile	non-volatile	non-volatile
memory format	flash memory	flash memory	flash memory	flash memory
technology	FLASH - NOR	FLASH - NOR	FLASH - NOR	FLASH - NOR
storage	8Mb （1M x 8）	8Mb （1M x 8）	8Mb （1M x 8）	8Mb （1M x 8）
Clock frequency	104MHz	104MHz	104MHz	104MHz
Write cycle time - words, pages	100µs，4ms	100µs，4ms	100µs，4ms	100µs，4ms
memory interface	SPI	SPI	SPI	SPI
Voltage - Power	2.3 V ~ 3.6 V	2.3 V ~ 3.6 V	2.3 V ~ 3.6 V	2.3 V ~ 3.6 V
Operating temperature	-40°C ~ 85°C（TA）	-40°C ~ 85°C（TA）	-40°C ~ 85°C（TA）	-40°C ~ 125°C
Installation type	surface mount	surface mount	surface mount	surface mount
Package/casing	8-UFDFN exposed pad	8-SOIC (0.209", 5.30mm wide)	8-WDFN Exposed Pad	8-SOIC (0.154", 3.90mm wide)
Supplier device packaging	8-USON（2x3）	8-SOP	8-WSON（6x5）	8-SOP

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