Tflex
TM
200T V0 Series
Innovative
Technology
for a
Connected
World
Thermal Gap Filler
THIN THERMALLY CONDUCTIVITY ELASTOMERIC INTERFACE MATERIAL
Tflex™ 200T V0 is a specially formulated thin gap filler thermal interface material designed
for thin interfaces that require a combination good thermal performance with great reli-
ability. The elastomeric property of Tflex™ 200T V0 provides good thermal performance in
a thin interface where reliability, shock and vibration considerations, are critical performance
considerations in addition to low thermal resistance.
Tflex™ 200T V0’s unique silicone and ceramic filler technology allows a combination of
great reliability, good thermal performance, and easy handling.
Tflex™ 200T V0 is slightly tacky, and requires no additional adhesive coating that inhibits
thermal performance. Tflex™ 200T V0 is electrically insulating, stable from -40ºC thru 200ºC
and meets UL 94V0 flame rating.
FEATURES AND BENEFITS
• Thermal Conductivity 1.5 W/mK
• Compliant Elastomeric based thin interface material
• Available in 0.008-inch (0.2mm), 0.010-inch (0.25mm), 0.012-inch (0.30mm), 0.015-inch
(0.38mm) , and 0.020-inch (0.51mm) thicknesses
• Slightly tacky for adhesion during assembly and transport
• Competitive price for high volume applications
• Available as individual custom parts, sheets, or custom parts converted on a roll
APPLICATIONS
• Memory Modules:
DDR2, DDR3, SDRAM, SRAM, RAM, NVRAM
• LED solid state lighting
• Power electronics
global
solutions:
local
support
Americas: +1.800.843.4556
Europe: +49.8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
Tflex
TM
200T V0 Series
Thermal Gap Filler
Innovative
Technology
for a
Connected
World
8 MIL
10 MIL
15 MIL
TEST METHOD
Construction &
Composition
Color
Thickness
Thickness tolerance
Specific Gravity
(Density)
Hardness
(Shore 00)
Outgassing TML
(Post Cured)
Outgassing CVCM
(Post Cured )
UL Flammability Rating
Temperature Range
Thermal Conductivity
Thermal Impedance
@ 10 psi
@ 69 KPa
Thermal Expansion
(30-150°C)
Volume Resistivity
Dielectric Constant @
1 MHz
Ceramic filled
silicone elastomer
Light Grey
0.008”
(0.203mm)
±0.0015”
(±0.038mm)
2.32 g/cc
55
0.38%
0.11%
94 V0
-45ºC to 200ºC
1.5 W/mK
0.384°C-in²/W
2.48°C-cm²/W
231.19ppm/°C
3.5x1010 ohm-cm
5.0
Ceramic filled
silicone elastomer
Light Grey
0.010”
(0.254mm)
±0.0015”
(±0.038mm)
2.32 g/cc
55
0.38%
0.11%
94 V0
-45ºC to 200ºC
1.5 W/mK
0.488°C-in²/W
3.14°C-cm²/W
231.19ppm/°C
3.5x1010 ohm-cm
5.1
Ceramic filled
silicone elastomer, reinforced
Light Grey
0.015”
(0.381mm)
±0.00225”
(±0.057mm)
2.32 g/cc
55
0.38%
0.11%
94 V0
-45ºC to 200ºC
1.5 W/mK
0.714°C-in²/W
4.60°C-cm²/W
231.19ppm/°C
3.5x1010 ohm-cm
5.1
Hot Disk
ASTM D5470
(modified)
IPC-TM-650
2.4 2.4
ASTM D257
ASTM D150
Helium
Pycnometer
ASTM D2240
ASTM E595
ASTM E595
E180840
Visual
Data for design engineer guidance only. Observed performance varies in application.
Engineers are reminded to test the material in application.
THR-DS-Tflex-200T-V0 1209
Any information furnished by Laird Technologies and its agents is believed to be accurate and reliable. Responsibility for the use and application of Laird Technologies
materials rests with the end user since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness,
merchantability, or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or conse-
quential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies terms and conditions of sale in effect from time to time, a copy
of which will be furnished upon request.damages of any kind. All Laird Technologies’ products are sold pursuant to the Laird Technologies’ terms and conditions of sale in
effect from time to time, a copy of which will be furnished upon request. A15922-00 Rev C., 12/2009.
© 2009 All Rights Reserved. Laird Technologies is a registered trademark of Laird Technologies, Inc.