ZSSC3036CI6B datasheet, PDF - EEWORLD Datasheet

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ZSSC3036CI6B: DescriptionWAFER (UNSAWN) - BOX; Categoryunclassified; File Size775KB，48 Pages; ManufacturerIDT (Integrated Device Technology, Inc.); Websitehttp://www.idt.com/

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Low-Power, High-Resolution 16-Bit

Sensor Signal Conditioner

ZSSC3036

Datasheet

Brief Description

The ZSSC3036 is a sensor signal conditioner (SSC)

integrated circuit for high-accuracy amplification and

analog-to-digital conversion of a differential input

signal. Designed for high-resolution altimeter module

applications, the ZSSC3036 can perform offset,

span, and 1 and 2 order temperature compen-

sation of the measured signal. Developed for correc-

tion of resistive bridge sensors, it can also provide a

corrected temperature output measured with an

internal sensor.

The measured and corrected bridge values are

provided at the digital output pins, which can be

configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).

Digital compensation of signal offset, sensitivity,

temperature, and non-linearity is accomplished via

an 18-bit internal digital signal processor (DSP) run-

ning a correction algorithm. Calibration coefficients

are stored on-chip in a highly reliable, non-volatile,

multiple-time programmable (MTP) memory. Pro-

gramming the ZSSC3036 is simple via the serial

interface. The IC-internal charge pump provides the

MTP programming voltage. The interface is used for

the PC-controlled calibration procedure, which pro-

grams the set of calibration coefficients in memory.

The ZSSC3036 provides accelerated signal process-

ing in order to support high-speed control, safety,

and real-time sensing applications. It complements

IDT’s additional ZSSC30x6 products.

•

Benefits

Integrated 18-bit calibration math DSP

Fully corrected signal at digital output

Layout customized for die-die bonding with

sensor for high-density chip-on-board assembly

Single-pass calibration minimizes calibration

costs

No external trimming, filter, or buffering com-

ponents required

Highly integrated CMOS design

Excellent for low-voltage and low-power battery

applications

Optimized for operation in calibrated resistive

sensor modules

Physical Characteristics

•

Supply voltage range: 1.8 to 3.6V

Current consumption: 1mA (operating mode)

Sleep State current: 50nA (typical)

Temperature resolution: <0.003K/LSB

Operation temperatures: –40°C to +85°C

–40°C to +110°C

Small die size

Delivery options: die for wafer bonding

C™ is a trademark of NXP.

FSO = Full Scale Output.

Features

•

Flexible, programmable analog front-end design;

up to 16-bit scalable, charge-balancing two-

segment analog-to-digital converter (ADC)

Fully programmable gain amplifier accepting

sensors from 14 to 72 (linear factor)

Internal auto-compensated temperature sensor

Digital compensation of individual sensor offset;

1 and 2 order digital compensation of sensor

gain as well as of 1 and 2 order temperature

gain and offset drift

Fast sensing: 16-bit conditioned sensor signal

-1

measurement rate at more than 200s

Typical sensor elements can achieve accuracy of

less than ±0.10% FSO** @ -40 to 110°C

ZSSC3036 Application Example

April 20, 2016

ZSSC3036 Datasheet

Table of Contents

IC Characteristics .......................................................................................................................................... 6

1.1. Absolute Maximum Ratings .................................................................................................................... 6

1.2. Operating Conditions .............................................................................................................................. 6

1.3. Electrical Parameters ............................................................................................................................. 7

1.4. Power Supply Rejection Ratio (RSRR) vs. Frequency........................................................................... 9

2 Circuit Description ....................................................................................................................................... 10

2.1. Brief Description ................................................................................................................................... 10

2.2. Signal Flow and Block Diagram............................................................................................................ 10

2.3. Analog Front End .................................................................................................................................. 11

2.3.1. Amplifier ......................................................................................................................................... 11

2.3.2. Analog-to-Digital Converter ............................................................................................................ 13

2.3.3. Temperature Measurement ........................................................................................................... 17

2.3.4. Bridge Supply ................................................................................................................................. 17

2.4. Digital Section ....................................................................................................................................... 17

2.4.1. Digital Signal Processor (DSP) Core ............................................................................................. 17

2.4.2. MTP Memory.................................................................................................................................. 17

2.4.3. Clock Generator ............................................................................................................................. 18

2.4.4. Power Supervision ......................................................................................................................... 18

2.4.5. Interface ......................................................................................................................................... 18

3 Functional Description ................................................................................................................................. 19

3.1. Power Up .............................................................................................................................................. 19

3.2. Measurements ...................................................................................................................................... 19

3.3. Operational Modes ............................................................................................................................... 19

3.4. Command Interpretation ....................................................................................................................... 22

3.4.1. SPI/I C™ Commands .................................................................................................................... 22

3.5. Communication Interface...................................................................................................................... 25

3.5.1. Common Functionality ................................................................................................................... 25

3.5.2. SPI ................................................................................................................................................. 26

3.5.3. I C™ ............................................................................................................................................... 29

3.6. Memory ................................................................................................................................................. 30

3.6.1. Programming Memory ................................................................................................................... 30

3.6.2. Memory Status Commands ........................................................................................................... 31

3.6.3. Memory Contents ........................................................................................................................... 32

3.7. Calibration Sequence ........................................................................................................................... 38

3.7.1. Calibration Step 1 – Assigning Unique Identification ..................................................................... 39

3.7.2. Calibration Step 2 – Data Collection .............................................................................................. 39

3.7.3. Calibration Step 3 – Coefficient Calculations ................................................................................. 40

3.8. The Calibration Math ............................................................................................................................ 40

3.8.1. Bridge Signal Compensation ......................................................................................................... 40

3.8.2. Temperature Signal Compensation ............................................................................................... 43

April 20, 2016

ZSSC3036 Datasheet

Die Pad Assignments .................................................................................................................................. 44

Quality and Reliability .................................................................................................................................. 45

Ordering Sales Codes ................................................................................................................................. 45

Related Documents ..................................................................................................................................... 45

Glossary ...................................................................................................................................................... 46

Document Revision History ......................................................................................................................... 48

Table of Figures

Figure 2.1

Figure 2.2

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

Figure 3.10

Figure 3.11

Figure 4.1

ZSSC3036 Functional Block Diagram ........................................................................................... 10

ADC Offset ..................................................................................................................................... 16

Operational Flow Chart: Power Up ................................................................................................ 21

Operational Flow Chart: Command Mode and Normal Mode ....................................................... 22

SPI Configuration CPHA=0 ........................................................................................................... 26

SPI Configuration CPHA=1 ........................................................................................................... 27

SPI Command Request ................................................................................................................. 27

SPI Read Status ............................................................................................................................ 28

SPI Read Data ............................................................................................................................... 28

C™ Command Request .............................................................................................................. 29

I C™ Read Status .......................................................................................................................... 29

I C™ Read Data ............................................................................................................................ 30

Memory Program Operation .......................................................................................................... 31

ZSSC3036 Pad Assignments ........................................................................................................ 44

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 2.8

Table 3.1

Table 3.2

Table 3.3

Maximum Ratings ............................................................................................................................ 6

Operating Conditions ....................................................................................................................... 6

Requirements for VDD Power-on Reset .......................................................................................... 7

Electrical Parameters ....................................................................................................................... 7

Amplifier Gain: Stage 1 .................................................................................................................. 11

Amplifier Gain: Stage 2 .................................................................................................................. 12

Gain Polarity .................................................................................................................................. 12

MSB/LSB Segmentation Settings for Bridge Measurement .......................................................... 13

MSB/LSB Segmentation Settings for Temperature Measurement ................................................ 13

ADC Conversion Times for a Single A2D Conversion................................................................... 14

Typical Conversion Times vs. Noise Performance for 16-Bit Results with Full Sensor Signal

Conditioning for AZBM, BM, AZTM, and TM ................................................................................. 15

ADC Offset Settings ....................................................................................................................... 16

SPI/I C™ Commands .................................................................................................................... 23

Get_Raw Commands .................................................................................................................... 24

General Status Byte ....................................................................................................................... 25

April 20, 2016

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