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ZSC31014EIC

Description
DICE (WAFER SAWN) - FRAME
Categoryunclassified   
File Size702KB,58 Pages
ManufacturerIDT (Integrated Device Technology, Inc.)
Websitehttp://www.idt.com/
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ZSC31014EIC Overview

DICE (WAFER SAWN) - FRAME

RBic
ilite
™ Digital Output Sensor
Signal Conditioner
ZSC31014
Datasheet
Brief Description
The ZSC31014 is a CMOS integrated circuit for
highly accurate amplification and analog-to-digital
conversion of differential and half-bridge input
signals. The ZSC31014 can compensate the mea-
st
nd
st
sured signal for offset, 1 and 2 order span, and 1
nd
and 2 order temperature (Tco and Tcg). It is well
suited for sensor-specific correction of bridge sen-
sors. Digital compensation of signal offset,
sensitivity, temperature drift, and non-linearity is
accomplished via an internal digital signal processor
running a correction algorithm with calibration
coefficients stored in a non-volatile EEPROM.
The ZSC31014 is adjustable to nearly all piezo-
resistive bridge sensors. Measured and corrected
bridge values are provided at digital output pins,
2
which can be configured as I C™* or SPI. The digital
2
I C™ interface can be used for a simple PC-
controlled calibration procedure to program cali-
bration coefficients into an on-chip EEPROM. The
calibrated ZSC31014 and a specific sensor are
mated digitally: fast, precise, and without the cost
overhead associated with trimming by external
devices or laser trimming.
The ZSC31014’s integrated diagnostics functions
are well suited for safety-critical applications.
Benefits
Simple PC-controlled configuration and single-
2
pass digital calibration via I C™ interface – quick
and precise; SPI option for measurement mode
Eliminates need for external trimming
components
On-chip diagnostic features add safety to the
application (e.g., EEPROM signature, bridge
connection checks, bridge short detection).
Low-power Sleep Mode lengthens battery life
Enables multiple sensor networks
Available Support
Evaluation Kit
Application Notes
Mass Calibration Solution
Physical Characteristics
Wide supply voltage capability: 2.7V to 5.5V
Current consumption as low as 70μA depending
on programmed sample rate
Low-power Sleep Mode (<2μA @ 25°C)
Operation temperature: -40°C to +125°C
Small SOP8 package
2
Features
High accuracy (±0.1% FSO @ -25 to +85°C;
±0.25% FSO @ -40 to +125°C)
nd
2 order charge-balancing analog-to-digital
converter provides low noise, 14-bit data at
sample rates exceeding 2kHz
Fast power-up to data output response:
3ms at 4MHz
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Eight programmable analog gain settings com-
bine with a digital gain term; accommodates
bridges with spans <1mV/V and high offset
Internal temperature compensation for sensor
correction and for corrected temperature output
48-bit customer ID field for module traceability
ZSC31014 Application: I C™ Interface, Low-Power
Bsink Option, Internal Temperature Correction
V
supply
ZSC31014
VSS
BSINK
VBP
VBN
VDD
INT/SS
SDA/MISO
SCL/SCLK
(2.7V to 5.5V)
0.1µF
GND
* I
2
C™ is a trademark of NXP.
© 2016 Integrated Device Technology, Inc.
1
January 20, 2016
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