ZSC31014EAB datasheet, PDF - EEWORLD Datasheet

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RBic

ilite

™ Digital Output Sensor

Signal Conditioner

ZSC31014

Datasheet

Brief Description

The ZSC31014 is a CMOS integrated circuit for

highly accurate amplification and analog-to-digital

conversion of differential and half-bridge input

signals. The ZSC31014 can compensate the mea-

sured signal for offset, 1 and 2 order span, and 1

and 2 order temperature (Tco and Tcg). It is well

suited for sensor-specific correction of bridge sen-

sors. Digital compensation of signal offset,

sensitivity, temperature drift, and non-linearity is

accomplished via an internal digital signal processor

running a correction algorithm with calibration

coefficients stored in a non-volatile EEPROM.

The ZSC31014 is adjustable to nearly all piezo-

resistive bridge sensors. Measured and corrected

bridge values are provided at digital output pins,

which can be configured as I C™* or SPI. The digital

I C™ interface can be used for a simple PC-

controlled calibration procedure to program cali-

bration coefficients into an on-chip EEPROM. The

calibrated ZSC31014 and a specific sensor are

mated digitally: fast, precise, and without the cost

overhead associated with trimming by external

devices or laser trimming.

The ZSC31014’s integrated diagnostics functions

are well suited for safety-critical applications.

Benefits

•

Simple PC-controlled configuration and single-

pass digital calibration via I C™ interface – quick

and precise; SPI option for measurement mode

Eliminates need for external trimming

components

On-chip diagnostic features add safety to the

application (e.g., EEPROM signature, bridge

connection checks, bridge short detection).

Low-power Sleep Mode lengthens battery life

Enables multiple sensor networks

Available Support

•

Evaluation Kit

Application Notes

Mass Calibration Solution

Physical Characteristics

•

Wide supply voltage capability: 2.7V to 5.5V

Current consumption as low as 70μA depending

on programmed sample rate

Low-power Sleep Mode (<2μA @ 25°C)

Operation temperature: -40°C to +125°C

Small SOP8 package

Features

•

High accuracy (±0.1% FSO @ -25 to +85°C;

±0.25% FSO @ -40 to +125°C)

2 order charge-balancing analog-to-digital

converter provides low noise, 14-bit data at

sample rates exceeding 2kHz

Fast power-up to data output response:

3ms at 4MHz

Digital compensation of sensor offset, sensitivity,

temperature drift, and non-linearity

Eight programmable analog gain settings com-

bine with a digital gain term; accommodates

bridges with spans <1mV/V and high offset

Internal temperature compensation for sensor

correction and for corrected temperature output

48-bit customer ID field for module traceability

ZSC31014 Application: I C™ Interface, Low-Power

Bsink Option, Internal Temperature Correction

supply

ZSC31014

VSS

BSINK

VBP

VBN

VDD

INT/SS

SDA/MISO

SCL/SCLK

(2.7V to 5.5V)

0.1µF

GND

* I

C™ is a trademark of NXP.

January 20, 2016

ZSC31014 Datasheet

Contents

List of Figures .......................................................................................................................................................... 4

List of Tables ........................................................................................................................................................... 5

1 IC Characteristics ............................................................................................................................................. 6

1.1. Absolute Maximum Ratings ....................................................................................................................... 6

1.2. Recommended Operating Conditions ....................................................................................................... 6

1.3. Electrical Parameters ................................................................................................................................ 7

1.4. Current Consumption ................................................................................................................................ 9

1.4.1. Update Mode Current Consumption ................................................................................................... 9

1.4.2. Sleep Mode Current Consumption.................................................................................................... 10

1.5. Analog Input versus Output Resolution ................................................................................................... 10

2 Circuit Description .......................................................................................................................................... 13

2.1. Signal Flow and Block Diagram............................................................................................................... 13

2.2. Analog Front End ..................................................................................................................................... 14

2.2.1. Preamplifier (PreAmp)....................................................................................................................... 14

2.2.2. Analog-to-Digital Converter ............................................................................................................... 15

2.2.3. Temperature Measurement .............................................................................................................. 18

2.2.4. Bridge Supply (Bsink)........................................................................................................................ 18

2.2.5. Analog Front-End Configuration ....................................................................................................... 19

2.3. Digital Signal Processor .......................................................................................................................... 19

2.3.1. Digital Core ....................................................................................................................................... 19

2.3.2. Normal Operation Mode .................................................................................................................... 20

2.3.3. EEPROM ........................................................................................................................................... 20

2.3.4. Digital Interface – I

C™ ..................................................................................................................... 20

2.3.5. Digital Interface – SPI ....................................................................................................................... 22

2.3.6. Clock Generator / Power-On Reset (CLKPOR) ................................................................................ 23

2.4. Diagnostic Features ................................................................................................................................. 23

2.4.1. EEPROM Integrity ............................................................................................................................. 25

2.4.2. Sensor Connection Check ................................................................................................................ 25

2.4.3. Sensor Short Check .......................................................................................................................... 25

3 Functional Description .................................................................................................................................... 26

3.1. General Working Mode ............................................................................................................................ 26

3.1.1. Update Mode ..................................................................................................................................... 28

3.1.2. Sleep Mode ....................................................................................................................................... 30

3.2. ZSC31014 Read Operations with I C™ .................................................................................................. 33

3.2.1. I C™ Read_MR (Measurement Request) ........................................................................................ 34

3.2.2. I C™ Read_DF (Data Fetch) ............................................................................................................ 34

3.3. SPI Read Operations ............................................................................................................................... 34

3.3.1. SPI Read_MR (Measurement Request) ........................................................................................... 34

January 20, 2016

ZSC31014 Datasheet

3.3.2. SPI Read_DF (Data Fetch) ............................................................................................................... 35

3.4. I C™ Write Operations ............................................................................................................................ 36

3.4.1. I C™ Write_MR (Measurement Request) ......................................................................................... 36

3.4.2. Command Mode I C™ Write Operations .......................................................................................... 37

3.5. Command/Data Pair Encoding in Command Mode ................................................................................ 37

3.6. EEPROM Bits .......................................................................................................................................... 38

3.7. Calibration Sequence .............................................................................................................................. 44

3.8. Calibration Math ...................................................................................................................................... 45

3.8.1. Bridge Signal Compensation ............................................................................................................ 46

3.8.2. Temperature Signal Compensation .................................................................................................. 47

3.8.3. Limits Imposed on Coefficient Ranges ............................................................................................. 47

3.8.4. Interpretation of Binary Numbers for Correction Coefficients ........................................................... 48

4 Application Circuit Examples .......................................................................................................................... 50

4.1. I C™ Interface – Bridge using Low Power Bsink Option......................................................................... 50

4.2. Generic Differential A2D Converter ......................................................................................................... 51

4.3. Half-Bridge Measurement........................................................................................................................ 52

5 ESD/Latch-Up-Protection ............................................................................................................................... 53

6 Pin Configuration and Package ...................................................................................................................... 53

7 Test................................................................................................................................................................. 54

8 Reliability ........................................................................................................................................................ 55

9 Customization ................................................................................................................................................. 55

10 Ordering Codes .............................................................................................................................................. 55

11 Related Documents ........................................................................................................................................ 56

12 Definitions of Acronyms .................................................................................................................................. 56

13 Document Revision History ............................................................................................................................ 57

List of Figures

Figure 1.1

Figure 1.2

Figure 1.3

Figure 2.1

Figure 2.2

Figure 2.3

Figure 2.4

Figure 2.5

Figure 3.1

Figure 3.2

Figure 3.3

Figure 3.4

Figure 3.5

Update Mode Current Consumption with Minimum Update Rate ...................................................... 9

Update Mode Current Consumption with Maximum Update Rate ..................................................... 9

Sleep Mode Current Consumption ................................................................................................... 10

ZSC31014 Block Diagram ................................................................................................................ 13

Functional Diagram of the ADC ........................................................................................................ 17

Format for AFE Configuration Registers B_Config and T_Config .................................................... 19

I C™ Timing Diagram ....................................................................................................................... 21

SPI Bus Data Output Timing............................................................................................................. 23

General Working Mode ..................................................................................................................... 27

Power-Up Sequence and Timing for Update Mode with EEPROM Locked .................................... 28

Measurement Sequence in Update Mode ........................................................................................ 30

Power-on Sequence in Sleep Mode for I C™ or SPI Read_MR (Typical Timing Values) ............... 32

Sequence during Sleep Mode Using an I C™ Write_MR to Wake Up (Typical Timing Values ) .... 32

January 20, 2016

ZSC31014 Datasheet

Figure 3.6

Figure 3.7

Figure 3.8

Figure 3.9

Figure 4.1

Figure 4.2

Figure 4.3

Figure 6.1

I C™ Measurement Packet Reads ................................................................................................... 33

SPI Read_MR ................................................................................................................................... 34

SPI Output Packet with Falling Edge SPI_Polarity ........................................................................... 35

I C™ Measurement Packet Writes ................................................................................................... 36

Example 1 Circuit Diagram: Bsink Option and Internal Temperature Correction and I C™ Output 50

Example 2 Circuit Diagram: Generic Differential A2D Converter ..................................................... 51

Half-Bridge Voltage Measurement with Internal Temperature Correction........................................ 52

ZSC31014 Pin-Out Diagram ............................................................................................................. 54

List of Tables

Table 1.1

Table 1.2

Table 1.3

Table 1.4

Table 2.1

Table 2.2

Table 2.3

Table 2.4

Table 2.5

Table 2.6

Table 2.7

Table 2.8

Table 2.9

Table 3.1

Table 3.2

Table 3.3

Table 3.4

Table 3.5

Table 3.6

Table 3.7

Table 3.8

Table 3.9

Table 3.10

Table 4.1

Table 4.2

Table 4.3

Table 6.1

Table 6.2

ZSC31014 Maximum Ratings ............................................................................................................. 6

ZSC31014 Recommended Operating Conditions .............................................................................. 6

ZSC31014 Electrical Parameters ....................................................................................................... 7

Minimum Guaranteed Resolution for the Analog Gain Settings ....................................................... 11

Preamplifier Gain Control Signals .................................................................................................... 14

Gain Polarity Control Signal.............................................................................................................. 14

Disable Nulling Control Signal .......................................................................................................... 15

A2D_Offset Signals .......................................................................................................................... 16

Parameters of the Internal Temperature Sensor Bridge .................................................................. 18

Supported I C™ Bit Rates ................................................................................................................ 20

I C™ Parameters .............................................................................................................................. 21

SPI Parameters................................................................................................................................. 22

2 MSB of Data Packet Encoding ...................................................................................................... 24

Command Types .............................................................................................................................. 26

Update Rate Settings (Normal Integration Mode: 9 Coarse + 5 Fine) ............................................. 29

Update Rate Settings (Long Integration Mode: 10 Coarse + 5 Fine) ............................................... 29

Sleep Mode Response Times (Normal Integration Mode: 9 Coarse + 5 Fine) ................................ 31

Sleep Mode Response Times (Long Integration Mode: 10 Coarse + 5 Fine) .................................. 31

Command List and Encodings .......................................................................................................... 37

EEPROM Word/Bit Assignments ...................................................................................................... 38

Restrictions on Coefficient Ranges................................................................................................... 47

Gain_B Weightings ........................................................................................................................... 48

Offset_B Weightings ......................................................................................................................... 48

Register Settings—Example 1 .......................................................................................................... 50

Register Settings—Example 2 .......................................................................................................... 51

Register Settings—Example 3 .......................................................................................................... 52

Storage and Soldering Conditions for the SOP-8 Package .............................................................. 53

ZSC31014 Pin Assignments ............................................................................................................. 54

January 20, 2016

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