Automotive Resistive Sensor Signal
Conditioner with SENT Output
Description
The ZSSC4169 is member of IDT’s family of CMOS integrated
circuits for highly accurate amplification and sensor-specific
correction of differential bridge sensor element signals. Featuring
a maximum analog pre-amplification in the range of up to 200, the
ZSSC4169 is adjustable to nearly all resistive bridges. This
datasheet specifies the specific configuration ZSSC4169_0500_14,
which is for a single, full bridge input on pins BR1P and BR1N.
Digital compensation of offset, gain, sensitivity, temperature drift,
and nonlinearity is accomplished via a 16-bit RISC microcontroller.
Calibration coefficients and configuration data are stored in the
ZSSC4169 nonvolatile memory (NVM), which is reliable in auto-
motive applications.
The ZSSC4169_0500_14 configuration supports using the internal
PTAT or external diodes as temperature references.
Measured values are provided via a digital SENT interface. The
SENT interface enables transmission of sensor data via its Fast
Channel as well as transmission of supplementary data via its
Serial Data Message (SDM) Channel (also referred to as the “slow”
channel) using only one output pin. End-of-line calibration is also
supported through this output pin via a One-Wire Interface (OWI).
The ZSSC4169 and the calibration equipment communicate
digitally, so the noise sensitivity is greatly reduced. Digital
calibration helps keep assembly cost low as no trimming by
external devices or lasers is needed.
The ZSSC4169 is optimized for automotive environments by
overvoltage and reverse polarity protection circuitry, excellent
electromagnetic compatibility, and multiple diagnostic features.
ZSSC4169
Short-Form Datasheet
Features
Differential bridge sensor input and on-chip or external
temperature sensors, selectable for conditioning of the sensor
input signal and/or temperature output
Digital compensation for offset, gain, and higher order
nonlinearity as well as temperature coefficients of measured
bridge sensor input signal
Operating temperature range: -40°C to 150°C
Accuracy: ±0.5% FS at -40°C to 150°C
NVM memory for configuration, calibration data, and
configurable measurement and conditioning functionality
SENT output based on SAE J2716 Revision 3.0 standard
using Fast and Serial Data Message Channels
Supports output of one or more sensor signals and product
identification via a single SENT interface connection
Configurable for nearly all resistive bridge sensors
One-pass, end-of-line calibration algorithm minimizes
production costs
No external trimming or components required
Qualified according to AEC-Q100 Grade 0
Support for the user’s ASIL C safety applications
Physical Characteristics
Typical Applications
Fluid brake pressure sensing (PV)
Hydraulic pressure sensing
(e.g., steering systems with hydraulic steering support)
Pneumatic pressure sensing
(e.g., air brake systems; pneumatic shock absorbers)
Supply voltage: 4.75V to 5.25V
Over-voltage and reverse polarity protection up to ±18V
Bridge sensor input span: 1 to 800 mV/V
Bridge sensor signal ADC resolution: 14 bit
Output resolution: 12-bit via SENT interface
Package: 24-QFN (4
4 mm; wettable flanks)
ZSSC4169 Basic Circuit
R
SENT
SENT
12
11
10
9
8
7
DOUT
C
LOAD
Available Support
Evaluation Kit
Application Notes
Calculation Tools
Bridge Sensor with
Optional On-Chip
PN-Junction
Temperature Sensor
13
BOT
14
BR1N
BR1P
VSSE
6
GND
C1
VCC
SCL
SDA
VSSA
C2
VDDA
VDDE
5
15
TS1
ZSSC4169
(Top View)
SCL
4
16
17
TOP
SDA
3
2
TS2
VSSA
18
BR2P
BR2N
VDDA
1
19
20
21
22
23
24
© 2018 Integrated Device Technology, Inc.
1
January 19, 2018
ZSSC4169 Short-Form Datasheet
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without notice, at IDT's sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, t he suitability
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© 2018 Integrated Device Technology, Inc.
2
January 19, 2018