MKL26Z128VFT4R datasheet, PDF - EEWORLD Datasheet

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MKL26Z128VFT4R: DescriptionKINETIS KL26: 48MHZ CORTEX-M0+ U; Categorysemiconductor The embedded processor and controller; File Size1MB，61 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MKL26Z128VFT4R Overview

KINETIS KL26: 48MHZ CORTEX-M0+ U

MKL26Z128VFT4R Parametric

Parameter Name	Attribute value
core processor	ARM® Cortex®-M0+
core size	32-bit
speed	48MHz
Connectivity	I²C，LINbus，SPI，UART/USART，USB，USB OTG
Peripheral	Undervoltage detection/reset, DMA, I²S, LVD, POR, PWM, WDT
Number of I/Os	36
Program storage capacity	128KB（128K x 8）
Program memory type	flash memory
EEPROM capacity	-
RAM capacity	16K x 8
Voltage - Power Supply (Vcc/Vdd)	1.71 V ~ 3.6 V
data converter	A/D - 16-bit, D/A - 12-bit
Oscillator type	internal
Operating temperature	-40°C ~ 105°C（TA）
Package/casing	48-VFQFN Exposed Pad
Supplier device packaging	48-QFN（7x7）

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Freescale Semiconductor, Inc.

Data Sheet: Technical Data

Document Number: KL26P64M48SF5

Rev 5 08/2014

Kinetis KL26 Sub-Family

48 MHz Cortex-M0+ Based Microcontroller

MKL26ZxxxVFM4

MKL26ZxxxVFT4

MKL26ZxxxVLH4

Designed with efficiency in mind. Compatible with all other

Kinetis L families as well as Kinetis K2x family. General purpose

MCU with USB 2.0, featuring market leading ultra low-power to

provide developers an appropriate entry-level 32-bit solution.

This product offers:

• Run power consumption down to 40 μA/MHz in very low

power run mode

• Static power consumption down to 2 μA with full state

retention and 4.5 μs wakeup

• Ultra-efficient Cortex-M0+ processor running up to 48 MHz

64-pin LQFP (LH)

10 x 10 x 1.4 Pitch 0.5 mm

with industry leading throughput

• Memory option is up to 128 KB flash and 16 KB RAM

• Energy-saving architecture is optimized for low power with

90nm TFS technology, clock and power gating techniques, and zero wait state flash memory controller

32-pin QFN (FM)

48-pin QFN (FT)

5 x 5 x 1 Pitch 0.5 mm 7 x 7 x 1 Pitch 0.5 mm

Performance

• 48 MHz ARM

Cortex

-M0+ core

Memories and memory interfaces

• Up to 128 KB program flash memory

• Up to 16 KB SRAM

Human-machine interface

• Low-power hardware touch sensor interface (TSI)

• Up to 50 general-purpose input/output (GPIO)

Communication interfaces

• USB full-/low-speed On-the-Go controller with on-

chip transceiver and 5 V to 3.3 V regulator

System peripherals

• Two 16-bit SPI modules

• Nine low-power modes to provide power optimization

• I2S (SAI) module

based on application requirements

• One low power UART module

• COP Software watchdog

• Two UART modules

• 4-channel DMA controller, supporting up to 63 request

• Two I2C module

sources

Analog Modules

• Low-leakage wakeup unit

• SWD debug interface and Micro Trace Buffer

• 16-bit SAR ADC

• Bit Manipulation Engine

• 12-bit DAC

• Analog comparator (CMP) containing a 6-bit DAC

Clocks

and programmable reference input

• 32 kHz to 40 kHz or 3 MHz to 32 MHz crystal oscillator

• Multi-purpose clock source

Timers

• Six channel Timer/PWM (TPM)

Operating Characteristics

• Two 2-channel Timer/PWM modules

• Voltage range: 1.71 to 3.6 V

• Periodic interrupt timers

• Flash write voltage range: 1.71 to 3.6 V

• 16-bit low-power timer (LPTMR)

• Temperature range (ambient): -40 to 105°C

• Real time clock

Freescale reserves the right to change the detail specifications as may be required to

Table of Contents

1 Ratings.................................................................................. 4

1.1 Thermal handling ratings............................................... 4

1.2 Moisture handling ratings...............................................4

1.3 ESD handling ratings..................................................... 4

1.4 Voltage and current operating ratings............................4

2 General................................................................................. 5

2.1 AC electrical characteristics...........................................5

2.2 Nonswitching electrical specifications............................6

2.2.1 Voltage and current operating requirements......6

2.2.2 LVD and POR operating requirements.............. 6

2.2.3 Voltage and current operating behaviors........... 7

2.2.4 Power mode transition operating behaviors.......8

2.2.5 Power consumption operating behaviors...........9

2.2.6 EMC radiated emissions operating behaviors... 15

2.2.7 Designing with radiated emissions in mind........ 16

2.2.8 Capacitance attributes....................................... 16

2.3 Switching specifications................................................. 16

2.3.1 Device clock specifications................................ 16

2.3.2 General switching specifications........................17

2.4 Thermal specifications................................................... 17

2.4.1 Thermal operating requirements........................17

2.4.2 Thermal attributes.............................................. 18

3 Peripheral operating requirements and behaviors................ 18

3.1 Core modules................................................................ 18

3.1.1 SWD electricals .................................................18

3.2 System modules............................................................ 20

3.3 Clock modules............................................................... 20

3.3.1 MCG specifications............................................ 20

3.3.2 Oscillator electrical specifications...................... 22

3.4 Memories and memory interfaces................................. 24

3.4.1 Flash electrical specifications............................ 24

3.5 Security and integrity modules.......................................26

3.6 Analog............................................................................26

3.6.1 ADC electrical specifications..............................26

3.6.2 CMP and 6-bit DAC electrical specifications......31

3.6.3 12-bit DAC electrical characteristics.................. 33

3.7 Timers............................................................................ 36

3.8 Communication interfaces............................................. 36

3.8.1 USB electrical specifications..............................36

3.8.2 USB VREG electrical specifications...................37

3.8.3 SPI switching specifications...............................37

3.8.4 Inter-Integrated Circuit Interface (I2C) timing.....42

3.8.5 UART................................................................. 43

3.8.6 I2S/SAI switching specifications........................ 43

3.9 Human-machine interfaces (HMI).................................. 47

3.9.1 TSI electrical specifications................................47

Dimensions........................................................................... 48

4.1 Obtaining package dimensions......................................48

Pinout.................................................................................... 48

5.1 KL26 Signal Multiplexing and Pin Assignments.............48

5.2 KL26 pinouts.................................................................. 51

Ordering parts....................................................................... 54

6.1 Determining valid orderable parts.................................. 54

Part identification...................................................................54

7.1 Description..................................................................... 55

7.2 Format........................................................................... 55

7.3 Fields............................................................................. 55

7.4 Example......................................................................... 55

Terminology and guidelines.................................................. 56

8.1 Definition: Operating requirement.................................. 56

8.2 Definition: Operating behavior....................................... 56

8.3 Definition: Attribute........................................................ 56

8.4 Definition: Rating........................................................... 57

8.5 Result of exceeding a rating.......................................... 57

8.6 Relationship between ratings and operating

requirements.................................................................. 57

8.7 Guidelines for ratings and operating requirements........ 58

8.8 Definition: Typical value................................................. 58

8.9 Typical value conditions.................................................59

9 Revision history.....................................................................60

Kinetis KL26 Sub-Family, Rev5 08/2014.

Freescale Semiconductor, Inc.

MKL26Z128VFT4R Related Products

	MKL26Z128VFT4R	MKL26Z64VFT4R	MKL26Z128VLH4R	MKL26Z128VFT4	935321827557	935324624528	935324624557
Description	KINETIS KL26: 48MHZ CORTEX-M0+ U	IC MCU 32BIT 64KB FLASH 48QFN	IC MCU 32BIT 128KB FLASH 64LQFP	Working voltage: 1.71V ~ 3.6V CPU bits: 32-Bit CPU core: ARM® Cortex®-M0+ Main frequency (MAX): 48MHz ROM type: FLASH	RISC Microcontroller	RISC Microcontroller	RISC Microcontroller
speed	48MHz	48MHz	48MHz	48 MHz	-	-	-
Maker	-	-	-	NXP	NXP	NXP	NXP
Reach Compliance Code	-	-	-	compliant	unknow	unknow	unknow
uPs/uCs/peripheral integrated circuit type	-	-	-	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC	MICROCONTROLLER, RISC

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