High-End 18-Bit Sensor Signal
Conditioner
ZSSC3218
Datasheet
Brief Description
The ZSSC3218 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential or
pseudo-differential input signal. Designed for high-
resolution sensor module applications, the
st
nd
ZSSC3218 can perform offset, span, and 1 and 2
order temperature compensation of the measured
signal. Developed for correction of resistive bridge or
absolute voltage sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected sensor values are
provided at the digital output pins, which can be
2
configured as I C™* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a
26-bit internal digital signal processor (DSP) running
a correction algorithm. Calibration coefficients are
stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3218 is simple via the serial
interface. The interface is used for the PC-controlled
calibration procedure, which programs the set of
calibration coefficients in memory. The ZSSC3218
provides accelerated signal processing, increased
resolution, and improved noise immunity in order to
support high-speed control, safety, and real-time
sensing applications with the highest requirements
for energy efficiency.
•
•
•
•
•
•
•
•
•
Benefits
Integrated 26-bit calibration math digital signal
processor (DSP)
Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering com-
ponents required
Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute
voltage (e.g., thermopile) sensor modules
Physical Characteristics
•
•
•
•
•
•
•
•
Supply voltage range: 1.68V to 3.6V
Current consumption: 1.0mA (operating mode)
Sleep State current: 20nA (typical)
Temperature resolution: <0.003K/LSB
Best-in-class energy-efficiency:
with 16-bit resolution: <140pJ/step
with 18-bit resolution: <50pJ/step
Operation temperature: –40°C to +85°C
Small die size
Delivery options: die for wafer bonding
Features
•
•
•
•
•
•
•
Flexible, programmable analog front-end design;
up to 18-bit analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing
sensor signals: gain range 6.6 to 216 (linear)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
st
nd
1 and 2 order digital compensation of sensor
st
nd
gain as well as 1 and 2 order temperature gain
and offset drift
Programmable interrupt operation
High-speed sensing: e.g. 16-bit conditioned
-1
sensor signal measurement rate >500s
Typical sensor elements can achieve an accu-
racy of better than ±0.10% FSO** at -40 to 85°C
*
I
2
C™ is a trademark of NXP.
**
FSO = Full Scale Output.
ZSSC3218 Application Example
VSS
VDD
VDD
Stacked-Die Sensor Module
VDD
VSS
VSS
VDDB
RES
RES
VDDB
INN
EOC
MISO
MISO
SCLK
SCL
INN(-)
VSSB
sensor element
INP
VSSB
MOSI
SDA
INP(+)
SS
MOSI
SDA
Signal Output /
Post-processing
Batte
ry
ZSSC3218
SS
SCLK
SCL
Microcontroller
EOC
© 2016 Integrated Device Technology, Inc.
1
April 20, 2016
High-End 18-Bit Sensor Signal
Conditioner
ZSSC3218
Datasheet
ZSSC3218
Block Diagram
VDDB
V
TP
V
TN
Vreg int
Temperature
Reference
Sensor
V
DD
AGND / CM
Generator
Bias Current
Generator
Power Ctr.
Voltage
Regulator
V
SS
ZSSC3218
Multiplexer
A
Pre-
Amplifier
Sensor
Bridge
INP
INN
VSSB
D
18 Bit
DSP Core
(Calculations,
Communication)
EOC
SPI
Power-ON
Reset
Clock
Generator
Oscillator
System
Control
Unit
MTP
I²C
TM
SCLK/SCL
SS
MOSI/SDA
MISO
RES
Applications
Barometric altitude measurement for
portable navigation or emergency call
systems
Altitude measurement for car navigation
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
High-resolution temperature measurements
Object-temperature radiation (via thermopile)
Sales Code
ZSSC3218BI1B
ZSSC3218BI2B
ZSSC3218BI3R ES
Description
Die—temperature range: –40°C to +85 °C; thickness 304µm
Die—temperature range: –40°C to +85 °C; thickness 725µm
(w/o backlapping)
PQFN24—temperature range: –40°C to +85 °C;
engineering
samples
Package
Unsawn wafer
Unsawn wafer
Packaged die
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit
www.idt.com/go/glossary.
All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
2
April 20, 2016
ZSSC3218 Datasheet
Table of Contents
IC Characteristics .......................................................................................................................................... 6
1.1. Absolute Maximum Ratings .................................................................................................................... 6
1.2. Operating Conditions .............................................................................................................................. 6
1.3. Electrical Parameters ............................................................................................................................. 7
1.4. Power Supply Rejection Ratio (PSRR) vs. Frequency ........................................................................... 9
2 Circuit Description ....................................................................................................................................... 10
2.1. Brief Description ................................................................................................................................... 10
2.2. Signal Flow and Block Diagram............................................................................................................ 10
2.3. Analog Front End .................................................................................................................................. 11
2.3.1. Amplifier ......................................................................................................................................... 11
2.3.2. Analog-to-Digital Converter ............................................................................................................ 13
2.3.3. Selection of Gain and Offset – Sensor System Dimensioning ...................................................... 15
2.3.4. Temperature Measurement ........................................................................................................... 16
2.3.5. External Sensor Supply: Bridge Sensors ....................................................................................... 16
2.3.6. External Sensor: Absolute Voltage Source Sensors ..................................................................... 16
2.4. Digital Section ....................................................................................................................................... 17
2.4.1. Digital Signal Processor (DSP) Core ............................................................................................. 17
2.4.2. MTP Memory.................................................................................................................................. 17
2.4.3. Clock Generator ............................................................................................................................. 17
2.4.4. Power Supervision ......................................................................................................................... 17
2.4.5. Interface ......................................................................................................................................... 17
3 Functional Description ................................................................................................................................. 18
3.1. Power Up .............................................................................................................................................. 18
3.2. Measurements ...................................................................................................................................... 18
3.3. Interrupt (EOC Pin) ............................................................................................................................... 19
3.4. Operational Modes ............................................................................................................................... 21
2
3.4.1. SPI/I C™ Commands .................................................................................................................... 24
3.5. Communication Interface ...................................................................................................................... 27
3.5.1. Common Functionality ................................................................................................................... 27
3.5.2. SPI.................................................................................................................................................. 28
2
3.5.3. I C™ ............................................................................................................................................... 30
3.6. Multiple Time Programmable (MTP) Memory ...................................................................................... 32
3.6.1. Programming Memory.................................................................................................................... 32
3.6.2. Memory Contents ........................................................................................................................... 33
3.7. Calibration Sequence ........................................................................................................................... 41
3.7.1. Calibration Step 1 – Assigning Unique Identification ..................................................................... 41
3.7.2. Calibration Step 2 – Data Collection .............................................................................................. 42
1
© 2016 Integrated Device Technology, Inc.
3
April 20, 2016
ZSSC3218 Datasheet
4
5
6
7
8
9
3.7.3. Calibration Step 3a) – Coefficient Calculations ............................................................................. 43
3.7.4. Calibration Step 3b) – Post-Calibration Offset Correction ............................................................. 43
3.7.5. SSC Measurements ....................................................................................................................... 43
3.8. The Calibration Math ............................................................................................................................ 44
3.8.1. Bridge Signal Compensation ......................................................................................................... 44
3.8.2. Temperature Signal Compensation ............................................................................................... 47
3.8.3. Measurement Output Data Format ................................................................................................ 48
Package Information and Pad Assignments ............................................................................................... 49
Quality and Reliability .................................................................................................................................. 53
Ordering Sales Codes ................................................................................................................................. 53
Related Documents ..................................................................................................................................... 53
Glossary ...................................................................................................................................................... 54
Document Revision History ......................................................................................................................... 55
Table of Figures
Figure 2.1
Figure 2.2
Figure 2.3
Figure 3.1
Figure 3.2
Figure 3.3
Figure 3.4
Figure 3.5
Figure 3.6
Figure 3.7
Figure 3.8
Figure 3.9
Figure 3.10
Figure 3.11
Figure 4.1
Figure 4.2
ZSSC3218 Functional Block Diagram, Resistive-Bridge Sensor .................................................. 10
ZSSC3218 Functional Block Diagram, Voltage-Source Sensor .................................................... 11
Gain and Offset Setup ................................................................................................................... 16
Interrupt Functionality .................................................................................................................... 20
Operational Flow Chart: Power Up ................................................................................................ 22
Operational Flow Chart: Command Mode and Normal Mode (Sleep and Cyclic) ......................... 23
SPI Configuration CPHA=0............................................................................................................ 28
SPI Configuration CPHA=1............................................................................................................ 29
SPI Command Request ................................................................................................................. 29
SPI Read Status ............................................................................................................................ 30
SPI Read Data ............................................................................................................................... 30
I
2
C™ Command Request .............................................................................................................. 31
I C™ Read Status .......................................................................................................................... 31
2
I C™ Read Data ............................................................................................................................ 31
ZSSC3218 Pad Placement ............................................................................................................ 49
General PQFN24 Package Dimensions ........................................................................................ 51
2
List of Tables
Table 1.1
Table 1.2
Table 1.3
Maximum Ratings ............................................................................................................................ 6
Operating Conditions ....................................................................................................................... 6
Requirements for VDD Power-on Reset .......................................................................................... 7
© 2016 Integrated Device Technology, Inc.
4
April 20, 2016
ZSSC3218 Datasheet
Table 1.4
Table 2.1
Table 2.2
Table 2.3
Table 2.4
Table 2.5
Table 2.6
Table 3.1
Table 3.2
Table 3.3
Table 3.4
Table 3.5
Table 3.6
Table 3.7
Table 3.8
Table 3.9
Table 4.1
Table 4.2
Table 4.3
Table 4.4
Electrical Parameters ....................................................................................................................... 7
Amplifier Gain: Stage 1 .................................................................................................................. 12
Amplifier Gain: Stage 2 .................................................................................................................. 12
Gain Polarity .................................................................................................................................. 12
ADC Conversion Times for a Single Analog-to-Digital Conversion ............................................... 13
ADC Offset Shift............................................................................................................................. 14
Typical Conversion Times vs. Noise Performance with Full Sensor Signal Conditioning for AZSM,
SM, AZTM, and TM (Bridge-Type Sensor) .................................................................................... 14
2
SPI/I C™ Commands .................................................................................................................... 24
Get_Raw Commands .................................................................................................................... 26
General Status Byte ....................................................................................................................... 27
Mode Status ................................................................................................................................... 28
MTP Memory Content Assignments .............................................................................................. 33
Measurement Results of ADC Raw Measurement Request (two’s complement) ......................... 48
Calibration Coefficients (Factors and Summands) in Memory (sign-magnitude) .......................... 48
Output Results from SSC-Correction Math or DSP—Sensor and Temperature ........................... 48
Interrupt Thresholds TRSH1 and TRSH2—Format as for SSC-Correction Math Output ............. 48
Pad Assignments ........................................................................................................................... 50
Die Connection and Bond Parameter ............................................................................................ 50
Physical Package Dimensions ....................................................................................................... 51
Pin Assignments PQFN24 ............................................................................................................. 52
© 2016 Integrated Device Technology, Inc.
5
April 20, 2016
京公网安备 11010802033920号
EEWORLD
