NXP Semiconductors
Data sheet: Technical data
Document Number: MMA26xxLW
Rev. 8, 01/2017
MMA26xx, DSI Inertial Sensor
The MMA26xx family, a SafeAssure solution, includes DSI2.5 compatible
overdamped X-axis satellite accelerometers.
Features
•
•
•
•
•
•
•
±25 g to ±312.5 g nominal full-scale range
Selectable 180 Hz, 2-pole, 400 Hz, 4-pole, or 800 Hz, 4-pole LPF
DSI2.5 compatible with full support of mandatory commands
Internal high side bus switch for DSI2.5 daisy chain applications
16
μs
internal sample rate, with interpolation to 1 ms
-40 °C to 125 °C operating temperature range
Pb-free 16-pin QFN, 6 mm x 6 mm package
Bottom View
MMA26xx
Typical Applications
• Airbag front and side crash detection
Referenced Documents
• Qualified AEC-Q100, Revision G, Grade 1 (-40°C to +125°C)
(http://www.aecouncil.com/)
Ordering information
Device
MMA2602KGCW
MMA2605KGCW
MMA2606KGCW
MMA2612KGCW
MMA2618KGCW
MMA2631KGCW
MMA2602KGCWR2
MMA2605KGCWR2
MMA2606KGCWR2
MMA2612KGCWR2
MMA2618KGCWR2
MMA2631KGCWR2
Axis
X
X
X
X
X
X
X
X
X
X
X
X
Range
25 g
50 g
62.5 g
125 g
187 g
312 g
25 g
50 g
62.5 g
125 g
187 g
312 g
Package
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
98ASA00690D
Shipping
Tubes
Tubes
Tubes
Tubes
Tubes
Tubes
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Tape & Reel
Pb-free, 16-pin QFN
6 mm x 6 mm x 1.98 mm package
Top View
TEST7
TEST6
TEST5
12 V
SSA
11 C
REGA
10 TEST4
9 C
REG
5
PCM
6
BUSOUT
7
BUSIN
8
HCAP
16 15 14 13
TEST2 1
TEST3 2
TEST1 3
BUSRTN 4
17
Pin connections
© 2017 NXP B.V.
V
SS
TEST2
TEST1
TEST3
TEST4
TEST5
TEST6
TEST7
C
REG
C
REGA
C4
C5
V
SSA
V
SS
BUSIN
V
CC
C1
BUSIN
MMA26xx
V
SS
BUSRTN
BUSRTN
C2
BUSOUT
HCAP
C3
PCM
BUSOUT
Figure 1. Application Diagram
Table 1. External Component Recommendations
Ref Des
C1
C2
C3
C4
C5
Type
Ceramic
Ceramic
Ceramic, Tantalum
Ceramic
Ceramic
Description
Purpose
100 pF
≤
C1
≤
1500 pF 10%, 50 V, X7R BUSIN Power Supply Decoupling, ESD
100 pF
≤
C2
≤
1500 pF, 10%, 50 V, X7R BUSOUT Power Supply Decoupling, ESD
1
μF
≤
C3
≤
100
μF,
10 %, 50 V, X7R
1
μF,
10%, 10 V, X7R
1
μF,
10%, 10 V, X7R
Reservoir Capacitor for Keep Alive during Signaling
Voltage Regulator Output Capacitor (C
REG
)
Voltage Regulator Output Capacitor (C
REGA
)
xxxxxxx
xxxxxxx
X: 0 g
MMA26xx
2
Sensors
NXP Semiconductors
xxxxxxx
xxxxxxx
X: +1 g
TTT
Figure 2. Device Orientation Diagram
MMA26xx
KGCW
AWLYWWZ
xxxxxxx
xxxxxxx
X: 0 g
xxxxxxx
xxxxxxx
X: -1 g
EARTH GROUND
X: 0 g
X: 0 g
Data Code Legend:
A: Assembly Location
WL: Wafer Lot Number (g-cell Lot Number)
Y: Year
WW: Work Week
Z: Assembly Lot Number
Figure 3. Part Marking
HCAP
BUSIN
DIGITAL
V
REG
VOLTAGE
REGULATOR
ANALOG
V
REGA
VOLTAGE
REGULATOR
REFERENCE
VOLTAGE
HCAP
C
REG
V
DSI_REF
C
REGA
V
SSA
V
REF
LOW-VOLTAGE
RESET
BUSOUT
V
DSI_REF
BUSRTN
V
SS
SERIAL
ENCODER
CONTROL
LOGIC
TEST3
TEST
TEST4
TEST5
TEST6
OSCILLATOR
OTP
FUSE
ARRAY
V
REG
SELF-TEST
INTERFACE
V
REGA
V
REG
SINC Filter
CONTROL
IN
STATUS
OUT
DSP
g-CELL
ΣΔ
CONVERTER
3
1
–
z
–
D
--------------------------------
-
D
× (
1
–
z
–
1
)
IIR
Low-Pass Filter Compensation
PCM Encoder
PCM
Figure 4. Internal Block Diagram
MMA26xx
Sensors
NXP Semiconductors
3
1
Pin Connections
TEST7
TEST6
TEST5
12 V
SSA
11 C
REGA
10 TEST4
9 C
REG
5
PCM
6
BUSOUT
7
BUSIN
8
H
CAP
Definition
This pin must be left unconnected in the application.
This pin must be grounded in the application.
This pin must be grounded in the application.
This pin is the common return for power and signalling.
This pin provides a 4 MHz PCM signal proportional to the acceleration data for test purposes. The output can
be enabled or disabled via OTP. If unused, this pin must be left unconnected in the application. Reference
Section 3.5.3.6.
This pin is internally connected to BUSIN through a switch. For daisy chain configurations, this pin is con-
nected to the BUSIN pin of the next slave on the DSI bus. The internal bus switch is open following reset, and
is closed when an Initialization command is received.
This pin is connected to the DSI positive bus node and provides the power supply and communication to the
system master. An external capacitor must be connected to between this pin and the BUSRTN pin. Refer-
ence
Figure 1.
This pin rectifies the supply voltage on the BUSIN pin to create the supply voltage for the device. An external
capacitor must be connected between this pin and the BUSRTN pin to store energy for operation during
master communication signalling. Reference
Figure 1.
This pin is connected to the power supply for the internal digital circuitry. An external capacitor must be con-
nected between this pin and V
SS
. Reference
Figure 1.
This pin must be grounded in the application.
This pin is connected to the power supply for the internal analog circuitry. An external capacitor must be con-
nected between this pin and V
SSA
. Reference
Figure 1.
This pin is the power supply return node for analog circuitry.
This pin enables test mode, and provides the SPI programming voltage in test mode. This pin is must be
grounded in the application.
This pin must be grounded in the application.
This pin must be grounded in the application.
This pin is the power supply return node for the digital circuitry.
This pin is the die attach flag, and should be connected to VSS in the application. Reference
Section 5.
16 15 14 13
TEST2 1
TEST3 2
TEST1 3
BUSRTN
4
17
Table 2. Pin Description
Pin
1
2
3
4
5
Pin
Name
TEST2
TEST3
TEST1
BUSRTN
PCM
Formal Name
Test Pin
Test Pin
Test Pin
Ground
PCM
Output
6
BUSOUT
BUS output
7
BUSIN
Supply /
Comm
Hold
Capacitor
Digital
Supply
Test Pin
Analog
Supply
Analog GND
Test Pin
Test Pin
Test Pin
Digital GND
Die Attach
Pad
8
HCAP
9
10
11
12
13
14
15
16
17
C
REG
TEST4
C
REGA
VSSA
TEST5
TEST6
TEST7
V
SS
PAD
MMA26xx
4
Sensors
NXP Semiconductors
V
SS
Figure 5. Pinout
Table 2. Pin Description
Pin
Pin
Name
Corner
Pads
Formal Name
Corner Pads The corner pads are internally connected to V
SS
.
Definition
2
2.1
Electrical Characteristics
Maximum Ratings
Maximum ratings are the extreme limits to which the device can be exposed without permanently damaging it. Do not apply
voltages higher than those shown in the table below.
#
1
2
3
4
5
6
7
8
9
10
11
12
13
14
Rating
Supply Voltage (continuous) (BUSIN,BUSOUT, HCAP)
Supply Voltage (pulsed < 400 ms, repetition rate 60s) (BUSIN,BUSOUT, HCAP)
C
REG
, C
REGA,
PCM, TEST1, TEST2, TEST3, TEST4, TEST5, TEST6, TEST7
BUSIN,BUSOUT, BUSRTN and H
CAP
Current
Maximum duration 1 s
Continuous
Powered Shock (six sides, 0.5 ms duration)
Unpowered Shock (six sides, 0.5 ms duration)
Drop Shock (to concrete, tile or steel surface, 10 drops, any orientation)
Electrostatic Discharge (per AECQ100)
HBM (100 pF, 1.5 kΩ)
CDM (R = 0Ω)
MM (200 pF, 0Ω)
Temperature Range
Storage
Junction
Thermal Resistance
Symbol
V
CC
V
CC
Value
-0.3 to +30.0
-0.3 to +34.0
-0.3 to +3.0
Unit
V
V
V
mA
mA
g
g
m
V
V
V
°C
°C
°C/W
(3)
(3)
(3)
(3)
(3)
(5)
(5)
(5)
(5)
(5)
(5)
(3)
(3)
(11)
I
IN
I
IN
g
pms
g
shock
h
DROP
V
ESD
V
ESD
V
ESD
T
stg
T
J
θ
JC
400
75
±2000
±2000
1.2
±2000
±500
±200
-40 to +125
-40 to +150
2.5
2.2
Operating Range
The operating ratings are the limits normally expected in the application.
V
L
≤
(V
CC
- V
SS
)
≤
V
H
, T
L
≤
T
A
≤
T
H
,
ΔT ≤
25 K/min, unless otherwise specified.
#
15
16
17
18
19
20
Supply Voltage
V
HCAP
BUSIN
Programming Voltage
Applied to BUSIN (DSI)
Programming Current
BUSIN
Operating Temperature Range
T
A
T
A
Characteristic
Symbol
V
HCAP
V
BUS
V
PP
I
PP
Min
V
L
6.3
-0.3
14.0
85
T
L
-40
-40
Typ
⎯
⎯
⎯
⎯
⎯
⎯
Max
V
H
30
30
30.0
⎯
T
H
+105
+125
Units
V
V
V
mA
°C
°C
(1,12)
(1,12)
(3)
(3)
(1)
(3)
MMA26xx
Sensors
NXP Semiconductors
5
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