PC96
Non Silicone Gap Filler
Description
PC96 is a yellowish white, highly filled tacky non silicone system suitable thermal dissipation of electronic devices. It has stable pot life and long
shelf life even at room temperature of 25 °C.
Applications
Heat dissipation from electronic components.
Guidelines for Use
1.
2.
3.
4.
5.
Wear rubber gloves when handling the product.
Pick up some of the product from the container using hand.
Peel off the liner. Place the product in required electronic part and circuit by hand.
Not require heating and curing.
The product can be applied and removed easily (care must be taken during installation to avoid tearing).
Properties
Property
Appearance
Tackiness
Viscosity, Brookfield Cap 2000+, 25°C
Operating temperature
Thermal Conductivity
Density
Hardness
Typical Value
Yellowish White
Both Sides
Pad
-40 to 125
2.5
1.5
50
Unit
-
-
cP
°C
W/mK
g/cm³
Shore 00
Test Method
Pen 10
-
Pen 44
Pen 92
ISO/DIS 22007
Pen 14
Pen 111
Packaging
Standard sheets
Customized shapes
Storage
Store this silicone thermal pad in air tight container, cool, dark place (temperature range from 20⁰C to 30⁰C) to prolong shelf life. Prevent
moisture condition.
NOTICE:
The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential
use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should
make their own test to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed
or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent
otherwise stated T-Global Technology Europe and North America’s invoice, quotation, or order acknowledgment. We disclaim any and liability
incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore,
nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with
existing future patents covering any product or material or its use.
Tel:
+44 (0) 1455 553 510
Email:
sales@tglobaltechnology.com
Web:
www.tglobaltechnology.com
Skype:
tglobal.technology
Microchip MCU
京公网安备 11010802033920号
EEWORLD
