A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
I live in Zhanjiang and want to buy Zhou Ligong's development board EasyARM2131, but I don't have any way. Please provide me with some information. Thank you. . . . . . ....
:) LSI sold its mobile phone chip business to Infineon, and ADI also sold its mobile phone chip business to MTK, and may withdraw from the entire DSP business including Blackfin processors. In additio...
The problem is as follows. I use nor flash as storage. I write data to the flash and then read it out to verify whether the read and write operations are correct. But the problem now is: when I write ...
[i=s]This post was last edited by qwqwqw2088 on 2019-5-5 08:35[/i] [size=4]1. Common low-pass filter circuits[/size] [align=center][/align] [align=center][/align] [align=center][/align]...
[i=s]This post was last edited by dcexpert on 2016-1-22 15:07[/i] STM32F746 is not finished yet, and STM32F779 is out. ST releases chips really fast. With the same M7 core, what are the similarities a...
On August 24th, Jin Yuzhi, CEO of Huawei's Intelligent Automotive Solutions BU, announced the first automotive application of Huawei Qiankun's unique Limera technology. This technology eliminates t...[Details]
Reflow soldering is a critical process in electronics assembly production, and the cleanliness of the reflow oven has a direct impact on product quality. Dust and residue accumulation within the ov...[Details]
Based on the commutation technology, thyristor rectifiers are classified into two main types. Line-commutated and force-commutated inverters are commonly used, while other commutated inverters, nam...[Details]
A human-machine interface (HMI) refers to the platform used by people to operate a PLC. This platform provides an interface between programs and humans, serving as a medium for information transmis...[Details]
With the gradual popularization of new energy vehicles in recent years, more and more people have been able to access and purchase electric vehicles. The structure of electric vehicles is composed ...[Details]
Puttshack's Trackaball uses the Nordic nRF54L15 system-on-chip (SoC) to monitor sensors and enable Bluetooth low energy connectivity, while the nPM2100 power management integrated circuit (PMIC) ...[Details]
The composition of the water heater
The water heater itself is divided into the following parts:
1. Water tank.
This is where the water heater is filled with water and where the wate...[Details]
With the prevalence of online conferencing, live streaming, and voice communication in gaming, high-quality audio input devices are becoming increasingly important. To this end, XMOS, an expert in ...[Details]
On August 20, it was reported that the specifications of Intel's upcoming Panther Lake mobile processor appeared on the Intel GFX CI website, which mainly focuses on Intel's open source Linux drive...[Details]
Since the beginning of the 21st century, with the rapid development of my country's urban and rural economies and the improvement of people's living standards, more and more people have begun to ow...[Details]
With the development of vehicle technology, there are more types of cars. Cars are divided into hybrid, pure electric vehicles, and fuel vehicles. For hybrid cars, they are divided into plug-in hyb...[Details]
The transition to SDVs (software-defined vehicles) involves more than just replacing parts; rather, it involves the organic connection of various elements, from internal vehicle systems to ext...[Details]
Let’s first take a look at the development concept of the EVD series.
The EVD control module is specially developed for operation in extreme environments. Components that meet these requiremen...[Details]
System Principle
According to the average imbalance rate of the branch three-phase phase line load and the average value of the branch phase line current, the adjustment of the phase line load...[Details]
Shenzhen RF Star's Bluetooth smart e-cigarette solution, by embedding a BLE module in the third-generation e-cigarette tube and coordinating it with the development of a smartphone APP, bring...[Details]
ARM Technology
京公网安备 11010802033920号
EEWORLD
