0465562547 datasheet, PDF - EEWORLD Datasheet

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0465562547: DescriptionCONN MALE 80POS 4ROWS GOLD SMD; CategoryThe connector; File Size344KB，3 Pages; ManufacturerMolex Premise Network; Environmental Compliance

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0465562547 Overview

CONN MALE 80POS 4ROWS GOLD SMD

0465562547 Parametric

Parameter Name	Attribute value
Connector type	High density array, public shape
Number of pins	80
spacing	0.050"（1.27mm）
Number of rows	4
Installation type	surface mount
characteristic	board guide
Contact plating	gold
Contact plating thickness	30.0µin（0.76µm）
Joint stack height	9.5mm，10.5mm，11mm，12mm，12.5mm
board height	0.319"（8.10mm）

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10

9

8

7

6

5

4

3

2

1

F

1.60

.063

DIM G

+0.13

-0.15

+0.005

DIM G

-0.006

11.0

.43

7.06

E

1.52

.060

+0.13

-0.15

+.005

.278

-.006

8.0

.31

CIRCUIT ONE IDENTIFIER

NOTES:

1. MATERIALS: HOUSING: GLASS FILLED LCP (LIQUID CRYSTAL POLYMER),

UL94V-0, BLACK

CONTACTS: COPPER ALLOY

SOLDER CHARGE: 95.5% TIN. 3.8% SILVER, 0.7 % COPPER

2. FINISHES:

CONTACT AREA: 30 MICROINCH MINIMUM GOLD

TAIL AREA:

-*1** ASSEMBLIES: 7 MICROINCH MINIMUM GOLD

ALL OTHER ASSEMBLIES: 50 MICROINCH MINIMUM TIN

ENTIRE TERMINAL: NICKEL UNDERPLATE

3. PRODUCT SPECIFICATION: PS-45970-001

4. PACKAGING SPECIFICATION: PK-45970-002 (TAPE AND REEL)

5. MATES WITH SEARAY RECEPTACLE ASSEMBLY SERIES 46557

6. APPLICATION SPECIFICATION: AS-45970-001

7. COSMETIC SPECIFICATION: PS-45499-002 CLASS B

8. PART STATUS: CONTACT MOLEX

F

E

PICK AND PLACE PAD

(SHOWN IN THIS VIEW ONLY)

X-YDDD

D

DATE CODE

⌓

SEE TABLE

DIM H

ACROSS ALL

SOLDER

CHARGES

DIM P

REF ONLY

MATING STACK

HEIGHT

(MILLIMETERS)

PO

+0.100

-0.110

+0.004

DIM H

-0.004

D

LEAD CODE: 1 = TIN

NOTE: THESE CODES MAY BE LOCATED ON

EITHER SIDE OF THE HOUSING

1.27

2 PLACES

.050

C

0.70

.028

5.08

.200

TYPICAL

7.57

.298

2 PLACES

SIT

I

ON

C

S

POSITIONS

DIM G

⌓

10 POSITION SHOWN

X-

YD

D

HEIGHTS

B

0.70

.027

EDGE NOTCHES- SEE TABLE

(THE NUMBER OF NOTCHES INCREASES AS

THE NUMBER OF POSITIONS INCREASES)

SYMBOLS

=

0

=

0

=

0

=

0

=

0

=

0

DIMENSION UNITS

10

15

20

25

30

35

40

45

50

SCALE

17.69/.698

24.04/.948

30.39/1.198

36.74/1.448

43.09/1.698

49.44/1.948

55.79/2.198

62.14/2.448

68.49/2.698

0.15/.006

0.23/.009

TOTAL NUMBER

OF EDGE NOTCHES

4

6

10

12

14

16

20

22

24

B

THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION

MM/IN

ANGULAR TOL

±

4:1

0.5 °

CURRENT REV DESC: MIGRATED TO

NX/ECTR

GENERAL TOLERANCES

(UNLESS SPECIFIED)

EC NO:

605096

4 PLACES

3 PLACES

2 PLACES

1 PLACE

0 PLACES

0.25

0.38

A

DOCUMENT STATUS

FORMAT: master-tb-prod-B

REVISION: H

DATE: 2018/01/18

=

0

=

0

DRWN:

VK10

CHK'D: DMCGOWAN

APPR:

DMCGOWAN

INITIAL REVISION:

DRWN:

TGREGORI

APPR:

JCOMERCI

THIRD ANGLE PROJECTION

DRAWING

2018/09/24

2018/09/27

2007/06/28

2007/06/29

SERIES

SEARAY SLIM (4 ROW)

PLUG, ASSEMBLY 1.27/.050 PITCH

PRODUCT CUSTOMER DRAWING

DOCUMENT NUMBER

DOC TYPE

DOC PART

REVISION

SD-46556-001

MATERIAL NUMBER

CUSTOMER

PSD

001

N1

A

P1

RELEASE DATE

2018/09/27

18:23:55

C

=

0

DRAFT WHERE APPLICABLE

MUST REMAIN

WITHIN DIMENSIONS

SHEET NUMBER

B-SIZE

46556

SEE TABLE SHT 3

GENERAL MARKET

1 OF 3

10

9

8

7

6

5

4

3

2

1

0465562547 Related Products

	0465562547	0465562347	0465562747	0465564347	0465567347	0465562545
Description	CONN MALE 80POS 4ROWS GOLD SMD	CONN MALE 80POS 4ROWS GOLD SMD	CONN MALE 80POS 4ROWS GOLD SMD	CONN MALE 160POS 4ROWS GOLD SMD	CONN MALE 100POS 4ROWS GOLD SMD	CONN MALE 80POS 4ROWS GOLD SMD
Connector type	High density array, public shape	High density array, public shape	High density array, public shape	High density array, public shape	High density array, public shape	High density array, public shape
Number of pins	80	80	80	160	100	80
spacing	0.050"（1.27mm）	0.050"（1.27mm）	0.050"（1.27mm）	0.050"（1.27mm）	0.050"（1.27mm）	0.050"（1.27mm）
Number of rows	4	4	4	4	4	4
Installation type	surface mount	surface mount	surface mount	surface mount	surface mount	surface mount
characteristic	board guide	board guide	board guide	board guide	board guide	board guide
Contact plating	gold	gold	gold	gold	gold	gold
Contact plating thickness	30.0µin（0.76µm）	30.0µin（0.76µm）	30.0µin（0.76µm）	30.0µin（0.76µm）	30.0µin（0.76µm）	30.0µin（0.76µm）
Joint stack height	9.5mm，10.5mm，11mm，12mm，12.5mm	8.5mm，9.5mm，10mm，11mm，11.5mm	12mm，13mm，13.5mm，14.5mm，15mm	8.5mm，9.5mm，10mm，11mm，11.5mm	8.5mm，9.5mm，10mm，11mm，11.5mm	9.5mm，10.5mm，11mm，12mm，12.5mm
board height	0.319"（8.10mm）	0.280"（7.10mm）	0.419"（10.64mm）	0.280"（7.10mm）	0.280"（7.10mm）	0.319"（8.10mm）

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