A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
#include stdio.hinline int getX(int x)
{return x + (int)x;
}int main()
{printf("%d", getX((int)main));
}The code is very simple, gcc does not open optimization link error. undefined reference to `getX...
Hello everyone, I have just started learning wince drivers and now I have encountered this problem. I customized the system under wince5.0 and the hardware platform is X86. How should I proceed?...
General IO Function Description GPIO Ports The24 GPIO pins can be divided into three groups of ports: PA, PB, and PC. The GPIOs in each group of ports are numbered 0-7 according to their bits in the G...
I want to write commands to EP0 of a USB flash drive, just like BUSHOUND sends a standard get descritor command to EP0. How can I do that? Use the standard XP driver. I know that using DeviceIoControl...
[font=楷体_GB2312]High efficiency and high quality seem to be a pair of unsolvable contradictions. Take the R&D link of an enterprise as an example. The technology is complicated and the update is unpre...
Amidst the wave of intelligent automotive transformation, advanced driver assistance is gradually emerging from cutting-edge technology into the mainstream, becoming a new frontier of industry comp...[Details]
Electric vehicles are becoming increasingly popular, with increasingly longer ranges. There are two ways to charge electric vehicles: slow charging and fast charging. Which is the most suitable? Sl...[Details]
Charging is a familiar process for new energy vehicles, and as a source of battery energy, charging piles are crucial. New energy vehicle charging can be divided into fast charging and slow chargin...[Details]
During daily operation of an R-type power transformer, the voltage used varies as the equipment being used adjusts. This raises the question: can the transformer change voltage at this point? The a...[Details]
Consumer demand for premium listening experiences has driven rapid evolution in the wireless headphone market in recent years. Hybrid designs, which utilize two drivers per earbud to enhance sound ...[Details]
Cadence and NVIDIA Collaborate to Revolutionize Power Analysis Technology, Accelerating Development of Billion-Gate AI Designs
Cadence's new Palladium Dynamic Power Analysis applicat...[Details]
New energy electric vehicles are energy-saving, environmentally friendly, have low operating costs, and enjoy strong support from national policies. With the growth in sales of new energy electric ...[Details]
The BB-Black is a development platform based on the TI AM335X processor, manufactured and sold by Embest under license from BeagleBoard.org. The BB-Black boasts superior graphics performance among ...[Details]
End-to-end autonomous driving sounds impressive. Raw data from onboard cameras, radar, lidar, and other sensors is fed directly into a large network, which then outputs steering wheel angle, accele...[Details]
A fuel-powered vehicle primarily consists of four main components: the engine, chassis, body, and electrical system. Compared to fuel-powered vehicles, a pure electric vehicle's structure primarily...[Details]
The automotive industry is hurtling toward a future that will transform transportation just as electricity transformed the way we light the world. Electric and self-driving cars will permanently ch...[Details]
1. Direct starting of squirrel cage motor
1. Contactor self-locking and overload protection
1)
Close the power switch QS, press the start button SB2, the AC contactor KM is...[Details]
Among numerous digital products, smartphones are arguably among the most functional and integrated. We've noticed that mobile phone products are evolving almost year after year, and this evolution ...[Details]
3D-SLISE, a quasi-solid-state electrolyte developed by the Institute of Science Tokyo, enables the production of safe and fast-charging 2.35 V lithium-ion batteries at room temperature and pressure...[Details]
1. How vibration sensors measure vibration
Vibration sensors are mainly used in gas equipment. They can sense disasters such as earthquakes and cut off gas or power supply in time to prevent s...[Details]