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3SMAJ5952B-TP

Description
DIODE ZENER 130V 3W DO214AC
Categorysemiconductor    Discrete semiconductor   
File Size324KB,4 Pages
ManufacturerMicro Commercial Co
Environmental Compliance
Download Datasheet Parametric View All

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3SMAJ5952B-TP Overview

DIODE ZENER 130V 3W DO214AC

3SMAJ5952B-TP Parametric

Parameter NameAttribute value
Voltage - Zener (nominal) (Vz)130V
Tolerance±5%
Power - Max3W
Impedance (max) (Zzt)450 Ohms
Current at different Vr - Reverse leakage current1µA @ 98.8V
Voltage at different If - Forward (Vf1.5V @ 200mA
Operating temperature-55°C ~ 150°C
Installation typesurface mount
Package/casingDO-214AC,SMA
Supplier device packagingDO-214AC(SMA)
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

  !"#
$ %    !"#
3SMAJ5913B
THRU
3SMAJ5956B
3SMAJ59
3.0 Watt
Surface Mount
Silicon
Zener Diodes

Features
3.3thru 200 Volt Voltage Range
Low Inductance, Low Profile Mounting
Glasss Passivated Junction
High specified maximum current(IZM)when adequately heat sinking
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
Halogen
free available upon request by adding suffix "-HF"
Surface Mount Application
Mechanical Data
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Terminals solderable per MIL-STD-750, Method 2026
Polarity is indicated by cathode band.
Packaging: Standard 12mm Tape (see EIA 481)
Maximum temperature for soldering: 260 C for 10 seconds.
0
DO-214AC

(SMA) (LEAD FRAME)
H



J
Maximum Ratings @ 25
o
C Unless Otherwise Specified
A
C
Junction
to
Lead
Junction
to
Ambient
Maximum
Forward
Voltage
Steady State
Power
Dissipation
Operation and
Storage
Temperature
Thermal
Resistance
Thermal
Resistance
V
F
P
d
T
J
,
T
STG
1.5V
3.0W
-55
o
C to
+150
o
C
(Note:
2)
(Note:
3)
E
F
G
DIMENSIONS
INCHES
MIN
.079
.050
.002
---
.030
.065
.189
.157
.090
MM
MIN
2.00
1.27
.05
---
.76
1.65
4.80
4.00
2.25
D
B
R
thJL
R
thJA
25
/W
135
/W
DIM
A
B
C
D
E
F
G
H
J
MAX
.096
.064
.008
.02
.060
.091
.220
.181
.115
MAX
2.44
1.63
.20
.51
1.52
2.32
5.59
4.60
2.92
NOTE
SUGGESTED SOLDER
PAD LAYOUT
0.090"
0.085"
Note:
1.
2.
3.
High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
Forward Current @ 200mA.
Mounted on 5.0mm2 (1oz thick) Iand areas.
Lead temperature at TL=75
o
C
Lead temperature at T
A
=15
O
C
0.070"
Revision:
D
www.mccsemi.com
1 of 4
2013/04/11
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