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TCK106AG,LF

Description
IC POWER DIST LOAD SWITCH 4WCSP
CategoryAnalog mixed-signal IC    Drivers and interfaces   
File Size443KB,12 Pages
ManufacturerToshiba Semiconductor
Websitehttp://toshiba-semicon-storage.com/
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TCK106AG,LF Overview

IC POWER DIST LOAD SWITCH 4WCSP

TCK106AG,LF Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
MakerToshiba Semiconductor
package instructionVFBGA,
Reach Compliance Codeunknown
ECCN codeEAR99
Factory Lead Time12 weeks
Samacsys DescriptionPower Switch ICs - Power Distribution Load Switch IC 1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package
Built-in protectionTRANSIENT
Interface integrated circuit typeBUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 codeS-PBGA-B4
length0.79 mm
Number of functions1
Number of terminals4
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output current flow directionSINK
Nominal output peak current1 A
Package body materialPLASTIC/EPOXY
encapsulated codeVFBGA
Package shapeSQUARE
Package formGRID ARRAY, VERY THIN PROFILE, FINE PITCH
Maximum seat height0.59 mm
Maximum supply voltage5.5 V
Minimum supply voltage1.1 V
Nominal supply voltage1.2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal pitch0.4 mm
Terminal locationBOTTOM
width0.79 mm
TCK106AG/TCK107AG/TCK108AG
TOSHIBA CMOS Linear Integrated Circuit Silicon Monolithic
TCK106AG, TCK107AG, TCK108AG
1.0 A Load Switch IC with Slew Rate Control Driver in Ultra Small Package
The TCK106AG, TCK107AG and TCK108AG are load switch ICs
for a general power management with slew rate control driver,
featuring low ON resistance and wide input voltage operation from
1.1 to 5.5 V. ON resistance is only 34 mΩ typical at 5.0 V, -0.5 A
condition and output current is available on 1.0 A. TCK107AG and
TCK108AG feature output auto-discharge function.
These devices are available in 0.4 mm pitch ultra small package
WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm) .Thus this devices is
ideal for portable applications that require high-density board
assembly such as cellular phone.
WCSP4D
Weight: 0.79 mg (typ.)
Feature
Low ON resistance :
R
ON
= 34 mΩ (typ.) at V
IN
= 5.0 V, -0.5 A
R
ON
= 42 mΩ (typ.) at V
IN
= 3.3 V, -0.5 A
R
ON
= 71 mΩ (typ.) at V
IN
= 1.8 V, -0.5 A
R
ON
= 139 mΩ (typ.) at V
IN
= 1.2 V, -0.2 A
R
ON
= 176 mΩ (typ.) at V
IN
= 1.1 V, -0.2 A
Low Quiescent current
I
Q
= 110 nA (typ.) at V
IN
= 5.5 V, 0 mA
High output current: I
OUT
= 1.0 A
Wide input voltage operation: V
IN
= 1.1 to 5.5 V
Built in Slew rate control driver
Built in Auto-discharge (TCK107AG and TCK108AG)
Active High and Pull down connection between CONTROL and GND (TCK106AG and TCK107AG)
Active Low (TCK108AG)
Ultra small package : WCSP4D (0.79 mm x 0.79 mm, t: 0.55 mm)
Pin Assignment(Top view)
V
IN
(A2)
CONTROL
(B2)
Top marking
6M: TCK106AG
7M: TCK107AG
8M: TCK108AG
V
OUT
(A1)
GND
(B1)
Index
Start of commercial production
2015-06
1
2015-10-05

TCK106AG,LF Related Products

TCK106AG,LF TCK108AG,LF TCK107AG,LF
Description IC POWER DIST LOAD SWITCH 4WCSP IC POWER DIST LOAD SWITCH 4WCSP
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