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DF
N1
01
PMXB56EN
11 January 2017
0D
-3
30 V, N-channel Trench MOSFET
Product data sheet
1. General description
N-channel enhancement mode Field-Effect Transistor (FET) in a leadless ultra small DFN1010D-3
(SOT1215) Surface-Mounted Device (SMD) plastic package using Trench MOSFET technology.
2. Features and benefits
•
•
•
•
•
Trench MOSFET technology
Leadless ultra small and thin SMD plastic package: 1.1 × 1.0 × 0.37 mm
Exposed drain pad for excellent thermal conduction
Very low Drain-Source on-state resistance R
DSon
= 49 mΩ
Very fast switching
3. Applications
•
•
•
•
Low-side load switch and charging switch for portable devices
Power management in battery-driven portables
LED driver
DC-to-DC converters
4. Quick reference data
Table 1. Quick reference data
Symbol
V
DS
V
GS
I
D
R
DSon
[1]
Parameter
drain-source voltage
gate-source voltage
drain current
drain-source on-state
resistance
Conditions
T
j
= 25 °C
V
GS
= 10 V; T
amb
= 25 °C
V
GS
= 10 V; I
D
= 3.2 A; T
j
= 25 °C
[1]
Min
-
-20
-
-
Typ
-
-
-
49
Max
30
20
3.2
55
2
Unit
V
V
A
mΩ
Static characteristics
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm .
NXP Semiconductors
PMXB56EN
30 V, N-channel Trench MOSFET
5. Pinning information
Table 2. Pinning information
Pin
1
2
3
4
Symbol Description
G
S
D
D
gate
source
drain
drain
2
Transparent top view
Simplified outline
1
4
3
Graphic symbol
D
G
S
017aaa253
DFN1010D-3 (SOT1215)
6. Ordering information
Table 3. Ordering information
Type number
PMXB56EN
Package
Name
DFN1010D-3
Description
DFN1010D-3: plastic thermal enhanced ultra thin small outline
package; no leads; 3 terminals; body 1.1 x 1.0 x 0.37 mm
Version
SOT1215
7. Marking
Table 4. Marking codes
Type number
PMXB56EN
READING
DIRECTION
Marking code
01 10 10
MARKING CODE
(EXAMPLE)
YEAR DATE
CODE
VENDOR CODE
PIN 1
INDICATION MARK
MARK-FREE AREA
READING EXAMPLE:
11
01
10
aaa-008041
Fig. 1.
DFN1010D-3 (SOT1215) binary marking code description
PMXB56EN
All information provided in this document is subject to legal disclaimers.
©
NXP Semiconductors N.V. 2017. All rights reserved
Product data sheet
11 January 2017
2 / 15
NXP Semiconductors
PMXB56EN
30 V, N-channel Trench MOSFET
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
V
DS
V
GS
I
D
I
DM
P
tot
Parameter
drain-source voltage
gate-source voltage
drain current
peak drain current
total power dissipation
V
GS
= 10 V; T
amb
= 25 °C
V
GS
= 10 V; T
amb
= 100 °C
T
amb
= 25 °C; single pulse; t
p
≤ 10 µs
T
amb
= 25 °C
T
sp
= 25 °C
T
j
T
amb
T
stg
I
S
[1]
[2]
[2]
[1]
[1]
[1]
Conditions
T
j
= 25 °C
Min
-
-20
-
-
-
-
-
-
-55
-55
-65
Max
30
20
3.2
2.8
15
0.4
1.07
8.33
150
150
150
1
2
Unit
V
V
A
A
A
W
W
W
°C
°C
°C
A
junction temperature
ambient temperature
storage temperature
source current
T
amb
= 25 °C
[1]
Source-drain diode
-
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated, mounting pad for drain 6 cm .
Device mounted on an FR4 Printed Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
120
P
der
(%)
80
017aaa123
120
I
der
(%)
80
017aaa124
40
40
0
- 75
- 25
25
75
125
T
j
(°C)
175
0
- 75
- 25
25
75
125
T
j
(°C)
175
Fig. 2.
Normalized total power dissipation as a
function of junction temperature
Fig. 3.
Normalized continuous drain current as a
function of junction temperature
PMXB56EN
All information provided in this document is subject to legal disclaimers.
©
NXP Semiconductors N.V. 2017. All rights reserved
Product data sheet
11 January 2017
3 / 15
NXP Semiconductors
PMXB56EN
30 V, N-channel Trench MOSFET
10
2
l
D
(A)
10
t
p
= 10 µs
aaa-009040
t
p
= 100 µs
1
t
p
= 1 ms
DC; T
amb
= 25 °C; 6 cm
2
10
-1
DC; T
sp
= 25 °C
t
p
= 10 ms
t
p
= 100 ms
10
-2
10
-1
1
10
V
DS
(V)
10
2
I
DM
= single pulse
Fig. 4.
Safe operating area; junction to ambient; continuous and peak drain currents as a function of drain-
source voltage
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
R
th(j-a)
Parameter
thermal resistance
from junction to
ambient
thermal resistance
from junction to solder
point
Conditions
in free air
[1]
[2]
Min
-
-
-
Typ
271
102
10
Max
312
117
15
Unit
K/W
K/W
K/W
R
th(j-sp)
[1]
[2]
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for drain 6 cm .
10
3
Z
th(j-a)
(K/W)
10
2
duty cycle = 1
0.5
0.25
0.1
0.02
10
0.01
aaa-008918
0.75
0.33
0.2
0.05
0
1
10
-3
10-2
10
-1
1
10
10
2
t
p
(s)
10
3
FR4 PCB, standard footprint
Fig. 5.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
PMXB56EN
All information provided in this document is subject to legal disclaimers.
©
NXP Semiconductors N.V. 2017. All rights reserved
Product data sheet
11 January 2017
4 / 15