IC GATE OR 1CH 3-INP 5DSBGA
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | Texas Instruments |
| Parts packaging code | BGA |
| package instruction | VFBGA, BGA6,2X3,20 |
| Contacts | 6 |
| Reach Compliance Code | not_compliant |
| Factory Lead Time | 1 week |
| series | LVC/LCX/Z |
| JESD-30 code | R-XBGA-B6 |
| length | 1.4 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | OR GATE |
| MaximumI(ol) | 0.024 A |
| Number of functions | 1 |
| Number of entries | 3 |
| Number of terminals | 6 |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| Output characteristics | 3-STATE |
| Package body material | UNSPECIFIED |
| encapsulated code | VFBGA |
| Encapsulate equivalent code | BGA6,2X3,20 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
| method of packing | TAPE AND REEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3 V |
| Prop。Delay @ Nom-Sup | 4.8 ns |
| propagation delay (tpd) | 17.2 ns |
| Certification status | Not Qualified |
| Schmitt trigger | NO |
| Maximum seat height | 0.5 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 1.65 V |
| Nominal supply voltage (Vsup) | 1.8 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | BALL |
| Terminal pitch | 0.5 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 0.9 mm |
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