UPD70F3378M1GJA-GAE-AX datasheet, PDF

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UPD70F3378M1GJA-GAE-AX: DescriptionIC MCU 32BIT; Categorysemiconductor The embedded processor and controller; File Size755KB，56 Pages; ManufacturerRenesas Electronics Corporation; Websitehttps://www.renesas.com/; Environmental Compliance

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UPD70F3378M1GJA-GAE-AX Overview

IC MCU 32BIT

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Data Sheet

V850ES/FF3

32-bit Single-Chip Microcontroller

Hardware

µPD70F3372(A)

µPD70F3372(A1)

µPD70F3372(A2)

µPD70F3373(A)

µPD70F3373(A1)

µPD70F3373(A2)

Document No. U18565EE1V2DS00

Date Published March 2008

NEC Electronics 2008

Printed in Germany

V850ES/FF3

Notes for CMOS Devices

Precaution against ESD for semiconductors

Strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and

ultimately degrade the device operation. Steps must be taken to stop generation of static electricity

as much as possible, and quickly dissipate it once, when it has occurred. Environmental control

must be adequate. When it is dry, humidifier should be used. It is recommended to avoid using

insulators that easily build static electricity. Semiconductor devices must be stored and transported

in an anti-static container, static shielding bag or conductive material. All test and measurement

tools including work bench and floor should be grounded. The operator should be grounded using

wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need

to be taken for PW boards with semiconductor devices on it.

Handling of unused input pins for CMOS

No connection for CMOS device inputs can be cause of malfunction. If no connection is provided to

the input pins, it is possible that an internal input level may be generated due to noise, etc., hence

causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels

of CMOS devices must be fixed high or low by using a pull-up or pull-down circuitry. Each unused

pin should be connected to VDD or GND with a resistor, if it is considered to have a possibility of

being an output pin. All handling related to the unused pins must be judged device by device and

related specifications governing the devices.

Status before initialization of MOS devices

Power-on does not necessarily define initial status of MOS device. Production process of MOS

does not define the initial operation status of the device. Immediately after the power source is

turned ON, the devices with reset function have not yet been initialized. Hence, power-on does not

guarantee out-pin levels, I/O settings or contents of registers. Device is not initialized until the reset

signal is received. Reset operation must be executed immediately after power-on for devices

having reset function.

Data Sheet U18565EE1V2DS00

V850ES/FF3

Legal Notes

• The information in this document is current as of January 2007. The information is subject to change

without notice. For actual design-in, refer to the latest publications of NEC Electronics data sheets or

data books, etc., for the most up-to-date specifications of NEC Electronics products. Not all products

and/or types are available in every country. Please check with an NEC sales representative for

availability and additional information.

• No part of this document may be copied or reproduced in any form or by any means without prior

written consent of NEC Electronics. NEC Electronics assumes no responsibility for any errors that

may appear in this document.

• NEC Electronics does not assume any liability for infringement of patents, copyrights or other

intellectual property rights of third parties by or arising from the use of NEC Electronics products

listed in this document or any other liability arising from the use of such NEC Electronics products.

No license, express, implied or otherwise, is granted under any patents, copyrights or other intellectual

property rights of NEC Electronics or others.

• Descriptions of circuits, software and other related information in this document are provided for

illustrative purposes in semiconductor product operation and application examples. The incorporation

of these circuits, software and information in the design of customer's equipment shall be done under

the full responsibility of customer. NEC Electronics assumes no responsibility for any losses incurred

by customers or third parties arising from the use of these circuits, software and information.

• While NEC Electronics endeavors to enhance the quality, reliability and safety of NEC Electronics

products, customers agree and acknowledge that the possibility of defects thereof cannot be eliminated

entirely. To minimize risks of damage to property or injury (including death) to persons arising from

defects in NEC Electronics products, customers must incorporate sufficient safety measures in their

design, such as redundancy, fire-containment and anti-failure features.

• NEC Electronics products are classified into the following three quality grades: “Standard”, “Special”

and “Specific”.

The "Specific" quality grade applies only to NEC Electronics products developed based on a

customer-designated “quality assurance program” for a specific application. The recommended

applications of NEC Electronics product depend on its quality grade, as indicated below. Customers

must check the quality grade of each NEC Electronics product before using it in a particular

application.

"Standard":

Computers, office equipment, communications equipment, test and

measurement equipment, audio and visual equipment, home electronic

appliances, machine tools, personal electronic equipment and industrial robots.

"Special":

Transportation equipment (automobiles, trains, ships, etc.), traffic control

systems, anti-disaster systems, anti-crime systems, safety equipment and

medical equipment (not specifically designed for life support).

"Specific":

Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control

systems, life support systems and medical equipment for life support, etc.

The quality grade of NEC Electronics products is “Standard” unless otherwise expressly specified in

NEC Electronics data sheets or data books, etc. If customers wish to use NEC Electronics products

in applications not intended by NEC Electronics, they must contact NEC Electronics sales

representative in advance to determine NEC Electronics 's willingness to support a given application.

Notes: 1.

"NEC Electronics" as used in this statement means NEC Electronics Corporation and also

includes its majority-owned subsidiaries.

"NEC Electronics products" means any product developed or manufactured by or for NEC

Electronics (as defined above).

SuperFlash® is a registered trademark of Silicon Storage Technology, Inc. in several coun-

tries including the United States and Japan. This product uses SuperFlash® technology

licensed from Silicon Storage Technology, Inc.

Data Sheet U18565EE1V2DS00

UPD70F3378M1GJA-GAE-AX Related Products

	UPD70F3378M1GJA-GAE-AX	UPD70F3370AM1GBA-GAH-AX	UPD70F3372M1GKA-GAK-AX
Description	IC MCU 32BIT	IC MCU 32BIT	IC MCU 32BIT

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