MCF5407CFT162 datasheet, PDF - EEWORLD Datasheet

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MCF5407CFT162: DescriptionIC MCU 32BIT ROMLESS 208FQFP; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，546 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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MCF5407CFT162 Overview

IC MCU 32BIT ROMLESS 208FQFP

MCF5407CFT162 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	NXP
Parts packaging code	QFP
package instruction	28 X 28 MM, 0.50 MM PITCH, PLASTIC, FQFP-208
Contacts	208
Reach Compliance Code	not_compliant
ECCN code	3A991
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	54 MHz
External data bus width	32
Format	FIXED POINT
Integrated cache	YES
JESD-30 code	S-PQFP-G208
JESD-609 code	e0
length	28 mm
low power mode	YES
Humidity sensitivity level	3
Number of terminals	208
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FQFP
Encapsulate equivalent code	QFP208,1.2SQ,20
Package shape	SQUARE
Package form	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	220
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	4.1 mm
speed	162 MHz
Nominal supply voltage	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	28 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

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MCF5407 ColdFire

Integrated Microprocessor

User’s Manual

MCF5407UM/D

Rev. 0.1, 11/2001

ColdFire is a registered trademark and DigitalDNA is a trademark of Motorola, Inc.

C is a registered trademark of Philips Semiconductors

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty,

representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation

consequential or incidental damages. “Typical” parameters which may be provided in Motorola data sheets and/or specifications can

and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must

be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent

rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems

intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in

which the failure of the Motorola product could create a situation where personal injury or death may occur. Should Buyer purchase or

use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola and its officers,

employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable

attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or

unauthorized use, even if such claim alleges that Motorola was negligent regarding the design or manufacture of the part. Motorola

and

are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

How to reach us:

USA/EUROPE/Locations Not Listed:

Motorola Literature Distribution; P.O. Box 5405, Denver, Colorado 80217. 1–303–675–2140

or 1–800–441–2447

JAPAN:

Motorola Japan Ltd.; SPS, Technical Information Center, 3–20–1, Minami–Azabu. Minato–ku, Tokyo 106–8573 Japan.

81–3–3440–3569

ASIA/PACIFIC:

Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T.,

Hong Kong. 852–26668334

Technical Information Center:

1–800–521–6274

HOME PAGE:

http://www.motorola.com/semiconductors

Document Comments:

FAX (512) 895-2638, Attn: TECD Applications Engineering

CONTENTS

Paragraph

Number

Title

Page

Number

Chapter 1

Overview

1.1

1.2

1.2.1

1.3

1.3.1

1.3.1.1

1.3.1.2

1.3.1.3

1.3.1.4

1.3.2

1.3.2.1

1.3.2.2

1.3.3

1.3.4

1.3.5

1.3.6

1.3.7

1.3.8

1.3.8.1

1.3.8.2

1.3.8.3

1.3.8.4

1.3.8.5

1.3.9

1.3.10

1.4

1.4.1

1.4.2

Features ............................................................................................................... 1-1

MCF5407 Features.............................................................................................. 1-4

Process ............................................................................................................ 1-7

ColdFire Module Description ............................................................................. 1-7

ColdFire Core ................................................................................................. 1-7

Instruction Fetch Pipeline (IFP).................................................................. 1-7

Operand Execution Pipeline (OEP) ............................................................ 1-8

MAC Module.............................................................................................. 1-8

Integer Divide Module................................................................................ 1-8

Harvard Architecture ...................................................................................... 1-8

16-Kbyte Instruction Cache/8-Kbyte Data Cache ...................................... 1-9

Internal 2-Kbyte SRAMs ............................................................................ 1-9

DRAM Controller ........................................................................................... 1-9

DMA Controller.............................................................................................. 1-9

UART Modules............................................................................................. 1-10

Timer Module ............................................................................................... 1-11

C Module ................................................................................................... 1-11

System Interface ........................................................................................... 1-11

External Bus Interface .............................................................................. 1-11

Chip Selects .............................................................................................. 1-11

16-Bit Parallel Port Interface .................................................................... 1-12

Interrupt Controller ................................................................................... 1-12

JTAG......................................................................................................... 1-12

System Debug Interface................................................................................ 1-12

PLL Module.................................................................................................. 1-13

Programming Model, Addressing Modes, and Instruction Set......................... 1-13

Programming Model ..................................................................................... 1-15

User Registers ............................................................................................... 1-15

Contents

MCF5407CFT162 Related Products

	MCF5407CFT162	MCF5407FT162	MCF5407FT220
Description	IC MCU 32BIT ROMLESS 208FQFP	IC MCU 32BIT ROMLESS 208FQFP	IC MCU 32BIT ROMLESS 208FQFP
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	NXP	NXP	NXP
Parts packaging code	QFP	QFP	QFP
package instruction	28 X 28 MM, 0.50 MM PITCH, PLASTIC, FQFP-208	28 X 28 MM, 0.50 MM PITCH, PLASTIC, FQFP-208	28 X 28 MM, 0.50 MM PITCH, PLASTIC, FQFP-208
Contacts	208	208	208
Reach Compliance Code	not_compliant	not_compliant	not_compliant
ECCN code	3A991	3A991	3A991
Address bus width	32	32	32
bit size	32	32	32
boundary scan	YES	YES	YES
maximum clock frequency	54 MHz	54 MHz	54 MHz
External data bus width	32	32	32
Format	FIXED POINT	FIXED POINT	FIXED POINT
Integrated cache	YES	YES	YES
JESD-30 code	S-PQFP-G208	S-PQFP-G208	S-PQFP-G208
JESD-609 code	e0	e0	e0
length	28 mm	28 mm	28 mm
low power mode	YES	YES	YES
Humidity sensitivity level	3	3	3
Number of terminals	208	208	208
Maximum operating temperature	85 °C	70 °C	70 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FQFP	FQFP	FQFP
Encapsulate equivalent code	QFP208,1.2SQ,20	QFP208,1.2SQ,20	QFP208,1.2SQ,20
Package shape	SQUARE	SQUARE	SQUARE
Package form	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	220	220	220
power supply	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	4.1 mm	4.1 mm	4.1 mm
speed	162 MHz	162 MHz	220 MHz
Nominal supply voltage	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES
technology	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	GULL WING	GULL WING	GULL WING
Terminal pitch	0.5 mm	0.5 mm	0.5 mm
Terminal location	QUAD	QUAD	QUAD
Maximum time at peak reflow temperature	30	30	30
width	28 mm	28 mm	28 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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