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74LV367DB,112

Description
IC BUF NON-INVERT 3.6V 16SSOP
Categorylogic    logic   
File Size114KB,12 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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74LV367DB,112 Overview

IC BUF NON-INVERT 3.6V 16SSOP

74LV367DB,112 Parametric

Parameter NameAttribute value
Brand NameNXP Semiconductor
Is it Rohs certified?conform to
MakerNXP
Parts packaging codeSSOP1
package instructionSSOP, SSOP16,.3
Contacts16
Manufacturer packaging codeSOT338-1
Reach Compliance Codecompliant
Other featuresONE FUNCTION WITH TWO BITS
Control typeENABLE LOW
seriesLV/LV-A/LVX/H
JESD-30 codeR-PDSO-G16
JESD-609 codee4
length6.2 mm
Load capacitance (CL)50 pF
Logic integrated circuit typeBUS DRIVER
MaximumI(ol)0.008 A
Humidity sensitivity level1
Number of digits6
Number of functions1
Number of ports2
Number of terminals16
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
Output characteristics3-STATE
Output polarityTRUE
Package body materialPLASTIC/EPOXY
encapsulated codeSSOP
Encapsulate equivalent codeSSOP16,.3
Package shapeRECTANGULAR
Package formSMALL OUTLINE, SHRINK PITCH
method of packingTUBE
Peak Reflow Temperature (Celsius)NOT SPECIFIED
power supply3.3 V
Prop。Delay @ Nom-Sup23 ns
propagation delay (tpd)39 ns
Certification statusNot Qualified
Maximum seat height2 mm
Maximum supply voltage (Vsup)3.6 V
Minimum supply voltage (Vsup)1 V
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch0.65 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width5.3 mm
INTEGRATED CIRCUITS
74LV367
Hex buffer/line driver (3-State)
Product specification
Supersedes data of 1997 Mar 04
IC24 Data Handbook
1998 May 29
Philips
Semiconductors

74LV367DB,112 Related Products

74LV367DB,112 74LV367N,112 74LV367D,112 74LV367DB,118 74LV367D,118 74LV367PW,118
Description IC BUF NON-INVERT 3.6V 16SSOP IC BUFFER NON-INVERT 3.6V 16DIP IC BUFFER NON-INVERT 3.6V 16SO IC BUF NON-INVERT 3.6V 16SSOP IC BUFFER NON-INVERT 3.6V 16SO IC BUF NON-INVERT 3.6V 16TSSOP
Brand Name NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor NXP Semiconductor
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP
Parts packaging code SSOP1 DIP SOP SSOP1 SOP TSSOP
package instruction SSOP, SSOP16,.3 0.300 INCH, PLASTIC, SOT-38-4, DIP-16 SOP, SOP16,.25 SSOP, SOP, TSSOP,
Contacts 16 16 16 16 16 16
Manufacturer packaging code SOT338-1 SOT38-4 SOT109-1 SOT338-1 SOT109-1 SOT403-1
Reach Compliance Code compliant compliant compliant unknown unknown unknown
Other features ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS ONE FUNCTION WITH TWO BITS
series LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 code R-PDSO-G16 R-PDIP-T16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16 R-PDSO-G16
JESD-609 code e4 e4 e4 e4 e4 e4
length 6.2 mm 19.025 mm 9.9 mm 6.2 mm 9.9 mm 5 mm
Load capacitance (CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
Logic integrated circuit type BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
Number of digits 6 6 6 6 6 6
Number of functions 1 1 1 1 1 1
Number of ports 2 2 2 2 2 2
Number of terminals 16 16 16 16 16 16
Maximum operating temperature 125 °C 125 °C 125 °C 125 °C 125 °C 125 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output characteristics 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
Output polarity TRUE TRUE TRUE TRUE TRUE TRUE
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SSOP DIP SOP SSOP SOP TSSOP
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE, SHRINK PITCH IN-LINE SMALL OUTLINE SMALL OUTLINE, SHRINK PITCH SMALL OUTLINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) NOT SPECIFIED 260 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
propagation delay (tpd) 39 ns 39 ns 39 ns 39 ns 39 ns 39 ns
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2 mm 4.2 mm 1.75 mm 2 mm 1.75 mm 1.1 mm
Maximum supply voltage (Vsup) 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V 3.6 V
Minimum supply voltage (Vsup) 1 V 1 V 1 V 1 V 1 V 1 V
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES NO YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE AUTOMOTIVE
Terminal surface Nickel/Palladium/Gold (Ni/Pd/Au) NICKEL PALLADIUM GOLD Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal form GULL WING THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING
Terminal pitch 0.65 mm 2.54 mm 1.27 mm 0.65 mm 1.27 mm 0.65 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED 30 30 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 5.3 mm 7.62 mm 3.9 mm 5.3 mm 3.9 mm 4.4 mm
Humidity sensitivity level 1 - 1 1 1 1

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