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110R2752X

Description
THIN FILM RESISTOR SERIES
File Size390KB,1 Pages
ManufacturerCALMIRCO
Websitehttp://www.calmicro.com/
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110R2752X Overview

THIN FILM RESISTOR SERIES

CALIFORNIA MICRO DEVICES
110R
THIN FILM RESISTOR SERIES
California Micro Devices’ 110R Series multi-terminal resistor chip offers the hybrid designer a component that provides a
wide range of resistance values on a single chip. Bonding pads segment the total resistance into ten single elements of
resistance and ten 10X elements of resistance enabling the combination of the eight standard parts to cover the resistance
range from 1100 ohms to 275K ohms.
Parameter
TCR
Operating Voltage
Package
ating per re
Power R
Power
(
Rating
sistor)
Thermal Shock
High Temperature Exposure
Moisture Resistance
Life
Noise
Insulation Resistance
ELECTRICAL SPECIFICATIONS
Test Condition
-55°C to +125°C
-55°C to +125°C
@ 70°C (D erate linearly to zero @ 150° C )
Method 107 MIL-STD -202F
100 Hrs @ 150° C A m b i e n t
Method 106 MIL-STD -202F
Method 108 MIL-STD -202F (125° C / 1 0 0 0 h r )
Method 308 MIL-STD -202F
@ 25° C
±250ppm/°C
100Vdc
250mw
±0.25% @
∆R
±0.25%
∆R
±0.5%
∆R
±0.5%
∆R
-20dB
1
×
1 0
12
Max
Max
Max
Max
Max
Max
Max
Max
Min
Part Number
110 R
110 R
110 R
110 R
110 R
110 R
110 R
110 R
110 1X
2 7 51X
550 1X
110 2 X
2 7 52 X
550 2 X
110 3 X
2 7 53 X
VALUES
Total
Nominal/Single
Resistance
Element of Resistance
110 0
2 7 50
550 0
110 0 0
2 7 500
550 0 0
110 0 0 0
2 7 50 0 0
10
25
50
10 0
2 50
50 0
10 0 0
2 50 0
Formats
Die Size:
34±3 mils square
Bonding Pads:
4x4 mils typical
ME CHANICAL SP E CIFICATIONS
Substrate
Isolation Layer
Backing
Metalization
Silicon 10±2 mils thick
S
i
0
2
100,000Å thick, min
Lapped (gold optional)
Aluminum 10,000Å thick, min
(15,000Å gold optional)
PACKAGING
Two inch square trays of 400 chips maximum.
NOTES
1. The tolerance applies to the total resistance value only.
2. Resistor pattern may vary from one value to another.
110R
Series
5502
Value
First 3 digits are
significant value.
Last digit represents
number of zeros.
R indicates decimal point
PART NUMBER DESIGNATION
X
G
Tolerance
G = ±2%
J = ±5%
K = ±10%
M = ±20%
Bond Pads
G = Go l d
No Letter = Aluminum
Backing
W = Go l d
L = Lapped
No Letter = Either
W
© 2002 California Micro Devices Corp. All rights reserved.
3/02
C0730400
215 Topaz Street, Milpitas, California 95035
Tel: (408) 263-3214
Fax: (408) 263-7846
www.calmicro.com


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