A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
Regarding ads1115, I would like to ask how to choose the reference voltage of ads1115. It is not an internal reference. I want to know how to choose it. It is best to give me some program about the re...
Can someone please help me check if there is any problem with my design drawing:loveliness: This is the first time I use this chip. Now the board is out, but the crystal oscillator is not vibrating an...
Abstract : A high-performance 8051 design with improved architecture, peripheral function integration, and selection of appropriate clock sources to reduce power consumption; and introduces software t...
Microchip launches new digital signal controller Microchip Technology Inc. (Microchip Technology, Inc.) recently announced the launch of a 16-bit dsPIC? Digital Signal Controller (DSC) series for gene...
I have been looking for the relationship between current and its induced field. I found the following relationship on the InternetQuestion 1: The first formula, B=(u0*I)/(2PI*x), where x is the perpen...
Hardware designers have begun to adopt FPGA technology in high-performance DSP designs because it can provide 10-100 times faster computing than PC-based or microcontroller-based solutions. Previou...[Details]
As cellular phones become more advanced, the power consumption of the system during operation and the power consumption during standby are also increasing. Therefore, the power management design of...[Details]
Power management solutions for today's portable application processors are becoming increasingly integrated. Total power consumption, standby and sleep current consumption affect battery size, bill...[Details]
I. Introduction
Since RS232 has a short communication distance (only 15 meters according to EAT/TAI-232 standard), and can only perform point-to-point communication, it cannot directly f...[Details]
LED lamps and bulbs are now rapidly replacing incandescent, halogen and CFL (compact fluorescent lamp) light sources in many general lighting applications. Flyback DC/DC converters are the power su...[Details]
With the rapid development of intelligent control technology, computers and information technology, the trend of information appliances IA (Information Application), computers and communications integ...[Details]
Digital array radar (DAR) uses digital beam forming (DBF) in both receiving and transmitting modes to achieve flexible distribution and reception of RF signal power in the airspace, obtain excellent t...[Details]
With the advocacy and implementation of the government's Safe City Plan, the security market has increasingly higher requirements for the clarity of surveillance images. Imagine that after a case o...[Details]
The concept of state machine
State machine is an important concept in software programming. More important than this concept is its flexible application. In a clear and efficient program, ther...[Details]
TC9012F is a universal CMOS large-scale integrated circuit for infrared remote control signal transmission, suitable for remote control of TV, VTR, laser player and other equipment. In the market, ...[Details]
In today's body control module (BCM) designs, savvy engineers are moving away from electromechanical relays whenever possible. Their next step is to eliminate fuses. But is eliminating fuses a nece...[Details]
To understand how and why OLED power supply affects display image quality, you must first understand OLED display technology and power supply requirements. This article will explain the latest OLED...[Details]
introduction
Incandescent bulbs can emit a variety of light, but in specific applications, only green, red, and yellow light are usually needed - such as traffic lights. If an incand...[Details]
Liquid crystal display (LCD) panels have a wide range of applications, from small portable electronic devices to large fixed devices, including digital cameras, laptops, personal data assistants, d...[Details]
introduction
At present, measuring instruments are developing towards networking, and each individual embedded instrument will become a node on the Internet. This system realizes the network...[Details]
Microcontroller MCU
京公网安备 11010802033920号
EEWORLD
