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BZT52C51-TP

Description
0.5W,51V,ZENER,SOD-323 PACKAGE
Categorysemiconductor    Discrete semiconductor   
File Size300KB,4 Pages
ManufacturerMicro Commercial Co
Environmental Compliance
Download Datasheet Parametric View All

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BZT52C51-TP Overview

0.5W,51V,ZENER,SOD-323 PACKAGE

BZT52C51-TP Parametric

Parameter NameAttribute value
Voltage - Zener (nominal) (Vz)51V
Tolerance±5.88%
Power - Max500mW
Impedance (max) (Zzt)100 Ohms
Current at different Vr - Reverse leakage current100nA @ 38V
Voltage at different If - Forward (Vf900mV @ 10mA
Operating temperature-65°C ~ 150°C(TJ)
Installation typesurface mount
Package/casingSOD-123
Supplier device packagingSOD-123
MCC
Micro Commercial Components
TM
  omponents
20736 Marilla
Street Chatsworth

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BZT52C2V4
THRU
BZT52C51
500 mW
Zener Diode
2.4 to
51
Volts
Features
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly Processes
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
Lead Free Finish/RoHS Compliant("P" Suffix
designates RoHS Compliant. See ordering information)
Halogen
free available upon request by adding suffix "-HF"
SOD-123
A
B
Unit
Absolute Maximum Ratings
Symbol
Rating
Rating
C
P
D
Power dissipation
500
mW
E
T
J
Junction Temperature
-65 to +150
T
STG
Storage Temperature Range
-65 to +150
H
D
J
Absolute Maximum Ratings
Symbol
Rating
Rating
Unit
G
DIM
R
thJA
Thermal Resistance Junction to
Ambient*
250
/W
* Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with
pad areas 25
mm
2
Electrical Characteristics
Symbol
Rating
Rating
Unit
A
B
C
D
E
G
H
J
DIMENSIONS
INCHES
MM
MIN
MAX
MIN
MAX
.140
.152
3.55
3.85
.100
.112
2.55
2.85
.055
.071
1.40
1.80
-----
.053
-----
1.35
.012
.031
0.30
.78
.006
-----
0.15
-----
-----
.01
-----
.25
-----
.006
-----
.15
NOTE
SUGGESTED SOLDER
PAD LAYOUT
V
F
Maximum Forward Voltage
(I
F
=10mAdc)
0.9
V
0.093"
0.048”
0.036”
Revision: C
www.mccsemi.com
1
of
4
2013/10/07

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