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ESDM3551N2T5G

Description
TVS DIODE 5.5V 8.2V 2X2DFN
CategoryCircuit protection   
File Size127KB,8 Pages
ManufacturerON Semiconductor
Websitehttp://www.onsemi.cn
Environmental Compliance
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ESDM3551N2T5G Overview

TVS DIODE 5.5V 8.2V 2X2DFN

ESDM3551N2T5G Parametric

Parameter NameAttribute value
typeZina
two-way channel1
Voltage - Reverse OFF (Typical)5.5V (maximum)
Voltage - Breakdown (minimum)5.6V
电压 - 箝位(最大值)@ Ipp8.2V
Current - Peak Pulse (10/1000µs)8A
Power - Peak Pulse-
Power line protectionnone
applicationUSB
Capacitance at different frequencies21pF @ 1MHz (maximum)
Operating temperature-55°C ~ 150°C(TJ)
Installation typesurface mount
Package/casing2-XDFN
Supplier device packaging2-X2DFN(1x0.6)
ESDM3551
5.5V ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESDM3551 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium.
Features
www.onsemi.com
Low Clamping Voltage
Small Body Outline Dimensions:
− 0201: 0.62 mm x 0.32 mm
− 0402: 1.00 mm x 0.60 mm
Low Body Height: 0.3 mm
Stand−off Voltage: 5.5 V
IEC61000−4−2 Level 4 ESD Protection
SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
USB ID Line Protection
mSD
Card Protection
Audio Line Protection
GPIO
1
2
MARKING
DIAGRAM
PIN 1
X3DFN2 (0201)
CASE 152AF
5
M
= Specific Device Code
(Rotated 270°)
= Date Code
5M
Typical Applications
JJ M
X2DFN2 (0402)
CASE 714AB
JJ = Specific Device Code
M = Date Code
MAXIMUM RATINGS
Rating
IEC 61000−4−2 Contact
IEC 61000−4−2 Air
ISO 10605 150 pF/2 kW
ISO 10605 330 pF/2 kW
ISO 10605 330 pF/330
W
Total Power Dissipation on FR−5 Board
(Note 1) @ T
A
= 25°C
Thermal Resistance, Junction−to−Ambient
Junction and Storage Temperature Range
Lead Solder Temperature − Maximum
(10 Second Duration)
Symbol
ESD
Value
±30
±30
±30
±30
±30
250
400
−55 to +150
260
Unit
kV
ORDERING INFORMATION
Device
ESDM3551MXT5G
ESDM3551N2T5G
Package
X3DFN2
(Pb−Free)
X2DFN2
(Pb−Free)
X2DFN2
(Pb−Free)
Shipping
10000 / Tape &
Reel
8000 / Tape &
Reel
8000 / Tape &
Reel
°P
D
°
R
qJA
T
J
, T
stg
T
L
mW
°C/W
°C
°C
SZESDM3551N2T5G
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
See Application Note AND8308/D for further description of survivability specs.
©
Semiconductor Components Industries, LLC, 2017
1
September, 2018 − Rev. 2
Publication Order Number:
ESDM3551/D

ESDM3551N2T5G Related Products

ESDM3551N2T5G ESDM3551MXT5G
Description TVS DIODE 5.5V 8.2V 2X2DFN TVS DIODE 5.5V 8.2V 2X3DFN
type Zina Zina
two-way channel 1 1
Voltage - Reverse OFF (Typical) 5.5V (maximum) 5.5V (maximum)
Voltage - Breakdown (minimum) 5.6V 5.6V
电压 - 箝位(最大值)@ Ipp 8.2V 8.2V
Current - Peak Pulse (10/1000µs) 8A 8A
application USB USB
Capacitance at different frequencies 21pF @ 1MHz (maximum) 21pF @ 1MHz (maximum)
Operating temperature -55°C ~ 150°C(TJ) -55°C ~ 150°C(TJ)
Installation type surface mount surface mount
Package/casing 2-XDFN 0201 (0603 Metric)
Supplier device packaging 2-X2DFN(1x0.6) 2-X3DFN(0.62x0.32)
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