EEWORLDEEWORLDEEWORLD

Part Number

Search

ATS-10C-35-C2-R0

Description
HEATSINK 36.83X57.6X5.84MM T766
CategoryThermal management products   
File Size154KB,1 Pages
ManufacturerERP
Environmental Compliance
Download Datasheet Parametric View All

ATS-10C-35-C2-R0 Overview

HEATSINK 36.83X57.6X5.84MM T766

ATS-10C-35-C2-R0 Parametric

Parameter NameAttribute value
typetop installation
cooling packageClassification (BGA, LGA, CPU, ASIC...)
Joining methodPush your feet
shaperectangular, fins
length1.450"(36.83mm)
width2.267"(57.60mm)
diameter-
Height from base (fin height)0.230"(5.84mm)
Power dissipation at different temperature rises-
Thermal resistance at different forced airflows22.48°C/W @ 100 LFM
Thermal resistance under natural conditions-
Materialaluminum
Material platingblue anodized
pushPIN™ Heat Sink Assembly
ATS Part#:
ATS-10C-35-C2-R0
Description:
pushPIN™ HS ASMBLY,FINE-PITCH,STRAIGHT, HOLE PATTERN:4-CORNER,BLUE,T766
Heat Sink Type:
pushPIN™ Heat Sink Assembly
Heat Sink Attachment:
pushPIN™ / Spring Kit
Features & Benefits
»
Quick Attachment – Push pins feature a flexible barb at the end designed to
engage with pre-drilled holes in a PCB.
»
Compression Springs add the necessary force to hold the assembly together
for secure attachment. Select from over 21 different springs to achieve
precise force required.
»
Push Pin Material available in brass or plastic in 10 sizes ranging from 9-
20mm in length. Stainless steel hardware kit available for more secure
attachment. Visit www.qats.com for available options.
»
Heat Sinks Designed for All Airflow Conditions. Select from over 112 fine
pitch HS designed for high velocity air flows and 98 course pitch HS
designed for low velocity air flow conditions.
»
Pre-assembled with phase-changing material for increased thermal
performance. Double-sided thermal tape and no TIM options available to
meet application-specific requirements.
»
Lightweight, aluminum HS extruded from AL6063 provide optimal heat
transfer with a blue anodized finish.
»
All components are RoHS and REACH compliant.
»
Industry standard hole pattern. Recommended through hole size is 3.175mm
For Illustration Purposes ONLY.
Bill of Material
Heat Sink:
ATS-FPS037058006-35-C2-R0
Push Pin:
Springs:
ATS-PP-03
ATS-PPS-10
Qty
1
4
4
Thermal Performance
100
AIR VELOCITY - LFM (m/s)
(0.5)
Thermal Resistance
°C/W
Unducted Flow
Ducted Flow
22.48
4.34
200
(1.0)
13.71
2.88
300
(1.5)
8.35
2.37
400
(2.0)
5.84
2.09
500
(2.5)
4.56
1.90
600
(3.0)
3.83
1.76
700
(3.5)
3.36
Fin
Pitch
FINE-PITCH
Fin
Type
STRAIGHT
Hole
Pattern
4-CORNER
1.65
Product Detail
P/N
ATS-10C-35-C2-R0
A
36.83
Dimensions
B
C
E
57.6
5.84
26.2
F
47.2
NOTES:
Push Pin
ATS-PP-03
Spring
ATS-PPS-10
TIM
T766
Finish
BLUE ANODIZED
1) Dimension A is the length of the heat sink in the direction of the flow.
2) Dimension B is the width of the heat sink perpendicular to the flow direction.
3) Dimension C is the heat sink height from the bottom of the base to the top of the fin
field.
4) Dimension E is the distance between holes perpendicular to the direction of flow.
5) Dimension F is the distance between holes in the direction of flow.
6) Thermal performance data are provided for reference only. Actual performance may
vary by application.
7) ATS reserves the right tp update or change its products without notice to improve the
design or performance.
8) ATS certifies that this heat sink assemby is RoHS-6 and REACH compliant.
9) Contact ATS to learn about custom options available.
For Illustration Purposes ONLY.
For further technical information, please contact Advanced Thermal Solutions, Inc.
89-27 ACCESS ROAD, NORWOOD, MA 02062 USA | T: 781.769. 2800 F: 781.769.9979 | WWW.QATS.COM
R2-0917
Graduation project help
Wireless charging and wireless data transmission, requiring simulation and physical objects, which big guy can help me do it, and I will pay for it...
摩登时代 MCU
Setting up TFTP server under UBUNTU
When doing uboot and kernel porting experiments, considering efficiency, we often download the kernel image to the board's memory through the network cable using tftp , and then run the test. uboot ha...
学学嵌入式 Linux and Android
Issue with WaitForMultipleObjects returning WAIT_FAILED
The situation is as follows: A global variable HANDLE g_hevInt[3] is set; Three events are created in the program: g_hevInt[0] = CreateEvent(NULL,FALSE,FALSE,NULL); g_hevInt[1] = CreateEvent(NULL,FALS...
duanhongmai Embedded System
It is found that domestic manufacturers like to polish the logo and model outside the chip.
Then they let you guess when you repair it, as if they are afraid that others will know your plan. In fact, it may be because many patent protections in our country look like a joke. Many people are u...
ezezy Talking
ATmega8 SPI data sending problem
I would like to ask, I use the SPI port of AVR's ATmega8 to receive a 16-bit data from the slave that is not FFFF. The slave sends the data on the falling edge, and then uses the serial port to send i...
eeleader Microchip MCU
Semiconductor Industry (Microelectronics/IC Design) Career Guidance (Transfer) (Part 1)
Some simple personal thoughts for the students who are about to graduate in this industry. 1. Now is a good era (the past 5 years and the next 5 years) We are very lucky to start our career in this pr...
songbo Power technology

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1973  653  586  950  2450  40  14  12  20  50 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号